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Flip Chip Bonder-Global Market Insights and Sales Trends 2025
Synopsis
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
The global Flip Chip Bonder market size is expected to reach US$ 315.6 million by 2029, growing at a CAGR of 1.2% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Bonder in various end use industries. The expanding demands from the IDMs and OSAT, are propelling Flip Chip Bonder market. Fully Automatic, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Semi-Automatic segment is estimated at % CAGR for the next seven-year period.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Bonder, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Bonder market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Bonder market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Bonder sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Bonder covered in this report include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET and Athlete FA, etc.
The global Flip Chip Bonder market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Global Flip Chip Bonder market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Bonder market, Segment by Type:
Fully Automatic
Semi-Automatic
Global Flip Chip Bonder market, by Application
IDMs
OSAT
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Flip Chip Bonder manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Flip Chip Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
The global Flip Chip Bonder market size is expected to reach US$ 315.6 million by 2029, growing at a CAGR of 1.2% from 2023 to 2029. The market is mainly driven by the significant applications of Flip Chip Bonder in various end use industries. The expanding demands from the IDMs and OSAT, are propelling Flip Chip Bonder market. Fully Automatic, one of the segments analysed in this report, is projected to record % CAGR and reach US$ million by the end of the analysis period. Growth in the Semi-Automatic segment is estimated at % CAGR for the next seven-year period.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Report Objectives
This report provides market insight on the different segments, by manufacturers, by Type, by Application. Market size and forecast (2018-2029) has been provided in the report. The primary objectives of this report are to provide 1) global market size and forecasts, growth rates, market dynamics, industry structure and developments, market situation, trends; 2) global market share and ranking by company; 3) comprehensive presentation of the global market for Flip Chip Bonder, with both quantitative and qualitative analysis through detailed segmentation; 4) detailed value chain analysis and review of growth factors essential for the existing market players and new entrants; 5) emerging opportunities in the market and the future impact of major drivers and restraints of the market.
Key Features of The Study:
This report provides in-depth analysis of the global Flip Chip Bonder market, and provides market size (US$ million) and CAGR for the forecast period (2023-2029), considering 2022 as the base year.
This report profiles key players in the global Flip Chip Bonder market based on the following parameters - company details (found date, headquarters, manufacturing bases), products portfolio, Flip Chip Bonder sales data, market share and ranking.
This report elucidates potential market opportunities across different segments and explains attractive investment proposition matrices for this market.
This report illustrates key insights about market drivers, restraints, opportunities, market trends, regional outlook.
Key companies of Flip Chip Bonder covered in this report include BESI, ASMPT, Shibaura, Muehlbauer, K&S, Hamni, AMICRA Microtechnologies, SET and Athlete FA, etc.
The global Flip Chip Bonder market report caters to various stakeholders in this industry including investors, suppliers, product manufacturers, distributors, new entrants, and financial analysts.
Market Segmentation
Company Profiles:
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Global Flip Chip Bonder market, by region:
North America (U.S., Canada, Mexico)
Europe (Germany, France, UK, Italy, etc.)
Asia Pacific (China, Japan, South Korea, Southeast Asia, India, etc.)
South America (Brazil, etc.)
Middle East and Africa (Turkey, GCC Countries, Africa, etc.)
Global Flip Chip Bonder market, Segment by Type:
Fully Automatic
Semi-Automatic
Global Flip Chip Bonder market, by Application
IDMs
OSAT
Core Chapters
Chapter One: Introduces the study scope of this report, executive summary of market segments by Type, market size segments for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Two: Detailed analysis of Flip Chip Bonder manufacturers competitive landscape, price, sales, revenue, market share and ranking, latest development plan, merger, and acquisition information, etc.
Chapter Three: Sales, revenue of Flip Chip Bonder in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the future development prospects, and market space in the world.
Chapter Four: Introduces market segments by Application, market size segment for North America, Europe, Asia Pacific, South America, Middle East & Africa.
Chapter Five, Six, Seven, Eight and Nine: North America, Europe, Asia Pacific, South America, Middle East & Africa, sales and revenue by country.
Chapter Ten: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter Eleven: Analysis of industrial chain, key raw materials, manufacturing cost, and market dynamics. Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter Twelve: Analysis of sales channel, distributors and customers.
Chapter Thirteen: Research Findings and Conclusion.
