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Synopsis
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Market Analysis and Insights: Global Flip Chip Bonder Market
The global Flip Chip Bonder market was valued at US$ 287 million in 2020 and it is expected to reach US$ 311.5 million by the end of 2027, growing at a CAGR of 1.2% during 2021-2027.
Global Flip Chip Bonder Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Flip Chip Bonder Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
IDMs
OSAT
By Company
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Production by Region
North America
Europe
China
Japan
South Korea
Singapore
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Flip chip is a method used for components or devices that can be bonded directly onto a substrate, board or carrier face-down. The connection is made through conductive bumps placed on the surface of the die. The placing process amounts to the following:
1. Die is picked up and place on a "flipping device"
2. Die is "flipped" and moved to hover over the substrate (or board or carrier) where bumps reside - precisely positioned in their previously defined positions
3. The tool then places the die on the bump with a programmed amount of force
Flip chip bumping is a vital step to the process. The bump provides the necessary electrical connection between the die and the substrate, provides thermal conduction through the two materials, acts as a "spacer" to prevent electrical shorts and provides mechanical support.
Flip chips avoid wire bonding and therefore are able to be much smaller than their counterparts. Flip chip processes have been around for more than 40 years. Since then, thousands of applications have taken advantage of the size and cost benefits enabled by the flip chip assembly method.
Global Flip Chip Bonder key players include Besi, ASM Pacific Technology, Shibaura, Kulicke & Soffa, etc. Global top four manufacturers hold a share nearly 70%.
China is the largest market, with a share about 25%, followed by United States, and Taiwan, both have a share about 30 percent.
In terms of product, Fully Automatic is the largest segment, with a share over 75%. And in terms of application, the largest application is IDMs, followed by OSAT.
Market Analysis and Insights: Global Flip Chip Bonder Market
The global Flip Chip Bonder market was valued at US$ 287 million in 2020 and it is expected to reach US$ 311.5 million by the end of 2027, growing at a CAGR of 1.2% during 2021-2027.
Global Flip Chip Bonder Market: Drivers and Restrains
The research report has incorporated the analysis of different factors that augment the market’s growth. It constitutes trends, restraints, and drivers that transform the market in either a positive or negative manner. This section also provides the scope of different segments and applications that can potentially influence the market in the future. The detailed information is based on current trends and historic milestones. This section also provides an analysis of the volume of production about the global market and about each type from 2016 to 2027. This section mentions the volume of production by region from 2016 to 2027. Pricing analysis is included in the report according to each type from the year 2016 to 2027, manufacturer from 2016 to 2021, region from 2016 to 2021, and global price from 2016 to 2027.
A thorough evaluation of the restrains included in the report portrays the contrast to drivers and gives room for strategic planning. Factors that overshadow the market growth are pivotal as they can be understood to devise different bends for getting hold of the lucrative opportunities that are present in the ever-growing market. Additionally, insights into market expert’s opinions have been taken to understand the market better.
Global Flip Chip Bonder Market: Segment Analysis
The research report includes specific segments by region (country), by manufacturers, by Type and by Application. Each type provides information about the production during the forecast period of 2016 to 2027. by Application segment also provides consumption during the forecast period of 2016 to 2027. Understanding the segments helps in identifying the importance of different factors that aid the market growth.
