SynopsisDynamic Lighting Driver ICs, often referred to as LED driver ICs, are integrated circuits designed to control the operation of LEDs (Light-Emitting Diodes) in various dynamic lighting applications. The global Dynamic Lighting Driver IC market was valued .....
SynopsisThe global Autonomous Valet Parking Robot market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Autonomous Valet Parking Robot is e.....
SynopsisGlobal Business Treasury Management market is projected to reach US$ million in 2029, increasing from US$ million in 2022, with the CAGR of % during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, .....
SynopsisOver the Top (OTT) services refer to any type of video or streaming media that provides a viewer access to movies or TV shows by sending the media directly through the internet. Some of the most popular OTT providers include Netflix, Amazon Prime Video, and Hu.....
Synopsis An antifuse is an electrically programmable two-terminal device with small area, low parasitic resistance, and capacitance. Field-programmable gate arrays (FPGAs) using antifuses in a segmented channel routing architecture now offer the digital .....
SynopsisThe photovoltaic power station intelligent diagnosis system is a system based on artificial intelligence and big data analysis, which is used to monitor and analyze the operating status of photovoltaic power stations, and provides intelligent fault diagnosis a.....
Synopsis The global IoT Underwater market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. According to our research, the number of global connected .....
SynopsisHigh-End MLCC (Multi-Layer Ceramic Capacitor) refers to a type of advanced electronic component that is used for energy storage and filtering purposes in various electronic devices. MLCCs are made of alternating layers of ceramic and conductive material, creat.....
SynopsisThe global Solder Bumping Flip Chip market was valued at US$ 12090 million in 2023 and is anticipated to reach US$ 18790 million by 2030, witnessing a CAGR of 6.6% during the forecast period 2024-2030. Following a strong growth of 26.2 percent in the yea.....
SynopsisMarket Analysis and Insights: Global SAP EPM Consulting Service Market The global SAP EPM Consulting Service market size is projected to reach US$ million by 2028, from US$ million in 2021, at a CAGR of % during 2022-2028. Fully considering the e.....
