The Market Reports

SynopsisThe percutaneous puncture surgical robot is a robot that uses MRI, ultrasound, CT and other imaging technologies to locate the target anatomy, guide the feedback needle to reach the target anatomical structure, and assist in the completion of the percutaneous .....

SynopsisConformal Conductor Etching System consists of multiple etch and plasma clean wafer processing chambers，the new coating material can protect the key chamber components, thereby further reducing defects and increasing yield.Conductor etch helps shape the electr.....

SynopsisThe global Arming Devices market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Arming Devices is estimated to increase from $ mill.....

SynopsisHigh-power semiconductor lasers are mainly divided into two structures: single-tube and single-bars. The single-tube structure mostly adopts the design of wide strip and large optical cavity and increases the gain area to achieve high power output and reduce t.....

SynopsisPackaging materials mainly include packaging substrates, lead frames, bonding wires, molding compounds, bonding materials, underfill materials, liquid sealants, patch materials, solder balls, wafer-level packaging dielectrics, etc. Divided into three types of .....

SynopsisCeramic packaging material is a commonly used electronic packaging material. Ceramic packaging belongs to airtight packaging. Its advantages are good moisture resistance, good thermal properties such as thermal expansion rate and thermal conductivity, high mec.....

SynopsisMetal has been used in electronic packaging earlier because of its good mechanical strength, good thermal conductivity, electromagnetic shielding function, and easy mechanical processing, and it is still the main material of electronic packaging today. Metal p.....

SynopsisAlthough plastic packaging materials have low thermal conductivity and mismatched thermal expansion coefficients, they have low cost and low density, and are often used in applications that do not require high packaging performance. The global Plastic Pa.....

SynopsisThe bar chip is a laser diode chip composed of multiple light-emitting units arranged in a straight line. After the bar chip is passivated and coated, it can be cleaved into a single-tube chip of a single light-emitting unit. The global Semiconductor Las.....

SynopsisThe core components of the semiconductor pump source integrate multiple layers of epitaxial materials including active area, waveguide layer, cladding layer, electrode contact layer, pn junction, etc. in nanometers, and rely on the diode pn junction structure .....