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
IDMs
OSAT
By Company
BESI
ASMPT
Shibaura
Muehlbauer
K&S
Hamni
AMICRA Microtechnologies
SET
Athlete FA
Production by Region
North America
Europe
China
Japan
South Korea
Singapore
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
India
Australia
China Taiwan
Indonesia
Thailand
Malaysia
Latin America
Mexico
Brazil
Argentina
Middle East & Africa
Turkey
Saudi Arabia
UAE
Index1 Flip Chip Bonder Market Overview
1.1 Product Overview and Scope of Flip Chip Bonder
1.2 Flip Chip Bonder Segment by Type
1.2.1 Global Flip Chip Bonder Market Size Growth Rate Analysis by Type 2021 VS 2027
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Flip Chip Bonder Segment by Application
1.3.1 Global Flip Chip Bonder Consumption Comparison by Application: 2016 VS 2021 VS 2027
1.3.2 IDMs
1.3.3 OSAT
1.4 Global Market Growth Prospects
1.4.1 Global Flip Chip Bonder Revenue Estimates and Forecasts (2016-2027)
1.4.2 Global Flip Chip Bonder Production Estimates and Forecasts (2016-2027)
1.5 Global Market Size by Region
1.5.1 Global Flip Chip Bonder Market Size Estimates and Forecasts by Region: 2016 VS 2021 VS 2027
1.5.2 North America Flip Chip Bonder Estimates and Forecasts (2016-2027)
1.5.3 Europe Flip Chip Bonder Estimates and Forecasts (2016-2027)
1.5.4 China Flip Chip Bonder Estimates and Forecasts (2016-2027)
1.5.5 Japan Flip Chip Bonder Estimates and Forecasts (2016-2027)
1.5.6 South Korea Flip Chip Bonder Estimates and Forecasts (2016-2027)
1.5.7 Singapore Flip Chip Bonder Estimates and Forecasts (2016-2027)
2 Market Competition by Manufacturers
2.1 Global Flip Chip Bonder Production Market Share by Manufacturers (2016-2021)
2.2 Global Flip Chip Bonder Revenue Market Share by Manufacturers (2016-2021)
2.3 Flip Chip Bonder Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.4 Global Flip Chip Bonder Average Price by Manufacturers (2016-2021)
