SynopsisRailway molded frictional material refers to specialized materials used in the braking systems of trains and locomotives, particularly molded brake blocks. The global Railway Molded Frictional Material market was valued at US$ million in 2023 and is anti.....
SynopsisTraditional epoxy molding compounds refer to standard epoxy resins used in the encapsulation and protection of electronic components and semiconductor devices. The global Traditional Epoxy Molding Compounds market was valued at US$ 1253 million in 2023 a.....
SynopsisHigh-performance epoxy molding compounds refer to advanced epoxy resins formulated for demanding electronic applications, such as automotive, aerospace, and telecommunications. The global High Performance Epoxy Molding Compounds market was valued at US$ .....
SynopsisAdvanced epoxy molding compounds are specialized epoxy resins formulated for high-performance encapsulation and protection of electronic components and semiconductor devices. These compounds offer enhanced mechanical, thermal, and electrical properties compare.....
SynopsisWafer level package epoxy molding compound is a specialized epoxy resin used in the packaging of semiconductor devices directly at the wafer level. This process is commonly known as wafer-level packaging (WLP). The global Wafer Level Package Epoxy Moldin.....
SynopsisMolding compounds for discretes are epoxy resins used in the encapsulation and packaging of discrete semiconductor devices, such as diodes, transistors, and power modules. The global Molding Compounds for Discrete market was valued at US$ 1293 million in.....
SynopsisMolding compounds for ICs (Integrated Circuits) are epoxy resins used in the encapsulation and packaging of semiconductor ICs. The global Molding Compounds for ICs market was valued at US$ 1047 million in 2023 and is anticipated to reach US$ 1625.2 milli.....
SynopsisHigh thermal conductive epoxy molding compound is a specialized epoxy resin with high thermal conductivity, used in semiconductor packaging to enhance heat dissipation and thermal management. The global High Thermal Conductive Epoxy Molding Compound mark.....
SynopsisMolding compounds for power devices are specialized epoxy resins designed for encapsulating and packaging high-power semiconductor devices, such as power transistors and diodes. The global Molding Compounds for Power Device market was valued at US$ 1293 .....
SynopsisFC underfills (Flip-Chip Underfills) are specialized epoxy-based materials used to fill the gap between a flip-chip die and its substrate to enhance the mechanical and thermal reliability of flip-chip packages. The global FC Underfills market was valued .....
