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Solder Bumping Flip Chip-Global Market Insights and Sales Trends 2025
Synopsis
The global Solder Bumping Flip Chip market size is expected to reach US$ 18790 million by 2029, growing at a CAGR of 6.6% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Bumping Flip Chip in various end use industries. The expanding demands from the Electronics, Industrial, Automotive & Transport and Healthcare, are propelling Solder Bumping Flip Chip market. 3D IC, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 2.5D IC segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Bumping Flip Chip, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Bumping Flip Chip market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Bumping Flip Chip market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Bumping Flip Chip sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Bumping Flip Chip covered in this report include TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan) and STMicroelectronics (Switzerland), etc.
The global Solder Bumping Flip Chip market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Global Solder Bumping Flip Chip market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Bumping Flip Chip market, Segment by Type:
3D IC
2.5D IC
2D IC
Global Solder Bumping Flip Chip market, by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Bumping Flip Chip manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Bumping Flip Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
The global Solder Bumping Flip Chip market size is expected to reach US$ 18790 million by 2029, growing at a CAGR of 6.6% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Bumping Flip Chip in various end use industries. The expanding demands from the Electronics, Industrial, Automotive & Transport and Healthcare, are propelling Solder Bumping Flip Chip market. 3D IC, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the 2.5D IC segment is estimated at % CAGR for the next seven-year period.
Following a strong growth of 26.2 percent in the year 2021, WSTS revised it down to a single digit growth for the worldwide semiconductor market in 2022 with a total size of US$580 billion, up 4.4 percent. WSTS lowered growth estimation as inflation rises and end markets seeing weaker demand, especially those exposed to consumer spending. While some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.8 percent, Sensors with 16.3 percent, and Logic with 14.5 percent growth. Memory declined with 12.6 percent year over year. In 2022, all geographical regions showed double-digit growth except Asia Pacific. The largest region, Asia Pacific, declined 2.0 percent. Sales in the Americas were US$142.1 billion, up 17.0% year-on-year, sales in Europe were US$53.8 billion, up 12.6% year-on-year, and sales in Japan were US$48.1 billion, up 10.0% year-on-year. However, sales in the largest Asia-Pacific region were US$336.2 billion, down 2.0% year-on-year.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Bumping Flip Chip, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Bumping Flip Chip market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Bumping Flip Chip market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Bumping Flip Chip sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Bumping Flip Chip covered in this report include TSMC (Taiwan), Samsung (South Korea), ASE Group (Taiwan), Amkor Technology (US), UMC (Taiwan), STATS ChipPAC (Singapore), Powertech Technology (Taiwan) and STMicroelectronics (Switzerland), etc.
The global Solder Bumping Flip Chip market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
TSMC (Taiwan)
Samsung (South Korea)
ASE Group (Taiwan)
Amkor Technology (US)
UMC (Taiwan)
STATS ChipPAC (Singapore)
Powertech Technology (Taiwan)
STMicroelectronics (Switzerland)
Global Solder Bumping Flip Chip market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Bumping Flip Chip market, Segment by Type:
3D IC
2.5D IC
2D IC
Global Solder Bumping Flip Chip market, by Application
Electronics
Industrial
Automotive & Transport
Healthcare
IT & Telecommunication
Aerospace and Defense
Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Bumping Flip Chip manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Bumping Flip Chip in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Solder Bumping Flip Chip Market Overview
1.1 Solder Bumping Flip Chip Product Overview
1.2 Solder Bumping Flip Chip Market Segment by Type
1.2.1 3D IC
1.2.2 2.5D IC
1.2.3 2D IC
1.3 Global Solder Bumping Flip Chip Market Size by Type
1.3.1 Global Solder Bumping Flip Chip Market Size Overview by Type (2018-2029)