2.5 Manufacturers Flip Chip Bonder Production Sites, Area Served, Product Types
2.6 Flip Chip Bonder Market Competitive Situation and Trends
2.6.1 Flip Chip Bonder Market Concentration Rate
2.6.2 Global 5 and 10 Largest Flip Chip Bonder Players Market Share by Revenue
2.6.3 Mergers & Acquisitions, Expansion
3 Production and Capacity by Region
3.1 Global Production of Flip Chip Bonder Market Share by Region (2016-2021)
3.2 Global Flip Chip Bonder Revenue Market Share by Region (2016-2021)
3.3 Global Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.4 North America Flip Chip Bonder Production
3.4.1 North America Flip Chip Bonder Production Growth Rate (2016-2021)
3.4.2 North America Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.5 Europe Flip Chip Bonder Production
3.5.1 Europe Flip Chip Bonder Production Growth Rate (2016-2021)
3.5.2 Europe Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.6 China Flip Chip Bonder Production
3.6.1 China Flip Chip Bonder Production Growth Rate (2016-2021)
3.6.2 China Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.7 Japan Flip Chip Bonder Production
3.7.1 Japan Flip Chip Bonder Production Growth Rate (2016-2021)
3.7.2 Japan Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.8 South Korea Flip Chip Bonder Production
3.8.1 South Korea Flip Chip Bonder Production Growth Rate (2016-2021)
3.8.2 South Korea Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
3.9 Singapore Flip Chip Bonder Production
3.9.1 Singapore Flip Chip Bonder Production Growth Rate (2016-2021)
3.9.2 Singapore Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
4 Global Flip Chip Bonder Consumption by Region
4.1 Global Flip Chip Bonder Consumption by Region
4.1.1 Global Flip Chip Bonder Consumption by Region
4.1.2 Global Flip Chip Bonder Consumption Market Share by Region
4.2 North America
4.2.1 North America Flip Chip Bonder Consumption by Country
4.2.2 U.S.
4.2.3 Canada
4.3 Europe
4.3.1 Europe Flip Chip Bonder Consumption by Country
4.3.2 Germany
4.3.3 France
4.3.4 U.K.
4.3.5 Italy
4.3.6 Russia
4.4 Asia Pacific
4.4.1 Asia Pacific Flip Chip Bonder Consumption by Region
4.4.2 China
4.4.3 Japan
4.4.4 South Korea
4.4.5 Taiwan
4.4.6 Southeast Asia
4.4.7 India
4.4.8 Australia
4.5 Latin America
4.5.1 Latin America Flip Chip Bonder Consumption by Country
4.5.2 Mexico
4.5.3 Brazil
5 Production, Revenue, Price Trend by Type
5.1 Global Flip Chip Bonder Production Market Share by Type (2016-2021)
5.2 Global Flip Chip Bonder Revenue Market Share by Type (2016-2021)
5.3 Global Flip Chip Bonder Price by Type (2016-2021)
6 Consumption Analysis by Application
6.1 Global Flip Chip Bonder Consumption Market Share by Application (2016-2021)
6.2 Global Flip Chip Bonder Consumption Growth Rate by Application (2016-2021)
7 Key Companies Profiled
7.1 BESI
7.1.1 BESI Flip Chip Bonder Corporation Information
7.1.2 BESI Flip Chip Bonder Product Portfolio
7.1.3 BESI Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.1.4 BESI Main Business and Markets Served
7.1.5 BESI Recent Developments/Updates
7.2 ASMPT
7.2.1 ASMPT Flip Chip Bonder Corporation Information
7.2.2 ASMPT Flip Chip Bonder Product Portfolio
7.2.3 ASMPT Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.2.4 ASMPT Main Business and Markets Served
7.2.5 ASMPT Recent Developments/Updates
7.3 Shibaura
7.3.1 Shibaura Flip Chip Bonder Corporation Information
7.3.2 Shibaura Flip Chip Bonder Product Portfolio
7.3.3 Shibaura Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.3.4 Shibaura Main Business and Markets Served
7.3.5 Shibaura Recent Developments/Updates
7.4 Muehlbauer
7.4.1 Muehlbauer Flip Chip Bonder Corporation Information
7.4.2 Muehlbauer Flip Chip Bonder Product Portfolio
7.4.3 Muehlbauer Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.4.4 Muehlbauer Main Business and Markets Served
7.4.5 Muehlbauer Recent Developments/Updates
7.5 K&S
7.5.1 K&S Flip Chip Bonder Corporation Information
7.5.2 K&S Flip Chip Bonder Product Portfolio
7.5.3 K&S Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.5.4 K&S Main Business and Markets Served
7.5.5 K&S Recent Developments/Updates
7.6 Hamni
7.6.1 Hamni Flip Chip Bonder Corporation Information
7.6.2 Hamni Flip Chip Bonder Product Portfolio
7.6.3 Hamni Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.6.4 Hamni Main Business and Markets Served
7.6.5 Hamni Recent Developments/Updates
7.7 AMICRA Microtechnologies
7.7.1 AMICRA Microtechnologies Flip Chip Bonder Corporation Information
7.7.2 AMICRA Microtechnologies Flip Chip Bonder Product Portfolio
7.7.3 AMICRA Microtechnologies Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.7.4 AMICRA Microtechnologies Main Business and Markets Served
7.7.5 AMICRA Microtechnologies Recent Developments/Updates
7.8 SET
7.8.1 SET Flip Chip Bonder Corporation Information
7.8.2 SET Flip Chip Bonder Product Portfolio
7.8.3 SET Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.8.4 SET Main Business and Markets Served
7.7.5 SET Recent Developments/Updates
7.9 Athlete FA