Index1 Flip Chip Bonder Market Overview
1.1 Flip Chip Bonder Product Overview
1.2 Flip Chip Bonder Market Segment by Type
1.2.1 Fully Automatic
1.2.2 Semi-Automatic
1.3 Global Flip Chip Bonder Market Size by Type
1.3.1 Global Flip Chip Bonder Market Size Overview by Type (2018-2029)
1.3.2 Global Flip Chip Bonder Historic Market Size Review by Type (2018-2023)
1.3.3 Global Flip Chip Bonder Forecasted Market Size by Type (2024-2029)
1.4 Key Regions Market Size Segment by Type
1.4.1 North America Flip Chip Bonder Sales Breakdown by Type (2018-2023)
1.4.2 Europe Flip Chip Bonder Sales Breakdown by Type (2018-2023)
1.4.3 Asia-Pacific Flip Chip Bonder Sales Breakdown by Type (2018-2023)
1.4.4 Latin America Flip Chip Bonder Sales Breakdown by Type (2018-2023)
1.4.5 Middle East and Africa Flip Chip Bonder Sales Breakdown by Type (2018-2023)
2 Global Flip Chip Bonder Market Competition by Company
2.1 Global Top Players by Flip Chip Bonder Sales (2018-2023)
2.2 Global Top Players by Flip Chip Bonder Revenue (2018-2023)
2.3 Global Top Players by Flip Chip Bonder Price (2018-2023)
2.4 Global Top Manufacturers Flip Chip Bonder Manufacturing Base Distribution, Sales Area, Product Type
2.5 Flip Chip Bonder Market Competitive Situation and Trends
2.5.1 Flip Chip Bonder Market Concentration Rate (2018-2023)
2.5.2 Global 5 and 10 Largest Manufacturers by Flip Chip Bonder Sales and Revenue in 2022
2.6 Global Top Manufacturers by Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Bonder as of 2022)
2.7 Date of Key Manufacturers Enter into Flip Chip Bonder Market
2.8 Key Manufacturers Flip Chip Bonder Product Offered
2.9 Mergers & Acquisitions, Expansion
3 Flip Chip Bonder Status and Outlook by Region
3.1 Global Flip Chip Bonder Market Size and CAGR by Region: 2018 VS 2022 VS 2029
3.2 Global Flip Chip Bonder Historic Market Size by Region
3.2.1 Global Flip Chip Bonder Sales in Volume by Region (2018-2023)
3.2.2 Global Flip Chip Bonder Sales in Value by Region (2018-2023)
3.2.3 Global Flip Chip Bonder Sales (Volume & Value) Price and Gross Margin (2018-2023)
3.3 Global Flip Chip Bonder Forecasted Market Size by Region
3.3.1 Global Flip Chip Bonder Sales in Volume by Region (2024-2029)
3.3.2 Global Flip Chip Bonder Sales in Value by Region (2024-2029)
3.3.3 Global Flip Chip Bonder Sales (Volume & Value), Price and Gross Margin (2024-2029)
4 Global Flip Chip Bonder by Application
4.1 Flip Chip Bonder Market Segment by Application
4.1.1 IDMs
4.1.2 OSAT
4.2 Global Flip Chip Bonder Market Size by Application
4.2.1 Global Flip Chip Bonder Market Size Overview by Application (2018-2029)
4.2.2 Global Flip Chip Bonder Historic Market Size Review by Application (2018-2023)
4.2.3 Global Flip Chip Bonder Forecasted Market Size by Application (2024-2029)
4.3 Key Regions Market Size Segment by Application
4.3.1 North America Flip Chip Bonder Sales Breakdown by Application (2018-2023)
4.3.2 Europe Flip Chip Bonder Sales Breakdown by Application (2018-2023)
4.3.3 Asia-Pacific Flip Chip Bonder Sales Breakdown by Application (2018-2023)
4.3.4 Latin America Flip Chip Bonder Sales Breakdown by Application (2018-2023)
4.3.5 Middle East and Africa Flip Chip Bonder Sales Breakdown by Application (2018-2023)
5 North America Flip Chip Bonder by Country
5.1 North America Flip Chip Bonder Historic Market Size by Country
5.1.1 North America Flip Chip Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
5.1.2 North America Flip Chip Bonder Sales in Volume by Country (2018-2023)
5.1.3 North America Flip Chip Bonder Sales in Value by Country (2018-2023)
5.2 North America Flip Chip Bonder Forecasted Market Size by Country
5.2.1 North America Flip Chip Bonder Sales in Volume by Country (2024-2029)
5.2.2 North America Flip Chip Bonder Sales in Value by Country (2024-2029)
6 Europe Flip Chip Bonder by Country
6.1 Europe Flip Chip Bonder Historic Market Size by Country
6.1.1 Europe Flip Chip Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
6.1.2 Europe Flip Chip Bonder Sales in Volume by Country (2018-2023)
6.1.3 Europe Flip Chip Bonder Sales in Value by Country (2018-2023)
6.2 Europe Flip Chip Bonder Forecasted Market Size by Country
6.2.1 Europe Flip Chip Bonder Sales in Volume by Country (2024-2029)
6.2.2 Europe Flip Chip Bonder Sales in Value by Country (2024-2029)
7 Asia-Pacific Flip Chip Bonder by Region
7.1 Asia-Pacific Flip Chip Bonder Historic Market Size by Region
7.1.1 Asia-Pacific Flip Chip Bonder Market Size Growth Rate (CAGR) by Region: 2018 VS 2022 VS 2029
7.1.2 Asia-Pacific Flip Chip Bonder Sales in Volume by Region (2018-2023)
7.1.3 Asia-Pacific Flip Chip Bonder Sales in Value by Region (2018-2023)