1.3.2 Global Solder Bumping Flip Chip Historic Market Size Review by Type (2018-2023)
1.3.3 Global Solder Bumping Flip Chip Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Solder Bumping Flip Chip Sales Breakdown by Type (2018-2023)
1.4.2 Europe Solder Bumping Flip Chip Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Solder Bumping Flip Chip Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Solder Bumping Flip Chip Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Solder Bumping Flip Chip Sales Breakdown by Type (2018-2023)
2 Global Solder Bumping Flip Chip Market Competition by Company
2.1 Global Top Players by Solder Bumping Flip Chip Sales (2018-2023)
2.2 Global Top Players by Solder Bumping Flip Chip Revenue (2018-2023)
2.3 Global Top Players by Solder Bumping Flip Chip Price (2018-2023)
2.4 Global Top Manufacturers Solder Bumping Flip Chip Manufacturing Base Distribution, Sales Area, Product Type
2.5 Solder Bumping Flip Chip Market Competitive Situation and Trends
2.5.1 Solder Bumping Flip Chip Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Solder Bumping Flip Chip Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Solder Bumping Flip Chip as of 2022)
2.7 Date of Key Manufacturers Enter into Solder Bumping Flip Chip Market
2.8 Key Manufacturers Solder Bumping Flip Chip Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Solder Bumping Flip Chip Status and Outlook by Region
3.1 Global Solder Bumping Flip Chip Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Solder Bumping Flip Chip Historic Market Size by Region
3.2.1 Global Solder Bumping Flip Chip Sales in Volume by Region (2018-2023)
3.2.2 Global Solder Bumping Flip Chip Sales in Value by Region (2018-2023)
3.2.3 Global Solder Bumping Flip Chip Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Solder Bumping Flip Chip Forecasted Market Size by Region
3.3.1 Global Solder Bumping Flip Chip Sales in Volume by Region (2024-2029)
3.3.2 Global Solder Bumping Flip Chip Sales in Value by Region (2024-2029)
3.3.3 Global Solder Bumping Flip Chip Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Solder Bumping Flip Chip by Application
4.1 Solder Bumping Flip Chip Market Segment by Application
4.1.1 Electronics
4.1.2 Industrial
4.1.3 Automotive & Transport
4.1.4 Healthcare
4.1.5 IT & Telecommunication
4.1.6 Aerospace and Defense
4.1.7 Others
4.2 Global Solder Bumping Flip Chip Market Size by Application
4.2.1 Global Solder Bumping Flip Chip Market Size Overview by Application (2018-2029)
4.2.2 Global Solder Bumping Flip Chip Historic Market Size Review by Application (2018-2023)
4.2.3 Global Solder Bumping Flip Chip Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Solder Bumping Flip Chip Sales Breakdown by Application (2018-2023)
4.3.2 Europe Solder Bumping Flip Chip Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Solder Bumping Flip Chip Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Solder Bumping Flip Chip Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Solder Bumping Flip Chip Sales Breakdown by Application (2018-2023)
5 North America Solder Bumping Flip Chip by Country
5.1 North America Solder Bumping Flip Chip Historic Market Size by Country
5.1.1 North America Solder Bumping Flip Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Solder Bumping Flip Chip Sales in Volume by Country (2018-2023)
5.1.3 North America Solder Bumping Flip Chip Sales in Value by Country (2018-2023)
5.2 North America Solder Bumping Flip Chip Forecasted Market Size by Country
5.2.1 North America Solder Bumping Flip Chip Sales in Volume by Country (2024-2029)
5.2.2 North America Solder Bumping Flip Chip Sales in Value by Country (2024-2029)
6 Europe Solder Bumping Flip Chip by Country
6.1 Europe Solder Bumping Flip Chip Historic Market Size by Country
6.1.1 Europe Solder Bumping Flip Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Solder Bumping Flip Chip Sales in Volume by Country (2018-2023)
6.1.3 Europe Solder Bumping Flip Chip Sales in Value by Country (2018-2023)
6.2 Europe Solder Bumping Flip Chip Forecasted Market Size by Country
6.2.1 Europe Solder Bumping Flip Chip Sales in Volume by Country (2024-2029)
6.2.2 Europe Solder Bumping Flip Chip Sales in Value by Country (2024-2029)
7 Asia-Pacific Solder Bumping Flip Chip by Region
7.1 Asia-Pacific Solder Bumping Flip Chip Historic Market Size by Region
7.1.1 Asia-Pacific Solder Bumping Flip Chip Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Solder Bumping Flip Chip Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Solder Bumping Flip Chip Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Solder Bumping Flip Chip Forecasted Market Size by Region