7.9.1 Athlete FA Flip Chip Bonder Corporation Information
7.9.2 Athlete FA Flip Chip Bonder Product Portfolio
7.9.3 Athlete FA Flip Chip Bonder Production, Revenue, Price and Gross Margin (2016-2021)
7.9.4 Athlete FA Main Business and Markets Served
7.9.5 Athlete FA Recent Developments/Updates
8 Flip Chip Bonder Manufacturing Cost Analysis
8.1 Flip Chip Bonder Key Raw Materials Analysis
8.1.1 Key Raw Materials
8.1.2 Key Raw Materials Price Trend
8.1.3 Key Suppliers of Raw Materials
8.2 Proportion of Manufacturing Cost Structure
8.3 Manufacturing Process Analysis of Flip Chip Bonder
8.4 Flip Chip Bonder Industrial Chain Analysis
9 Marketing Channel, Distributors and Customers
9.1 Marketing Channel
9.2 Flip Chip Bonder Distributors List
9.3 Flip Chip Bonder Customers
10 Market Dynamics
10.1 Flip Chip Bonder Industry Trends
10.2 Flip Chip Bonder Growth Drivers
10.3 Flip Chip Bonder Market Challenges
10.4 Flip Chip Bonder Market Restraints
11 Production and Supply Forecast
11.1 Global Forecasted Production of Flip Chip Bonder by Region (2022-2027)
11.2 North America Flip Chip Bonder Production, Revenue Forecast (2022-2027)
11.3 Europe Flip Chip Bonder Production, Revenue Forecast (2022-2027)
11.4 China Flip Chip Bonder Production, Revenue Forecast (2022-2027)
11.5 Japan Flip Chip Bonder Production, Revenue Forecast (2022-2027)
11.6 South Korea Flip Chip Bonder Production, Revenue Forecast (2022-2027)
11.7 Singapore Flip Chip Bonder Production, Revenue Forecast (2022-2027)
12 Consumption and Demand Forecast
12.1 Global Forecasted Demand Analysis of Flip Chip Bonder
12.2 North America Forecasted Consumption of Flip Chip Bonder by Country
12.3 Europe Market Forecasted Consumption of Flip Chip Bonder by Country
12.4 Asia Pacific Market Forecasted Consumption of Flip Chip Bonder by Region
12.5 Latin America Forecasted Consumption of Flip Chip Bonder by Country
13 Forecast by Type and by Application (2022-2027)
13.1 Global Production, Revenue and Price Forecast by Type (2022-2027)
13.1.1 Global Forecasted Production of Flip Chip Bonder by Type (2022-2027)
13.1.2 Global Forecasted Revenue of Flip Chip Bonder by Type (2022-2027)
13.1.3 Global Forecasted Price of Flip Chip Bonder by Type (2022-2027)
13.2 Global Forecasted Consumption of Flip Chip Bonder by Application (2022-2027)
14 Research Finding and Conclusion
15 Methodology and Data Source
15.1 Methodology/Research Approach
15.1.1 Research Programs/Design
15.1.2 Market Size Estimation
15.1.3 Market Breakdown and Data Triangulation
15.2 Data Source
15.2.1 Secondary Sources
15.2.2 Primary Sources
15.3 Author List
15.4 Disclaimer
List of TablesList of Tables
Table 1. Global Flip Chip Bonder Market Size by Type (Units) & (US$ Million) (2021 VS 2027)
Table 2. Global Flip Chip Bonder Consumption (Units) Comparison by Application: 2016 VS 2021 VS 2027
Table 3. Flip Chip Bonder Market Size Comparison by Region: 2016 VS 2021 VS 2027
Table 4. Global Flip Chip Bonder Production (Units) by Manufacturers
Table 5. Global Flip Chip Bonder Production (Units) by Manufacturers (2016-2021)
Table 6. Global Flip Chip Bonder Production Market Share by Manufacturers (2016-2021)
Table 7. Global Flip Chip Bonder Revenue (US$ Million) by Manufacturers (2016-2021)
Table 8. Global Flip Chip Bonder Revenue Share by Manufacturers (2016-2021)
Table 9. Company Type (Tier 1, Tier 2 and Tier 3) & (based on the Revenue in Flip Chip Bonder as of 2020)
Table 10. Global Market Flip Chip Bonder Average Price (K USD/Unit) of Key Manufacturers (2016-2021)
Table 11. Manufacturers Flip Chip Bonder Production Sites and Area Served
Table 12. Manufacturers Flip Chip Bonder Product Types
Table 13. Mergers & Acquisitions, Expansion
Table 14. Global Flip Chip Bonder Production (Units) by Region (2016-2021)
Table 15. Global Flip Chip Bonder Revenue (US$ Million) by Region (2016-2021)
Table 16. Global Flip Chip Bonder Revenue Market Share by Region (2016-2021)
Table 17. Global Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 18. North America Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 19. Europe Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 20. China Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 21. Japan Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 22. South Korea Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 23. Singapore Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 24. Global Flip Chip Bonder Consumption Market by Region (2016-2021) & (Units)
Table 25. Global Flip Chip Bonder Consumption Market Share by Region (2016-2021)
Table 26. North America Flip Chip Bonder Consumption by Country (2016-2021) & (Units)
Table 27. Europe Flip Chip Bonder Consumption by Country (2016-2021) & (Units)
Table 28. Asia Pacific Flip Chip Bonder Consumption by Region (2016-2021) & (Units)
Table 29. Latin America Flip Chip Bonder Consumption by Countries (2016-2021) & (Units)
Table 30. Global Flip Chip Bonder Production (Units) by Type (2016-2021)
