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SynopsisSemiconductor underfill is an epoxy-based material used to fill the gap between a semiconductor die and its package substrate to enhance mechanical and thermal reliability. The global Semiconductor Underfill market was valued at US$ 153 million in 2023 a.....

No Of Pages : 103
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHeat dissipation sheet (HD sheet) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Sheet (HD Sheet) market was valued at US$ 182 millio.....

No Of Pages : 115
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHeat dissipation grease (HD grease) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Grease (HD Grease) market was valued at US$ 144 mi.....

No Of Pages : 120
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHeat dissipation adhesive (HD adhesive) is a thermal interface material (TIM) used to improve heat transfer between electronic components and heat sinks or other cooling surfaces. The global Heat Dissipation Adhesive (HD Adhesive) market was valued at US.....

No Of Pages : 115
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHeat dissipation gap filler (HD gap filler) is a thermal interface material (TIM) used to fill irregular gaps and voids between electronic components and heat sinks or other cooling surfaces, ensuring efficient heat dissipation. The global Heat Dissipati.....

No Of Pages : 98
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisFillers for thermal interface materials refer to a wide range of particles and additives used to enhance the thermal conductivity and performance of thermal interface materials (TIMs), such as pastes, greases, and pads. The global Filler for Thermal Inte.....

No Of Pages : 99
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisThermal gap filler pad is a type of thermal interface material (TIM) available in pad form, used to fill gaps between electronic components and heat sinks or other cooling surfaces, ensuring efficient heat dissipation. The global Thermal Gap Filler Pad m.....

No Of Pages : 97
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisPerfluoropolyether (PFPE) fluorinated fluids are a class of synthetic lubricants known for their exceptional thermal stability, chemical inertness, and low volatility. The global Perfluoropolyether Fluorinated Fluids market was valued at US$ million in 2.....

No Of Pages : 83
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisQuartz glass for photovoltaic refers to high-purity quartz glass used in solar photovoltaic (PV) applications, such as solar cells and modules. The global Quartz Glass for Photovoltaic market was valued at US$ 788 million in 2023 and is anticipated to re.....

No Of Pages : 112
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00

SynopsisHigh purity silica sand for solar cell is a type of silica sand with high silica content and low impurities, used in the production of solar photovoltaic (PV) cells. The global High Purity Silica Sand for Solar Cell market was valued at US$ 164 million i.....

No Of Pages : 89
Publication Date: Mar, 2025
Single User Price : US$ 2,900.00