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SynopsisFoundry, a business model of the semiconductor industry, specializes in semiconductor wafer manufacturing, and is commissioned by other IC design companies instead of their own designs. The foundry mode is divided into Pure-play Foundry mode and IDM Foun.....

No Of Pages : 94
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSemiconductor Inspection System is the equipment used in manufacturing process of semiconductor device to detect the failure. The global Semiconductor Inspection Systems market was valued at US$ 9261.2 million in 2023 and is anticipated to reach US$ 1263.....

No Of Pages : 114
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisInterconnects connect IC elements into a functioning whole. The metal layers or interconnect levels vary depending on the complexity of the device. They are interconnected by vias, also known as etching holes. The global Semiconductor Interconnect market.....

No Of Pages : 77
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSemiconductor Laser Therapeutic Equipment is equipment that uses a semiconductor laser as a medium to stimulate therapeutic instrument. Each excitation, The electron atoms pumped to a higher energy level , the energy level in the original leave a hole , and th.....

No Of Pages : 90
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSemiconductor IPs are an integral part of electronic design automation (EDA). They help design engineers and developers create SoCs. The global Semiconductor Memory IP market was valued at US$ 4535.3 million in 2023 and is anticipated to reach US$ 9015.8.....

No Of Pages : 75
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisSemiconductor micro components are an important part of all the electronic devices. The global Semiconductor Micro Components market was valued at US$ 134970 million in 2023 and is anticipated to reach US$ 183170 million by 2030, witnessing a CAGR of 4.4.....

No Of Pages : 92
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisFor an integrated chip (IC) to function, it needs to be connected to the package or connected directly to the printed circuit. This involves dicing, wire bonding, and die bonding. This entire process is known as semiconductor packaging and assembly, which is t.....

No Of Pages : 95
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

Synopsis Semiconductor packaging is carried out to provide extra protection to wafers or substrates. The package casing is made up of materials such as metal, plastic, glass, or ceramic and contains one or more semiconductor electronic components. .....

No Of Pages : 103
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisPhotoresist stripping equipment is used to remove the residuals of photoresists from silicon wafer after it is etched during the semiconductor chip fabrication process. The equipment plays an important role in the chip fabrication process in ensuring that the .....

No Of Pages : 104
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThe global Semiconductor Process Control Equipment market was valued at US$ 7602.8 million in 2023 and is anticipated to reach US$ 13050 million by 2030, witnessing a CAGR of 7.9% during the forecast period 2024-2030. According to our Semiconductor Resea.....

No Of Pages : 103
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00