SynopsisThe matching unit matches the impedance of the exciter to the transmission line so as to assure the maximum of the RF power transmission to the RF coil. The global RF Matching Unit market was valued at US$ million in 2023 and is anticipated to reach US$ .....
SynopsisThe global HD Haptic Driver IC market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for HD Haptic Driver IC is estimated to increase f.....
SynopsisThe global Phone PTZ market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Phone PTZ is estimated to increase from $ million in 202.....
SynopsisThe global Endoscope Robot market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Endoscope Robot is estimated to increase from $ mi.....
SynopsisThe percutaneous puncture surgical robot is a robot that uses MRI, ultrasound, CT and other imaging technologies to locate the target anatomy, guide the feedback needle to reach the target anatomical structure, and assist in the completion of the percutaneous .....
SynopsisConformal Conductor Etching System consists of multiple etch and plasma clean wafer processing chambers，the new coating material can protect the key chamber components, thereby further reducing defects and increasing yield.Conductor etch helps shape the electr.....
SynopsisThe global Arming Devices market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Arming Devices is estimated to increase from $ mill.....
SynopsisHigh-power semiconductor lasers are mainly divided into two structures: single-tube and single-bars. The single-tube structure mostly adopts the design of wide strip and large optical cavity and increases the gain area to achieve high power output and reduce t.....
SynopsisPackaging materials mainly include packaging substrates, lead frames, bonding wires, molding compounds, bonding materials, underfill materials, liquid sealants, patch materials, solder balls, wafer-level packaging dielectrics, etc. Divided into three types of .....
SynopsisCeramic packaging material is a commonly used electronic packaging material. Ceramic packaging belongs to airtight packaging. Its advantages are good moisture resistance, good thermal properties such as thermal expansion rate and thermal conductivity, high mec.....
