SynopsisIn integrated circuit packaging, a solder ball, also a solder bump (often referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in mult.....
SynopsisThe High Density D-Sub Connector have the same size as the Standard Density connector but hold more contacts in its insulator.The High Density connector have a drawback in comparison and that is the current rating which is only 3Aas the Standard Density have 5.....
SynopsisTime lapsecamera is used for time-lapse shooting which is a shooting technique that compresses time. It shoots a set of photos or videos, and later compresses the process in minutes, hours, or even days and years in a short period of time by video. In a time-l.....
SynopsisThe global Irradiation Technology market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of %during the forecast period 2024-2030. North American market for Irradiation Technology is estimated to incre.....
SynopsisElectronic Informed Consent is a method of using digital technology to manage and record the consent process of research participants or patients. It is primarily used in the healthcare and clinical research sectors to improve efficiency, transparency and comp.....
SynopsisOcean Logistics refers to the transportation and management of goods through cargo ships on the ocean. It involves the coordination of activities such as booking shipping space, tracking shipments, and managing customs procedures and regulations to ensure the .....
Synopsis Zirconia oxide (ZrO2) ceramic substrates are a type of ceramic substrate that are used in a variety of applications due to their excellent mechanical, thermal, and electrical properties. ZrO2 ceramic substrates have a high mechanica.....
SynopsisMultiport USB Hubs are devices that allow multiple USB devices to connect to a single USB port. These USB hubs come with multiple USB ports and provide a convenient way to connect different USB devices to a laptop, desktop, or other electronic device. Multipor.....
SynopsisThe global Machine-to-Machine Modules market size is expected to reach US$ million by 2029, growing at a CAGR of % from 2023 to 2029. The market is mainly driven by the significant applications of Machine-to-Machine Modules in various end use industries. The e.....
SynopsisThe global Configurable Mixed-signal IC market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while .....
