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Solder Bumps-Global Market Insights and Sales Trends 2025
Synopsis
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "bumps" or "balls" made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Those "bumps", which can be composed from eutectic, lead free, high lead materials, or Cu pillar on wafer are the fundamental interconnect components that will interconnect the die and the substrate together into a single package. These bumps not only provide a connected path between die and substrate, but also play an important role in the electrical, mechanical and thermal performance in the flip chip package.
Flip chip assembly package has traditionally been used for high-end niche applications. Recent technology development has adopted this process to be widely used in today's consumer electronics applications. For the performance driven market, flip chip interconnection reduces signal propagation delay, provide much better bandwidth, and relieves the constraints of power and ground distribution. For the form factor driven market, such as mobile applications, replacing wire bonding by flip chip interconnects reduces the size and weight of the package.
The global Solder Bumps market size is expected to reach US$ 344.2 million by 2029, growing at a CAGR of 6.0% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Bumps in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Solder Bumps market. Lead Solder Bumps, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Bumps segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Solder Bumps market, driven by demand from China, the second largest economy with some signs of stabilising, the Solder Bumps market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Bumps, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Bumps market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Bumps market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Bumps sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Bumps covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global Solder Bumps market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Global Solder Bumps market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Bumps market, Segment by Type:
Lead Solder Bumps
Lead Free Solder Bumps
Global Solder Bumps market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Bumps manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Bumps in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Wafer bumping is an essential to flip chip or board level semiconductor packaging. Bumping is an advanced wafer level process technology where "bumps" or "balls" made of solder are formed on the wafers in a whole wafer form before the wafer is being diced into individual chips. Those "bumps", which can be composed from eutectic, lead free, high lead materials, or Cu pillar on wafer are the fundamental interconnect components that will interconnect the die and the substrate together into a single package. These bumps not only provide a connected path between die and substrate, but also play an important role in the electrical, mechanical and thermal performance in the flip chip package.
Flip chip assembly package has traditionally been used for high-end niche applications. Recent technology development has adopted this process to be widely used in today's consumer electronics applications. For the performance driven market, flip chip interconnection reduces signal propagation delay, provide much better bandwidth, and relieves the constraints of power and ground distribution. For the form factor driven market, such as mobile applications, replacing wire bonding by flip chip interconnects reduces the size and weight of the package.
The global Solder Bumps market size is expected to reach US$ 344.2 million by 2029, growing at a CAGR of 6.0% from 2023 to 2029. The market is mainly driven by the significant applications of Solder Bumps in various end use industries. The expanding demands from the BGA, CSP & WLCSP and Flip-Chip & Others,, are propelling Solder Bumps market. Lead Solder Bumps, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Lead Free Solder Bumps segment is estimated at % CAGR for the next seven-year period.
Asia Pacific shows high growth potential for Solder Bumps market, driven by demand from China, the second largest economy with some signs of stabilising, the Solder Bumps market in China is forecast to reach US$ million by 2029, trailing a CAGR of % over the 2023-2029 period, while the U.S. market will reach US$ million by 2029, exhibiting a CAGR of % during the same period.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Solder Bumps, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Solder Bumps market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Solder Bumps market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Solder Bumps sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Solder Bumps covered in this report include Senju Metal, DS HiMetal, MKE, YCTC, Accurus, PMTC, Shanghai hiking solder material, Shenmao Technology and Nippon Micrometal, etc.