Table 31. Global Flip Chip Bonder Production Market Share by Type (2016-2021)
Table 32. Global Flip Chip Bonder Revenue (US$ Million) by Type (2016-2021)
Table 33. Global Flip Chip Bonder Revenue Share by Type (2016-2021)
Table 34. Global Flip Chip Bonder Price (K USD/Unit) by Type (2016-2021)
Table 35. Global Flip Chip Bonder Consumption by Application (2016-2021) & (Units)
Table 36. Global Flip Chip Bonder Consumption Market Share by Application (2016-2021)
Table 37. Global Flip Chip Bonder Consumption Growth Rate by Application (2016-2021)
Table 38. BESI Flip Chip Bonder Corporation Information
Table 39. BESI Specification and Application
Table 40. BESI Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 41. BESI Main Business and Markets Served
Table 42. BESI Recent Developments/Updates
Table 43. ASMPT Flip Chip Bonder Corporation Information
Table 44. ASMPT Specification and Application
Table 45. ASMPT Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 46. ASMPT Main Business and Markets Served
Table 47. ASMPT Recent Developments/Updates
Table 48. Shibaura Flip Chip Bonder Corporation Information
Table 49. Shibaura Specification and Application
Table 50. Shibaura Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 51. Shibaura Main Business and Markets Served
Table 52. Shibaura Recent Developments/Updates
Table 53. Muehlbauer Flip Chip Bonder Corporation Information
Table 54. Muehlbauer Specification and Application
Table 55. Muehlbauer Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 56. Muehlbauer Main Business and Markets Served
Table 57. Muehlbauer Recent Developments/Updates
Table 58. K&S Flip Chip Bonder Corporation Information
Table 59. K&S Specification and Application
Table 60. K&S Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 61. K&S Main Business and Markets Served
Table 62. K&S Recent Developments/Updates
Table 63. Hamni Flip Chip Bonder Corporation Information
Table 64. Hamni Specification and Application
Table 65. Hamni Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 66. Hamni Main Business and Markets Served
Table 67. Hamni Recent Developments/Updates
Table 68. AMICRA Microtechnologies Flip Chip Bonder Corporation Information
Table 69. AMICRA Microtechnologies Specification and Application
Table 70. AMICRA Microtechnologies Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 71. AMICRA Microtechnologies Main Business and Markets Served
Table 72. AMICRA Microtechnologies Recent Developments/Updates
Table 73. SET Flip Chip Bonder Corporation Information
Table 74. SET Specification and Application
Table 75. SET Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 76. SET Main Business and Markets Served
Table 77. SET Recent Developments/Updates
Table 78. Athlete FA Flip Chip Bonder Corporation Information
Table 79. Athlete FA Specification and Application
Table 80. Athlete FA Flip Chip Bonder Production (Units), Revenue (US$ Million), Price (K USD/Unit) and Gross Margin (2016-2021)
Table 81. Athlete FA Main Business and Markets Served
Table 82. Athlete FA Recent Developments/Updates
Table 83. Production Base and Market Concentration Rate of Raw Material
Table 84. Key Suppliers of Raw Materials
Table 85. Flip Chip Bonder Distributors List
Table 86. Flip Chip Bonder Customers List
Table 87. Flip Chip Bonder Market Trends
Table 88. Flip Chip Bonder Growth Drivers
Table 89. Flip Chip Bonder Market Challenges
Table 90. Flip Chip Bonder Market Restraints
Table 91. Global Flip Chip Bonder Production (Units) Forecast by Region (2022-2027)
Table 92. North America Flip Chip Bonder Consumption Forecast by Country (2022-2027) & (Units)
Table 93. Europe Flip Chip Bonder Consumption Forecast by Country (2022-2027) & (Units)
Table 94. Asia Pacific Flip Chip Bonder Consumption Forecast by Region (2022-2027) & (Units)
Table 95. Latin America Flip Chip Bonder Consumption Forecast by Country (2022-2027) & (Units)
Table 96. Global Flip Chip Bonder Production Forecast by Type (2022-2027) & (Units)
Table 97. Global Flip Chip Bonder Revenue Forecast by Type (2022-2027) & (US$ Million)
Table 98. Global Flip Chip Bonder Price Forecast by Type (2022-2027) & (K USD/Unit)
Table 99. Global Flip Chip Bonder Consumption (Units) Forecast by Application (2022-2027)
Table 100. Research Programs/Design for This Report
Table 101. Key Data Information from Secondary Sources
Table 102. Key Data Information from Primary Sources
List of Figures
Figure 1. Product Picture of Flip Chip Bonder
Figure 2. Global Flip Chip Bonder Market Share by Type: 2020 VS 2027
Figure 3. Fully Automatic Product Picture
Figure 4. Semi-Automatic Product Picture
Figure 5. Global Flip Chip Bonder Market Share by Application: 2020 VS 2027
Figure 6. IDMs
Figure 7. OSAT
Figure 8. Global Flip Chip Bonder Revenue (US$ Million), 2016 VS 2021 VS 2027
Figure 9. Global Flip Chip Bonder Revenue (US$ Million) (2016-2027)
Figure 10. Global Flip Chip Bonder Production (Units) & (2016-2027)
