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Synopsis
The global market for Thick Film Ceramic Substrates was estimated to be worth US$ 114 million in 2024 and is forecast to a readjusted size of US$ 149 million by 2031 with a CAGR of 3.9% during the forecast period 2025-2031.
Thick film ceramic substrate refers to ceramic substrate processed by thick film technology. The thick film ceramic substrate is a post-fired ceramic substrate. "Thick Film" refers to the thickness of conductor layer on Ceramic Substrate. Normally the thickness will be at least exceeds 10 miron (um), around 10~100um, more thick than spurting technology in Thin Film Ceramic Substrate. Of course thickness is less than DCB Ceramic board or FR4 board. At the same time, using thick film technology, we can put resistor, electric capacity, conductor, semi-conductor, and interchangable conductor on ceramic board, after manufacturing steps of printing and high temperature sintering. We can make all the resistors with the same value, or different value for different resistor on the same board. Due to the mature technology, simple process and low cost, thick-film ceramic substrates have been applied in electronic packages that do not require high graphics accuracy. In general, the thick film ceramic substrate covers Alumina (Al2O3) thick film substrates, AlN thick film substrates and BeO thick film Substrates.
Global thick film ceramic substrates key players include Noritake, NCI, Miyoshi Electronics Corporation, etc. Global top 3 manufacturers hold a share over 27%. Asia-Pacific is the largest market, with a share about 37%, followed by North America and Europe, both have a share about 56 percent. In terms of product, alumina thick film substrates is the largest segment, with a share about 77%. And in terms of application, the largest application is automotive & sensors, followed by industrial & medical.
Asia-Pacific is the largest market, with a share about 37%, driven by demand from China, Japan, and South Korea.
The key players of thick film ceramic substrates are mainly located in Japan, US, and Europe, include Noritake
NCI, Kyocera, Miyoshi Electronics Corporation, CMS Circuit Solutions, Inc, Cicor Group, Nikko, Maruwa, APITech (CMAC), and Mitsuboshi Belting, etc. The global top six players hold a share about 42 percent in 2024.
This report aims to provide a comprehensive presentation of the global market for Thick Film Ceramic Substrates, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Thick Film Ceramic Substrates by region & country, by Type, and by Application.
The Thick Film Ceramic Substrates market size, estimations, and forecasts are provided in terms of sales volume (K Sqm) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thick Film Ceramic Substrates.
Market Segmentation
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Index
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Published By : QY Research