The global Solder Bumps market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
Senju Metal
DS HiMetal
MKE
YCTC
Accurus
PMTC
Shanghai hiking solder material
Shenmao Technology
Nippon Micrometal
Indium Corporation
Global Solder Bumps market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Solder Bumps market, Segment by Type:
Lead Solder Bumps
Lead Free Solder Bumps
Global Solder Bumps market, by Application
BGA
CSP & WLCSP
Flip-Chip & Others
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Solder Bumps manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Solder Bumps in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Solder Bumps Market Overview
1.1 Solder Bumps Product Overview
1.2 Solder Bumps Market Segment by Type
1.2.1 Lead Solder Bumps
1.2.2 Lead Free Solder Bumps
1.3 Global Solder Bumps Market Size by Type
1.3.1 Global Solder Bumps Market Size Overview by Type (2018-2029)
1.3.2 Global Solder Bumps Historic Market Size Review by Type (2018-2023)
1.3.3 Global Solder Bumps Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Solder Bumps Sales Breakdown by Type (2018-2023)
1.4.2 Europe Solder Bumps Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Solder Bumps Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Solder Bumps Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Solder Bumps Sales Breakdown by Type (2018-2023)
2 Global Solder Bumps Market Competition by Company
2.1 Global Top Players by Solder Bumps Sales (2018-2023)
2.2 Global Top Players by Solder Bumps Revenue (2018-2023)
2.3 Global Top Players by Solder Bumps Price (2018-2023)
2.4 Global Top Manufacturers Solder Bumps Manufacturing Base Distribution, Sales Area, Product Type
2.5 Solder Bumps Market Competitive Situation and Trends
2.5.1 Solder Bumps Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Solder Bumps Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Solder Bumps as of 2022)
2.7 Date of Key Manufacturers Enter into Solder Bumps Market
2.8 Key Manufacturers Solder Bumps Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Solder Bumps Status and Outlook by Region
3.1 Global Solder Bumps Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Solder Bumps Historic Market Size by Region
3.2.1 Global Solder Bumps Sales in Volume by Region (2018-2023)
3.2.2 Global Solder Bumps Sales in Value by Region (2018-2023)
3.2.3 Global Solder Bumps Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Solder Bumps Forecasted Market Size by Region
3.3.1 Global Solder Bumps Sales in Volume by Region (2024-2029)
3.3.2 Global Solder Bumps Sales in Value by Region (2024-2029)
3.3.3 Global Solder Bumps Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Solder Bumps by Application
4.1 Solder Bumps Market Segment by Application
4.1.1 BGA
4.1.2 CSP & WLCSP
4.1.3 Flip-Chip & Others
4.2 Global Solder Bumps Market Size by Application
4.2.1 Global Solder Bumps Market Size Overview by Application (2018-2029)
4.2.2 Global Solder Bumps Historic Market Size Review by Application (2018-2023)
4.2.3 Global Solder Bumps Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Solder Bumps Sales Breakdown by Application (2018-2023)
4.3.2 Europe Solder Bumps Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Solder Bumps Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Solder Bumps Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Solder Bumps Sales Breakdown by Application (2018-2023)
5 North America Solder Bumps by Country
5.1 North America Solder Bumps Historic Market Size by Country
5.1.1 North America Solder Bumps Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Solder Bumps Sales in Volume by Country (2018-2023)
5.1.3 North America Solder Bumps Sales in Value by Country (2018-2023)
5.2 North America Solder Bumps Forecasted Market Size by Country
5.2.1 North America Solder Bumps Sales in Volume by Country (2024-2029)
5.2.2 North America Solder Bumps Sales in Value by Country (2024-2029)
6 Europe Solder Bumps by Country
6.1 Europe Solder Bumps Historic Market Size by Country
6.1.1 Europe Solder Bumps Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Solder Bumps Sales in Volume by Country (2018-2023)
6.1.3 Europe Solder Bumps Sales in Value by Country (2018-2023)
6.2 Europe Solder Bumps Forecasted Market Size by Country
6.2.1 Europe Solder Bumps Sales in Volume by Country (2024-2029)
6.2.2 Europe Solder Bumps Sales in Value by Country (2024-2029)
7 Asia-Pacific Solder Bumps by Region
7.1 Asia-Pacific Solder Bumps Historic Market Size by Region
