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Global Automated Wafer Bonder Market Research Report 2025
Synopsis
Global Automated Wafer Bonder market is projected to reach US$ 241.9 million in 2029, increasing from US$ 150 million in 2022, with the CAGR of 7.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Automated Wafer Bonder market research.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Automated Wafer Bonder market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
SUSS MicroTec Group
EV Group
Dymek Company Ltd
Dynatex International
Hutem
Kanematsu PWS Ltd
AML
Mitsubishi
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Shanghai Micro Electronics
U-Precision Tech
Canon
Bondtech
TAZMO
TOK
Segment by Type
200 mm
300 mm
Segment by Application
Packaging
MEMS
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Automated Wafer Bonder report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Global Automated Wafer Bonder market is projected to reach US$ 241.9 million in 2029, increasing from US$ 150 million in 2022, with the CAGR of 7.7% during the period of 2023 to 2029. Influencing issues, such as economy environments, COVID-19 and Russia-Ukraine War, have led to great market fluctuations in the past few years and are considered comprehensively in the whole Automated Wafer Bonder market research.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
Report Scope
This report, based on historical analysis (2018-2022) and forecast calculation (2023-2029), aims to help readers to get a comprehensive understanding of global Automated Wafer Bonder market with multiple angles, which provides sufficient supports to readers’ strategy and decision making.
By Company
SUSS MicroTec Group
EV Group
Dymek Company Ltd
Dynatex International
Hutem
Kanematsu PWS Ltd
AML
Mitsubishi
Tokyo Electron
Applied Microengineering
Nidec Machinetool
Shanghai Micro Electronics
U-Precision Tech
Canon
Bondtech
TAZMO
TOK
Segment by Type
200 mm
300 mm
Segment by Application
Packaging
MEMS
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
Taiwan
Indonesia
Thailand
Malaysia
Philippines
Vietnam
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
The Automated Wafer Bonder report covers below items:
Chapter 1: Product Basic Information (Definition, Type and Application)
Chapter 2: Manufacturers’ Competition Patterns
Chapter 3: Production Region Distribution and Analysis
Chapter 4: Country Level Sales Analysis
Chapter 5: Product Type Analysis
Chapter 6: Product Application Analysis
Chapter 7: Manufacturers’ Outline
Chapter 8: Industry Chain, Market Channel and Customer Analysis
Chapter 9: Market Opportunities and Challenges
Chapter 10: Market Conclusions
Chapter 11: Research Methodology and Data Source
Index1 Automated Wafer Bonder Market Overview
1.1 Product Definition
1.2 Automated Wafer Bonder Segment by Type
1.2.1 Global Automated Wafer Bonder Market Value Growth Rate Analysis by Type 2022 VS 2029
1.2.2 200 mm
1.2.3 300 mm
1.3 Automated Wafer Bonder Segment by Application
1.3.1 Global Automated Wafer Bonder Market Value Growth Rate Analysis by Application: 2022 VS 2029
1.3.2 Packaging
1.3.3 MEMS
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Automated Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
1.4.2 Global Automated Wafer Bonder Production Capacity Estimates and Forecasts (2018-2029)
1.4.3 Global Automated Wafer Bonder Production Estimates and Forecasts (2018-2029)
1.4.4 Global Automated Wafer Bonder Market Average Price Estimates and Forecasts (2018-2029)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Automated Wafer Bonder Production Market Share by Manufacturers (2018-2023)
2.2 Global Automated Wafer Bonder Production Value Market Share by Manufacturers (2018-2023)
2.3 Global Key Players of Automated Wafer Bonder, Industry Ranking, 2021 VS 2022 VS 2023
2.4 Global Automated Wafer Bonder Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Automated Wafer Bonder Average Price by Manufacturers (2018-2023)
2.6 Global Key Manufacturers of Automated Wafer Bonder, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Automated Wafer Bonder, Product Offered and Application
2.8 Global Key Manufacturers of Automated Wafer Bonder, Date of Enter into This Industry
2.9 Automated Wafer Bonder Market Competitive Situation and Trends
2.9.1 Automated Wafer Bonder Market Concentration Rate
2.9.2 Global 5 and 10 Largest Automated Wafer Bonder Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Automated Wafer Bonder Production by Region
3.1 Global Automated Wafer Bonder Production Value Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.2 Global Automated Wafer Bonder Production Value by Region (2018-2029)
3.2.1 Global Automated Wafer Bonder Production Value Market Share by Region (2018-2023)