7.2.1 Asia-Pacific Solder Bumping Flip Chip Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Solder Bumping Flip Chip Sales in Value by Region (2024-2029)
8 Latin America Solder Bumping Flip Chip by Country
8.1 Latin America Solder Bumping Flip Chip Historic Market Size by Country
8.1.1 Latin America Solder Bumping Flip Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Solder Bumping Flip Chip Sales in Volume by Country (2018-2023)
8.1.3 Latin America Solder Bumping Flip Chip Sales in Value by Country (2018-2023)
8.2 Latin America Solder Bumping Flip Chip Forecasted Market Size by Country
8.2.1 Latin America Solder Bumping Flip Chip Sales in Volume by Country (2024-2029)
8.2.2 Latin America Solder Bumping Flip Chip Sales in Value by Country (2024-2029)
9 Middle East and Africa Solder Bumping Flip Chip by Country
9.1 Middle East and Africa Solder Bumping Flip Chip Historic Market Size by Country
9.1.1 Middle East and Africa Solder Bumping Flip Chip Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Solder Bumping Flip Chip Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Solder Bumping Flip Chip Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Solder Bumping Flip Chip Forecasted Market Size by Country
9.2.1 Middle East and Africa Solder Bumping Flip Chip Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Solder Bumping Flip Chip Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 TSMC (Taiwan)
10.1.1 TSMC (Taiwan) Company Information
10.1.2 TSMC (Taiwan) Introduction and Business Overview
10.1.3 TSMC (Taiwan) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.1.4 TSMC (Taiwan) Solder Bumping Flip Chip Products Offered
10.1.5 TSMC (Taiwan) Recent Development
10.2 Samsung (South Korea)
10.2.1 Samsung (South Korea) Company Information
10.2.2 Samsung (South Korea) Introduction and Business Overview
10.2.3 Samsung (South Korea) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.2.4 Samsung (South Korea) Solder Bumping Flip Chip Products Offered
10.2.5 Samsung (South Korea) Recent Development
10.3 ASE Group (Taiwan)
10.3.1 ASE Group (Taiwan) Company Information
10.3.2 ASE Group (Taiwan) Introduction and Business Overview
10.3.3 ASE Group (Taiwan) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.3.4 ASE Group (Taiwan) Solder Bumping Flip Chip Products Offered
10.3.5 ASE Group (Taiwan) Recent Development
10.4 Amkor Technology (US)
10.4.1 Amkor Technology (US) Company Information
10.4.2 Amkor Technology (US) Introduction and Business Overview
10.4.3 Amkor Technology (US) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Amkor Technology (US) Solder Bumping Flip Chip Products Offered
10.4.5 Amkor Technology (US) Recent Development
10.5 UMC (Taiwan)
10.5.1 UMC (Taiwan) Company Information
10.5.2 UMC (Taiwan) Introduction and Business Overview
10.5.3 UMC (Taiwan) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.5.4 UMC (Taiwan) Solder Bumping Flip Chip Products Offered
10.5.5 UMC (Taiwan) Recent Development
10.6 STATS ChipPAC (Singapore)
10.6.1 STATS ChipPAC (Singapore) Company Information
10.6.2 STATS ChipPAC (Singapore) Introduction and Business Overview
10.6.3 STATS ChipPAC (Singapore) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.6.4 STATS ChipPAC (Singapore) Solder Bumping Flip Chip Products Offered
10.6.5 STATS ChipPAC (Singapore) Recent Development
10.7 Powertech Technology (Taiwan)
10.7.1 Powertech Technology (Taiwan) Company Information
10.7.2 Powertech Technology (Taiwan) Introduction and Business Overview
10.7.3 Powertech Technology (Taiwan) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Powertech Technology (Taiwan) Solder Bumping Flip Chip Products Offered
10.7.5 Powertech Technology (Taiwan) Recent Development
10.8 STMicroelectronics (Switzerland)
10.8.1 STMicroelectronics (Switzerland) Company Information
10.8.2 STMicroelectronics (Switzerland) Introduction and Business Overview
10.8.3 STMicroelectronics (Switzerland) Solder Bumping Flip Chip Sales, Revenue and Gross Margin (2018-2023)
10.8.4 STMicroelectronics (Switzerland) Solder Bumping Flip Chip Products Offered
10.8.5 STMicroelectronics (Switzerland) Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Solder Bumping Flip Chip Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Solder Bumping Flip Chip Industrial Chain Analysis
11.4 Solder Bumping Flip Chip Market Dynamics
11.4.1 Solder Bumping Flip Chip Industry Trends
11.4.2 Solder Bumping Flip Chip Market Drivers
11.4.3 Solder Bumping Flip Chip Market Challenges
11.4.4 Solder Bumping Flip Chip Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Solder Bumping Flip Chip Distributors
12.3 Solder Bumping Flip Chip Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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