SynopsisGlobal 3D Structured Light Type Sensor Module market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukr.....
Synopsis The global Student Information System market was valued at US$ 9146.7 million in 2023 and is anticipated to reach US$ 22620 million by 2030, witnessing a CAGR of 13.6% during the forecast period 2024-2030. North American market for Stu.....
SynopsisThe global Automated Freight Transport Solution market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Automated Freight Transport Solution in various end u.....
SynopsisCellular telematic gateway with multiple interface and IP 68 tiny tracking devices for fleet management market. The global Telematics Gateways market size is expected to reach US$ 113 million by 2029, growing at a CAGR of 5.6% from 2023 to 2029. The mark.....
SynopsisThe global Intelligent Log Analysis market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Intelligent Log Analysis in various end use industries. The expan.....
SynopsisDigital Brand Protection Services is a service for the protection and maintenance of corporate brands in the digital environment. With the development of the Internet and the rise of e-commerce, enterprises' brand value and intellectual property rights are fac.....
SynopsisThe global IoT Asset Management market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to our research, the number of global connected IoT devices w.....
SynopsisHigh-bandwidth memory (HBM) is a dynamic random-access memory (DRAM) technology approved by the Joint Electron Device Engineering Council (JEDEC) as an industry standard. The technology uses through-silicon vias (TSVs) and a silicon interposer technology to in.....
SynopsisThe global Mergers and Acquisitions Service market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Mergers and Acquisitions Service i.....
SynopsisThin-film lithium niobate (LNOI) refers to a lithium niobate single crystal with a thickness of 300-900nm prepared on heterogeneous substrate materials such as silicon by Smart-cut technology (including ion implantation, transfer bonding, lift-off and polishin.....
