The Market Reports

Synopsis

The global market for Substrates for Semiconductor Test Probe Card was estimated to be worth US$ 147 million in 2024 and is forecast to a readjusted size of US$ 274 million by 2031 with a CAGR of 9.2% during the forecast period 2025-2031.

Substrates for Semiconductor Test Probe Cards are essential components in the semiconductor testing process, acting as the intermediary between the test probes (used to make electrical contact with semiconductor devices) and the test equipment. These substrates are used to position the probes accurately and facilitate the flow of electrical signals during the testing of integrated circuits (ICs) and semiconductor wafers. The choice of substrate material can impact the performance, reliability, and cost-effectiveness of the probe card, making it a critical consideration in semiconductor manufacturing and testing.

The future development trends of Substrates for Semiconductor Test Probe Card are mainly:

1. Higher test density
With the continuous advancement of integrated circuit (IC) technology, the integration of chips is getting higher and higher, especially the demand for system-on-chip (SoC), AI chips and high-performance computing chips has driven the increase in test density. Probe card substrates will need to support more probes (with higher probe arrangement density) to achieve comprehensive testing of chips. The substrate will develop towards higher precision and finer structures to meet this high-density testing demand.

2. More miniaturization and high integration
In order to adapt to modern electronic devices and high-density packaging technologies (such as 3D packaging, system-level packaging (SiP)), probe card substrates will tend to be miniaturized and highly integrated. This will not only reduce space occupancy, but also improve test efficiency. Miniaturization design will also make probe cards more suitable for portable and low-power devices.

3. Multifunctional integration
As chip testing requirements become more complex, substrates will not only play the role of mechanical support and electrical connection, but may also integrate more functions, such as temperature monitoring, humidity control, automatic adjustment, etc. For example, in high-power semiconductor testing, the substrate may need to integrate more heat dissipation technology or liquid cooling solutions to ensure test stability and accuracy.

4. Application of new materials
Ceramic substrates are still the mainstream material, but with the demand for higher efficiency and lower cost, composite substrates (such as ceramic and metal composites, ceramic and plastic composites) and glass substrates are expected to become new development directions. New materials will improve the thermal management performance, mechanical strength, corrosion resistance and signal transmission efficiency of the substrate, and help reduce production costs.

5. Automation and intelligence
As the semiconductor manufacturing and testing process develops towards intelligence and automation, the probe card substrate will be closely integrated with automated testing equipment and intelligent diagnostic systems to improve test accuracy, efficiency and reliability. The substrate may integrate intelligent control systems, such as real-time monitoring of temperature, pressure, and displacement, to optimize the test process and reduce manual intervention.

6. Cost optimization and domestic substitution
As the global semiconductor industry gradually moves towards localized production and domestic substitution, the production of probe card substrates will pay more attention to reducing costs. The rapid growth of the Chinese market may also prompt more local manufacturers to invest in the research and development of probe card substrates, driving further cost reductions.

In terms of consumption, North America is currently the world's largest consumer market, accounting for 29.06% of the sales market share in 2024, followed by Japan and South Korea, accounting for 23.16% and 10.12% of the sales market share respectively. It is expected that in the next few years, the localization substitution and independent research and development process of China's semiconductor industry will accelerate, and the demand for probe cards in the domestic market will grow rapidly. With the development of domestic semiconductor equipment and material technology, localization substitution has become a trend of future development. The market for Substrates for Semiconductor Test Probe Card in China has the fastest growth, with a CAGR of approximately 17.00% during 2025-2031.

From the production side, the substrates for semiconductor test probe cards are currently basically concentrated in Japan and South Korea, which are two important production areas, accounting for 67.03% and 28.68% of the market share in 2024 respectively. Due to the high monopoly of the semiconductor test probe card substrate market, the core technology is in the hands of Japanese and Korean companies. It is expected that Japan and South Korea will still firmly occupy the core position in the next few years. With the research and development results of Chinese company Shanghai Zefeng Semiconductor Technology on MEMS probes and substrates for semiconductor test probe cards, more and more Chinese local companies will gradually increase their technology research and development and market penetration in the field of probe cards and substrates. It is expected that in the next few years, China will maintain the fastest growth rate, and the share is expected to reach 2.93% in 2031.

In terms of product types, 300mm Substrates for Semiconductor Test Probe Card occupy an important position. 300mm substrates are mainly used for testing high-end chips, high-density packaging and advanced processes, and are suitable for large-scale mass production. With the continuous advancement of chip manufacturing technology, 300mm substrates are becoming mainstream, especially in high-end processes and high-performance chip testing. It is expected that the market demand for 300mm substrates will continue to grow in the next few years. The sales market share of 300mm substrates in 2024 is 83.96%, and it is expected to reach 89.42% in 2031. At the same time, in terms of application, DRAM's sales share in 2024 is about 44.62%, and the CAGR in the next few years is about 13.72%.

From the perspective of manufacturers, semiconductor test probe card substrate manufacturers are highly concentrated worldwide, and only a few can mass-produce and supply Substrates for Semiconductor Test Probe Card. The main manufacturers include Kyocera, SEMCNS Co., Ltd, Niterra (NTK), IMTech Plus, LTCC Materials, FINE CERATECH INC., Shanghai Zefeng Semiconductor Technology, etc. In 2024, the first-tier manufacturers in the world are mainly Kyocera, which has a market share of about 42.73%; the second-tier manufacturers are SEMCNS Co., Ltd and Niterra (NTK), which have a total share of 43.13%.

The future development of Substrates for Semiconductor Test Probe Card will be driven by multiple factors, mainly including the continuous evolution of semiconductor processes, innovation in packaging technology, the rise of high-performance computing and AI chips, and the increase in cost control and environmental protection needs. Future probe card substrates will tend to be high-density, high-integration, miniaturized, low-cost and multi-functional designs, and technological innovation will continue to drive semiconductor testing technology towards higher precision and higher efficiency. At the same time, with the advancement of domestic substitution, the Chinese market will also become a key driving force for the development of probe card substrates.

This report aims to provide a comprehensive presentation of the global market for Substrates for Semiconductor Test Probe Card, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Substrates for Semiconductor Test Probe Card by region & country, by Type, and by Application.

The Substrates for Semiconductor Test Probe Card market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Substrates for Semiconductor Test Probe Card.

Market Segmentation

By Company

• Kyocera
• SEMCNS Co., Ltd
• Niterra (NTK)
• IMTech Plus
• LTCC Materials
• FINE CERATECH INC.
• Shanghai Zenfocus

Segment by Type

• Size: 300mm
• Other Sizes: 200mm and 150mm

Segment by Application

• NAND Flash Memory
• DRAM
• Logic Devices
• Others

Segment by Region

• North America: United States, Canada, and Mexico
• Europe: United Kingdom, Germany, France, Spain, Italy, and Rest of Europe
• Asia Pacific: China, India, Japan, Australia, South Korea, and Rest of Asia Pacific
• Middle East & Africa: Saudi Arabia, South Africa, and Rest of MEA
• Latin America: Brazil, Argentina, and Rest of Latin America

*If you need a regional or country-specific version, or customized segmentation, we can tailor the report to your requirements.