SynopsisMetal has been used in electronic packaging earlier because of its good mechanical strength, good thermal conductivity, electromagnetic shielding function, and easy mechanical processing, and it is still the main material of electronic packaging today. Metal p.....
SynopsisAlthough plastic packaging materials have low thermal conductivity and mismatched thermal expansion coefficients, they have low cost and low density, and are often used in applications that do not require high packaging performance. The global Plastic Pa.....
SynopsisThe bar chip is a laser diode chip composed of multiple light-emitting units arranged in a straight line. After the bar chip is passivated and coated, it can be cleaved into a single-tube chip of a single light-emitting unit. The global Semiconductor Las.....
SynopsisThe core components of the semiconductor pump source integrate multiple layers of epitaxial materials including active area, waveguide layer, cladding layer, electrode contact layer, pn junction, etc. in nanometers, and rely on the diode pn junction structure .....
SynopsisSingle-Emitter Laser Diode is a light-emitting unit formed by packaging a laser chip The global Single Emitter Laser Diode market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the foreca.....
SynopsisThe global Semiconductor Laser Module market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Semiconductor Laser Module is estimated.....
SynopsisThe incident light whose light intensity distribution is not uniform enough to meet specific application requirements is transformed into optical components with improved light intensity distribution uniformity and capable of meeting application requirements t.....
SynopsisSince the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal conductivity (TC) and matching coefficient of thermal expansion (CTE). High thermal conductivity realizes rapid heat d.....
SynopsisThe global Electronic Packaging Ceramic Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Electronic Packaging Cerami.....
SynopsisThe development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by Invar and Kovar alloys, and the thermal conductivity of the alloy is only 11-17W/(m•K). The second generation .....
