The Market Reports

Synopsis
The global market for SMT Solder Pastes was estimated to be worth US$ 1294 million in 2024 and is forecast to a readjusted size of US$ 1795 million by 2031 with a CAGR of 5.0% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on SMT Solder Pastes cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Solder paste is a crucial material used in the surface mount technology (SMT) process for assembling electronic components onto printed circuit boards (PCBs). It consists of a mixture of finely powdered solder alloy, flux, and other additives.
Solder paste can be manufactured in hundreds of alloys and with powder size ranging from Type 3 to Type 8. Solder pastes are available for a wide variety of process deposition techniques, including printing, dipping, dispensing, jetting, and pin transfer assembly. Solder paste is a suspension of solder particles in a solder flux, which is widely used in the electronic assembly materials.
At present, in the industrial developed countries the SMT Solder Paste industry is generally at a more advanced level, the world's large enterprises are mainly concentrated in the USA, Europe and Japan. Meanwhile, these companies have more mature equipment, strong R & D capability, and the technical level is in a leading position. SMT Solder Paste industry is a low concentration industry. As electronic foundry industry transfer to China mainland, many new entrants enter this industry. At present, some Chinese enterprises occupy a relatively large international market share. Chinese companies represented by Tongfang Tech and Shenzhen Vital New Material have successively built standard chemical production bases, which have a strong first-mover advantage. Of the global major players of SMT Solder Paste, MacDermid Alpha Electronics Solutions, Senju Metal Industry and Tamura captured the top three revenue share spots in the SMT Solder Paste market in 2024. MacDermid Alpha Electronics Solutions dominated with 14% revenue share in 2024 with the acquision of Kester, followed by Senju Metal Industry and Tamura with 13.5% and 9.6% revenue share, respectively.
The SMT Solder Paste industry is a mature industry. The largest sales market is China, due to the rapidly development of electronics industry, with 60.0% global sales volume share in 2024. The demand in other region, such as Southeast Asia, is increasing rapidly. While in the electronics mature region, such as USA, Europe, the demanding of SMT Solder Paste decline gradually, due to the production transfer of electronics products.
This report aims to provide a comprehensive presentation of the global market for SMT Solder Pastes, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of SMT Solder Pastes by region & country, by Type, and by Application.
The SMT Solder Pastes market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SMT Solder Pastes.
Market Segmentation
By Company
MacDermid Alpha Electronics Solutions
Senju Metal Industry
Tamura
AIM
Indium
Heraeus
Tongfang Tech
Shenzhen Vital New Material
Shengmao
Harima Chemicals
Inventec Performance Chemicals
KOKI
Nippon Genma
Nordson EFD
Shenzhen Chenri Technology
NIHON HANDA
Nihon Superior
BBIEN Technology
DS HiMetal
Yong An
Segment by Type
No-clean Solder Paste
Water Soluble Solder Paste
Rosin-based Solder Paste
Segment by Application
Computer
Communication
Consumer Electronics
Automotive
Industrial
Medical
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of SMT Solder Pastes manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of SMT Solder Pastes in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of SMT Solder Pastes in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index