7.1.1 Asia-Pacific Solder Bumps Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Solder Bumps Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Solder Bumps Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Solder Bumps Forecasted Market Size by Region
7.2.1 Asia-Pacific Solder Bumps Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Solder Bumps Sales in Value by Region (2024-2029)
8 Latin America Solder Bumps by Country
8.1 Latin America Solder Bumps Historic Market Size by Country
8.1.1 Latin America Solder Bumps Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Solder Bumps Sales in Volume by Country (2018-2023)
8.1.3 Latin America Solder Bumps Sales in Value by Country (2018-2023)
8.2 Latin America Solder Bumps Forecasted Market Size by Country
8.2.1 Latin America Solder Bumps Sales in Volume by Country (2024-2029)
8.2.2 Latin America Solder Bumps Sales in Value by Country (2024-2029)
9 Middle East and Africa Solder Bumps by Country
9.1 Middle East and Africa Solder Bumps Historic Market Size by Country
9.1.1 Middle East and Africa Solder Bumps Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Solder Bumps Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Solder Bumps Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Solder Bumps Forecasted Market Size by Country
9.2.1 Middle East and Africa Solder Bumps Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Solder Bumps Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 Senju Metal
10.1.1 Senju Metal Company Information
10.1.2 Senju Metal Introduction and Business Overview
10.1.3 Senju Metal Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.1.4 Senju Metal Solder Bumps Products Offered
10.1.5 Senju Metal Recent Development
10.2 DS HiMetal
10.2.1 DS HiMetal Company Information
10.2.2 DS HiMetal Introduction and Business Overview
10.2.3 DS HiMetal Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.2.4 DS HiMetal Solder Bumps Products Offered
10.2.5 DS HiMetal Recent Development
10.3 MKE
10.3.1 MKE Company Information
10.3.2 MKE Introduction and Business Overview
10.3.3 MKE Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.3.4 MKE Solder Bumps Products Offered
10.3.5 MKE Recent Development
10.4 YCTC
10.4.1 YCTC Company Information
10.4.2 YCTC Introduction and Business Overview
10.4.3 YCTC Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.4.4 YCTC Solder Bumps Products Offered
10.4.5 YCTC Recent Development
10.5 Accurus
10.5.1 Accurus Company Information
10.5.2 Accurus Introduction and Business Overview
10.5.3 Accurus Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.5.4 Accurus Solder Bumps Products Offered
10.5.5 Accurus Recent Development
10.6 PMTC
10.6.1 PMTC Company Information
10.6.2 PMTC Introduction and Business Overview
10.6.3 PMTC Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.6.4 PMTC Solder Bumps Products Offered
10.6.5 PMTC Recent Development
10.7 Shanghai hiking solder material
10.7.1 Shanghai hiking solder material Company Information
10.7.2 Shanghai hiking solder material Introduction and Business Overview
10.7.3 Shanghai hiking solder material Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.7.4 Shanghai hiking solder material Solder Bumps Products Offered
10.7.5 Shanghai hiking solder material Recent Development
10.8 Shenmao Technology
10.8.1 Shenmao Technology Company Information
10.8.2 Shenmao Technology Introduction and Business Overview
10.8.3 Shenmao Technology Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.8.4 Shenmao Technology Solder Bumps Products Offered
10.8.5 Shenmao Technology Recent Development
10.9 Nippon Micrometal
10.9.1 Nippon Micrometal Company Information
10.9.2 Nippon Micrometal Introduction and Business Overview
10.9.3 Nippon Micrometal Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Nippon Micrometal Solder Bumps Products Offered
10.9.5 Nippon Micrometal Recent Development
10.10 Indium Corporation
10.10.1 Indium Corporation Company Information
10.10.2 Indium Corporation Introduction and Business Overview
10.10.3 Indium Corporation Solder Bumps Sales, Revenue and Gross Margin (2018-2023)
10.10.4 Indium Corporation Solder Bumps Products Offered
10.10.5 Indium Corporation Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Solder Bumps Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Solder Bumps Industrial Chain Analysis
11.4 Solder Bumps Market Dynamics
11.4.1 Solder Bumps Industry Trends
11.4.2 Solder Bumps Market Drivers
11.4.3 Solder Bumps Market Challenges
11.4.4 Solder Bumps Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Solder Bumps Distributors
12.3 Solder Bumps Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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