Figure 11. North America Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 12. Europe Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 13. China Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 14. Japan Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 15. South Korea Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 16. Singapore Flip Chip Bonder Revenue (US$ Million) and Growth Rate (2016-2027)
Figure 17. Flip Chip Bonder Production Share by Manufacturers in 2020
Figure 18. Global Flip Chip Bonder Revenue Share by Manufacturers in 2020
Figure 19. Flip Chip Bonder Market Share by Company Type (Tier 1, Tier 2 and Tier 3): 2016 VS 2020
Figure 20. Global Market Flip Chip Bonder Average Price (K USD/Unit) of Key Manufacturers in 2020
Figure 21. The Global 5 and 10 Largest Players: Market Share by Flip Chip Bonder Revenue in 2020
Figure 22. Global Flip Chip Bonder Production Market Share by Region (2016-2021)
Figure 23. North America Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 24. Europe Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 25. China Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 26. Japan Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 27. South Korea Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 28. Singapore Flip Chip Bonder Production (Units) Growth Rate (2016-2021)
Figure 29. Global Flip Chip Bonder Consumption Market Share by Region (2016-2021)
Figure 30. Global Flip Chip Bonder Consumption Market Share by Region in 2020
Figure 31. North America Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 32. North America Flip Chip Bonder Consumption Market Share by Country in 2020
Figure 33. Canada Flip Chip Bonder Consumption Growth Rate (2016-2021) & (Units)
Figure 34. U.S. Flip Chip Bonder Consumption Growth Rate (2016-2021) & (Units)
Figure 35. Europe Flip Chip Bonder Consumption Growth Rate (2016-2021) & (Units)
Figure 36. Europe Flip Chip Bonder Consumption Market Share by Country in 2020
Figure 37. Germany America Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 38. France Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 39. U.K. Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 40. Italy Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 41. Russia Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 42. Asia Pacific Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 43. Asia Pacific Flip Chip Bonder Consumption Market Share by Regions in 2020
Figure 44. China Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 45. Japan Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 46. South Korea Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 47. Taiwan Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 48. Southeast Asia Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 49. India Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 50. Australia Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 51. Latin America Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 52. Latin America Flip Chip Bonder Consumption Market Share by Country in 2020
Figure 53. Mexico Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 54. Brazil Flip Chip Bonder Consumption and Growth Rate (2016-2021) & (Units)
Figure 55. Production Market Share of Flip Chip Bonder by Type (2016-2021)
Figure 56. Production Market Share of Flip Chip Bonder by Type in 2020
Figure 57. Revenue Share of Flip Chip Bonder by Type (2016-2021)
Figure 58. Revenue Market Share of Flip Chip Bonder by Type in 2020
Figure 59. Global Flip Chip Bonder Consumption Market Share by Application (2016-2021)
Figure 60. Global Flip Chip Bonder Consumption Market Share by Application in 2020
Figure 61. Global Flip Chip Bonder Consumption Growth Rate by Application (2016-2021)
Figure 62. Key Raw Materials Price Trend
Figure 63. Manufacturing Cost Structure of Flip Chip Bonder
Figure 64. Manufacturing Process Analysis of Flip Chip Bonder
Figure 65. Flip Chip Bonder Industrial Chain Analysis
Figure 66. Channels of Distribution
Figure 67. Distributors Profiles
Figure 68. Global Flip Chip Bonder Production Market Share Forecast by Region (2022-2027)
Figure 69. North America Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 70. Europe Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 71. China Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 72. Japan Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 73. South Korea Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 74. Singapore Flip Chip Bonder Production (Units) Growth Rate Forecast (2022-2027)
Figure 75. Global Forecasted Demand Analysis of Flip Chip Bonder (2015-2027) & (Units)
Figure 76. Global Flip Chip Bonder Production Market Share Forecast by Type (2022-2027)
Figure 77. Global Flip Chip Bonder Revenue Market Share Forecast by Type (2022-2027)
Figure 78. Global Flip Chip Bonder Consumption Forecast by Application (2022-2027)
Figure 79. Bottom-up and Top-down Approaches for This Report
Figure 80. Data Triangulation
Published By : QY Research
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