3.2.2 Global Forecasted Production Value of Automated Wafer Bonder by Region (2024-2029)
3.3 Global Automated Wafer Bonder Production Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
3.4 Global Automated Wafer Bonder Production by Region (2018-2029)
3.4.1 Global Automated Wafer Bonder Production Market Share by Region (2018-2023)
3.4.2 Global Forecasted Production of Automated Wafer Bonder by Region (2024-2029)
3.5 Global Automated Wafer Bonder Market Price Analysis by Region (2018-2023)
3.6 Global Automated Wafer Bonder Production and Value, Year-over-Year Growth
3.6.1 North America Automated Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.2 Europe Automated Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.3 China Automated Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
3.6.4 Japan Automated Wafer Bonder Production Value Estimates and Forecasts (2018-2029)
4 Automated Wafer Bonder Consumption by Region
4.1 Global Automated Wafer Bonder Consumption Estimates and Forecasts by Region: 2018 VS 2022 VS 2029
4.2 Global Automated Wafer Bonder Consumption by Region (2018-2029)
4.2.1 Global Automated Wafer Bonder Consumption by Region (2018-2023)
4.2.2 Global Automated Wafer Bonder Forecasted Consumption by Region (2024-2029)
4.3 North America
4.3.1 North America Automated Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.3.2 North America Automated Wafer Bonder Consumption by Country (2018-2029)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Automated Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.4.2 Europe Automated Wafer Bonder Consumption by Country (2018-2029)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Automated Wafer Bonder Consumption Growth Rate by Region: 2018 VS 2022 VS 2029
4.5.2 Asia Pacific Automated Wafer Bonder Consumption by Region (2018-2029)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Automated Wafer Bonder Consumption Growth Rate by Country: 2018 VS 2022 VS 2029
4.6.2 Latin America, Middle East & Africa Automated Wafer Bonder Consumption by Country (2018-2029)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Automated Wafer Bonder Production by Type (2018-2029)
5.1.1 Global Automated Wafer Bonder Production by Type (2018-2023)
5.1.2 Global Automated Wafer Bonder Production by Type (2024-2029)
5.1.3 Global Automated Wafer Bonder Production Market Share by Type (2018-2029)
5.2 Global Automated Wafer Bonder Production Value by Type (2018-2029)
5.2.1 Global Automated Wafer Bonder Production Value by Type (2018-2023)
5.2.2 Global Automated Wafer Bonder Production Value by Type (2024-2029)
5.2.3 Global Automated Wafer Bonder Production Value Market Share by Type (2018-2029)
5.3 Global Automated Wafer Bonder Price by Type (2018-2029)
6 Segment by Application
6.1 Global Automated Wafer Bonder Production by Application (2018-2029)
6.1.1 Global Automated Wafer Bonder Production by Application (2018-2023)
6.1.2 Global Automated Wafer Bonder Production by Application (2024-2029)
6.1.3 Global Automated Wafer Bonder Production Market Share by Application (2018-2029)
6.2 Global Automated Wafer Bonder Production Value by Application (2018-2029)
6.2.1 Global Automated Wafer Bonder Production Value by Application (2018-2023)
6.2.2 Global Automated Wafer Bonder Production Value by Application (2024-2029)
6.2.3 Global Automated Wafer Bonder Production Value Market Share by Application (2018-2029)
6.3 Global Automated Wafer Bonder Price by Application (2018-2029)
7 Key Companies Profiled
7.1 SUSS MicroTec Group
7.1.1 SUSS MicroTec Group Automated Wafer Bonder Corporation Information
7.1.2 SUSS MicroTec Group Automated Wafer Bonder Product Portfolio
7.1.3 SUSS MicroTec Group Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.1.4 SUSS MicroTec Group Main Business and Markets Served
7.1.5 SUSS MicroTec Group Recent Developments/Updates
7.2 EV Group
7.2.1 EV Group Automated Wafer Bonder Corporation Information
7.2.2 EV Group Automated Wafer Bonder Product Portfolio
7.2.3 EV Group Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.2.4 EV Group Main Business and Markets Served
7.2.5 EV Group Recent Developments/Updates
7.3 Dymek Company Ltd
7.3.1 Dymek Company Ltd Automated Wafer Bonder Corporation Information
7.3.2 Dymek Company Ltd Automated Wafer Bonder Product Portfolio
7.3.3 Dymek Company Ltd Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.3.4 Dymek Company Ltd Main Business and Markets Served
7.3.5 Dymek Company Ltd Recent Developments/Updates
7.4 Dynatex International
7.4.1 Dynatex International Automated Wafer Bonder Corporation Information
7.4.2 Dynatex International Automated Wafer Bonder Product Portfolio
7.4.3 Dynatex International Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.4.4 Dynatex International Main Business and Markets Served
7.4.5 Dynatex International Recent Developments/Updates