7.2 Asia-Pacific Flip Chip Bonder Forecasted Market Size by Region
7.2.1 Asia-Pacific Flip Chip Bonder Sales in Volume by Region (2024-2029)
7.2.2 Asia-Pacific Flip Chip Bonder Sales in Value by Region (2024-2029)
8 Latin America Flip Chip Bonder by Country
8.1 Latin America Flip Chip Bonder Historic Market Size by Country
8.1.1 Latin America Flip Chip Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
8.1.2 Latin America Flip Chip Bonder Sales in Volume by Country (2018-2023)
8.1.3 Latin America Flip Chip Bonder Sales in Value by Country (2018-2023)
8.2 Latin America Flip Chip Bonder Forecasted Market Size by Country
8.2.1 Latin America Flip Chip Bonder Sales in Volume by Country (2024-2029)
8.2.2 Latin America Flip Chip Bonder Sales in Value by Country (2024-2029)
9 Middle East and Africa Flip Chip Bonder by Country
9.1 Middle East and Africa Flip Chip Bonder Historic Market Size by Country
9.1.1 Middle East and Africa Flip Chip Bonder Market Size Growth Rate (CAGR) by Country: 2018 VS 2022 VS 2029
9.1.2 Middle East and Africa Flip Chip Bonder Sales in Volume by Country (2018-2023)
9.1.3 Middle East and Africa Flip Chip Bonder Sales in Value by Country (2018-2023)
9.2 Middle East and Africa Flip Chip Bonder Forecasted Market Size by Country
9.2.1 Middle East and Africa Flip Chip Bonder Sales in Volume by Country (2024-2029)
9.2.2 Middle East and Africa Flip Chip Bonder Sales in Value by Country (2024-2029)
10 Company Profiles
10.1 BESI
10.1.1 BESI Company Information
10.1.2 BESI Introduction and Business Overview
10.1.3 BESI Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.1.4 BESI Flip Chip Bonder Products Offered
10.1.5 BESI Recent Development
10.2 ASMPT
10.2.1 ASMPT Company Information
10.2.2 ASMPT Introduction and Business Overview
10.2.3 ASMPT Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.2.4 ASMPT Flip Chip Bonder Products Offered
10.2.5 ASMPT Recent Development
10.3 Shibaura
10.3.1 Shibaura Company Information
10.3.2 Shibaura Introduction and Business Overview
10.3.3 Shibaura Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.3.4 Shibaura Flip Chip Bonder Products Offered
10.3.5 Shibaura Recent Development
10.4 Muehlbauer
10.4.1 Muehlbauer Company Information
10.4.2 Muehlbauer Introduction and Business Overview
10.4.3 Muehlbauer Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.4.4 Muehlbauer Flip Chip Bonder Products Offered
10.4.5 Muehlbauer Recent Development
10.5 K&S
10.5.1 K&S Company Information
10.5.2 K&S Introduction and Business Overview
10.5.3 K&S Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.5.4 K&S Flip Chip Bonder Products Offered
10.5.5 K&S Recent Development
10.6 Hamni
10.6.1 Hamni Company Information
10.6.2 Hamni Introduction and Business Overview
10.6.3 Hamni Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.6.4 Hamni Flip Chip Bonder Products Offered
10.6.5 Hamni Recent Development
10.7 AMICRA Microtechnologies
10.7.1 AMICRA Microtechnologies Company Information
10.7.2 AMICRA Microtechnologies Introduction and Business Overview
10.7.3 AMICRA Microtechnologies Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.7.4 AMICRA Microtechnologies Flip Chip Bonder Products Offered
10.7.5 AMICRA Microtechnologies Recent Development
10.8 SET
10.8.1 SET Company Information
10.8.2 SET Introduction and Business Overview
10.8.3 SET Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.8.4 SET Flip Chip Bonder Products Offered
10.8.5 SET Recent Development
10.9 Athlete FA
10.9.1 Athlete FA Company Information
10.9.2 Athlete FA Introduction and Business Overview
10.9.3 Athlete FA Flip Chip Bonder Sales, Revenue and Gross Margin (2018-2023)
10.9.4 Athlete FA Flip Chip Bonder Products Offered
10.9.5 Athlete FA Recent Development
11 Upstream, Opportunities, Challenges, Risks and Influences Factors Analysis
11.1 Flip Chip Bonder Key Raw Materials
11.1.1 Key Raw Materials
11.1.2 Key Raw Materials Price
11.1.3 Raw Materials Key Suppliers
11.2 Manufacturing Cost Structure
11.2.1 Raw Materials
11.2.2 Labor Cost
11.2.3 Manufacturing Expenses
11.3 Flip Chip Bonder Industrial Chain Analysis
11.4 Flip Chip Bonder Market Dynamics
11.4.1 Flip Chip Bonder Industry Trends
11.4.2 Flip Chip Bonder Market Drivers
11.4.3 Flip Chip Bonder Market Challenges
11.4.4 Flip Chip Bonder Market Restraints
12 Market Strategy Analysis, Distributors
12.1 Sales Channel
12.2 Flip Chip Bonder Distributors
12.3 Flip Chip Bonder Downstream Customers
13 Research Findings and Conclusion
14 Appendix
14.1 Research Methodology
14.1.1 Methodology/Research Approach
14.1.2 Data Source
14.2 Author Details
14.3 Disclaimer
Published By : QY Research
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