The Market Reports

Synopsis
The global market for Ultra-thin Copper Foil was estimated to be worth US$ 4139 million in 2024 and is forecast to a readjusted size of US$ 17619 million by 2031 with a CAGR of 23.3% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Ultra-thin Copper Foil cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Electrolytic Copper Foil is the copper foil produced by the electrolytic method, which is made by dissolving the copper material into a copper sulfate solution.In professional electrolysis equipment, the solution is made into the original foil by direct current electrodeposition. Ultra-thin copper foil is a key material in batteries and other electronic fields, and its thickness is generally 2-5μm. But for high-end market demand, the market demand for copper foil with a thickness of less than 5μm is showing an upward trend.
Global Ultra-thin Copper Foil key players include SK Nexilis, Mitsui Mining & Smelting, ILJIN Materials, Nippon Denkai and UACJ Foil Corporation, etc. Global top five manufacturers hold a share over 70%.
In terms of product, 2-5μm is the largest segment, with a share about 70%. And in terms of application, the largest application is IC Substrate, followed by Coreless Substrate, etc.
The market trend of ultra-thin copper foil is showing a rapid growth trend, mainly driven by emerging industries such as 5G communications, flexible electronics, lithium batteries, and semiconductor packaging. As terminal products such as smartphones and wearable devices continue to develop in the direction of thinness and miniaturization, higher performance requirements are put forward for flexible circuit boards (FPCs), driving the demand for high-strength, high-conductivity, and low-thickness copper foil to continue to rise. At the same time, in the field of new energy vehicles, ultra-thin copper foil is an important component of the negative electrode current collector of lithium batteries. Its conductivity and mechanical properties are directly related to the battery energy density and safety. It is a key material under the development trend of high energy density of power batteries.
This report aims to provide a comprehensive presentation of the global market for Ultra-thin Copper Foil, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Ultra-thin Copper Foil by region & country, by Type, and by Application.
The Ultra-thin Copper Foil market size, estimations, and forecasts are provided in terms of sales volume (Tons) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Ultra-thin Copper Foil.
Market Segmentation
By Company
SK Nexilis
Mitsui Mining & Smelting
ILJIN Materials
Fukuda Metal Foil & Powder
Nippon Denkai
UACJ Foil Corporation
Nan Ya Plastics
Chaohua Technology
Guangdong Jia Yuan Tech
Nuode
Shengda Electric
Tongling Nonferrous Metals Group
Segment by Type
Below 2μm
2-5μm
Segment by Application
IC Substrate
Coreless Substrate
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Ultra-thin Copper Foil manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Ultra-thin Copper Foil in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Ultra-thin Copper Foil in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index