7.5 Hutem
7.5.1 Hutem Automated Wafer Bonder Corporation Information
7.5.2 Hutem Automated Wafer Bonder Product Portfolio
7.5.3 Hutem Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.5.4 Hutem Main Business and Markets Served
7.5.5 Hutem Recent Developments/Updates
7.6 Kanematsu PWS Ltd
7.6.1 Kanematsu PWS Ltd Automated Wafer Bonder Corporation Information
7.6.2 Kanematsu PWS Ltd Automated Wafer Bonder Product Portfolio
7.6.3 Kanematsu PWS Ltd Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.6.4 Kanematsu PWS Ltd Main Business and Markets Served
7.6.5 Kanematsu PWS Ltd Recent Developments/Updates
7.7 AML
7.7.1 AML Automated Wafer Bonder Corporation Information
7.7.2 AML Automated Wafer Bonder Product Portfolio
7.7.3 AML Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.7.4 AML Main Business and Markets Served
7.7.5 AML Recent Developments/Updates
7.8 Mitsubishi
7.8.1 Mitsubishi Automated Wafer Bonder Corporation Information
7.8.2 Mitsubishi Automated Wafer Bonder Product Portfolio
7.8.3 Mitsubishi Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.8.4 Mitsubishi Main Business and Markets Served
7.7.5 Mitsubishi Recent Developments/Updates
7.9 Tokyo Electron
7.9.1 Tokyo Electron Automated Wafer Bonder Corporation Information
7.9.2 Tokyo Electron Automated Wafer Bonder Product Portfolio
7.9.3 Tokyo Electron Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.9.4 Tokyo Electron Main Business and Markets Served
7.9.5 Tokyo Electron Recent Developments/Updates
7.10 Applied Microengineering
7.10.1 Applied Microengineering Automated Wafer Bonder Corporation Information
7.10.2 Applied Microengineering Automated Wafer Bonder Product Portfolio
7.10.3 Applied Microengineering Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.10.4 Applied Microengineering Main Business and Markets Served
7.10.5 Applied Microengineering Recent Developments/Updates
7.11 Nidec Machinetool
7.11.1 Nidec Machinetool Automated Wafer Bonder Corporation Information
7.11.2 Nidec Machinetool Automated Wafer Bonder Product Portfolio
7.11.3 Nidec Machinetool Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.11.4 Nidec Machinetool Main Business and Markets Served
7.11.5 Nidec Machinetool Recent Developments/Updates
7.12 Shanghai Micro Electronics
7.12.1 Shanghai Micro Electronics Automated Wafer Bonder Corporation Information
7.12.2 Shanghai Micro Electronics Automated Wafer Bonder Product Portfolio
7.12.3 Shanghai Micro Electronics Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.12.4 Shanghai Micro Electronics Main Business and Markets Served
7.12.5 Shanghai Micro Electronics Recent Developments/Updates
7.13 U-Precision Tech
7.13.1 U-Precision Tech Automated Wafer Bonder Corporation Information
7.13.2 U-Precision Tech Automated Wafer Bonder Product Portfolio
7.13.3 U-Precision Tech Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.13.4 U-Precision Tech Main Business and Markets Served
7.13.5 U-Precision Tech Recent Developments/Updates
7.14 Canon
7.14.1 Canon Automated Wafer Bonder Corporation Information
7.14.2 Canon Automated Wafer Bonder Product Portfolio
7.14.3 Canon Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.14.4 Canon Main Business and Markets Served
7.14.5 Canon Recent Developments/Updates
7.15 Bondtech
7.15.1 Bondtech Automated Wafer Bonder Corporation Information
7.15.2 Bondtech Automated Wafer Bonder Product Portfolio
7.15.3 Bondtech Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.15.4 Bondtech Main Business and Markets Served
7.15.5 Bondtech Recent Developments/Updates
7.16 TAZMO
7.16.1 TAZMO Automated Wafer Bonder Corporation Information
7.16.2 TAZMO Automated Wafer Bonder Product Portfolio
7.16.3 TAZMO Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.16.4 TAZMO Main Business and Markets Served
7.16.5 TAZMO Recent Developments/Updates
7.17 TOK
7.17.1 TOK Automated Wafer Bonder Corporation Information
7.17.2 TOK Automated Wafer Bonder Product Portfolio
7.17.3 TOK Automated Wafer Bonder Production, Value, Price and Gross Margin (2018-2023)
7.17.4 TOK Main Business and Markets Served
7.17.5 TOK Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Automated Wafer Bonder Industry Chain Analysis
8.2 Automated Wafer Bonder Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Automated Wafer Bonder Production Mode & Process
8.4 Automated Wafer Bonder Sales and Marketing
8.4.1 Automated Wafer Bonder Sales Channels
8.4.2 Automated Wafer Bonder Distributors
8.5 Automated Wafer Bonder Customers
9 Automated Wafer Bonder Market Dynamics
9.1 Automated Wafer Bonder Industry Trends
9.2 Automated Wafer Bonder Market Drivers
9.3 Automated Wafer Bonder Market Challenges
9.4 Automated Wafer Bonder Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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