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Global Planar Die Bonder Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2029
Synopsis
The global Planar Die Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
The Global Info Research report includes an overview of the development of the Planar Die Bonder industry chain, the market status of Semiconductor Manufacturing (Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder), Electronic Packaging (Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Planar Die Bonder.
Regionally, the report analyzes the Planar Die Bonder markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Planar Die Bonder market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Planar Die Bonder market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Planar Die Bonder industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Units), revenue generated, and market share of different by Type (e.g., Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Planar Die Bonder market.
Regional Analysis: The report involves examining the Planar Die Bonder market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Planar Die Bonder market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Planar Die Bonder:
Company Analysis: Report covers individual Planar Die Bonder manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Planar Die Bonder This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Semiconductor Manufacturing, Electronic Packaging).
Technology Analysis: Report covers specific technologies relevant to Planar Die Bonder. It assesses the current state, advancements, and potential future developments in Planar Die Bonder areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Planar Die Bonder market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Planar Die Bonder market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Market segment by Application
Semiconductor Manufacturing
Electronic Packaging
Others
Major players covered
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Planar Die Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Planar Die Bonder, with price, sales, revenue and global market share of Planar Die Bonder from 2018 to 2023.
Chapter 3, the Planar Die Bonder competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Planar Die Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Planar Die Bonder market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Planar Die Bonder.
Chapter 14 and 15, to describe Planar Die Bonder sales channel, distributors, customers, research findings and conclusion.
The global Planar Die Bonder market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period.
A planar die bonder is a device used in the electronics assembly and packaging process. It is mainly used in the process of fixing micro components such as chips, chipsets, sensors, etc. on printed circuit boards (PCB) or other substrates. A planar die bonder usually includes a workbench, a feeding system and a die bonding head. In operation, the table holds the substrate, the feeding system supplies the chips or components, and the die attach head is responsible for placing the chip precisely on the substrate and fixing it using appropriate methods such as heat pressure or soldering. The operation process of a planar die bonder usually involves the following steps: Preparatory work: setting up and calibrating the machine, preparing substrates and chips. Loading: Place the chip or component in the feeding system, usually using a suction nozzle or other suitable fixture. Positioning: Place the substrate on the workbench and make sure the position is accurate. Die-bonding: The die-bonding head precisely places the chip or component on the substrate, and applies appropriate pressure or temperature to make it firmly connected to the substrate. Inspection: Check whether the connection after die bonding is accurate and reliable. Unloading: Remove the die-bonded substrate from the feeding system and prepare for the next operation. Planar die bonding machine plays a key role in the electronics manufacturing industry. It can improve production efficiency and ensure assembly quality, and is widely used in electronic equipment manufacturing, semiconductor packaging, sensor manufacturing and other fields.
The Global Info Research report includes an overview of the development of the Planar Die Bonder industry chain, the market status of Semiconductor Manufacturing (Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder), Electronic Packaging (Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder), and key enterprises in developed and developing market, and analysed the cutting-edge technology, patent, hot applications and market trends of Planar Die Bonder.
Regionally, the report analyzes the Planar Die Bonder markets in key regions. North America and Europe are experiencing steady growth, driven by government initiatives and increasing consumer awareness. Asia-Pacific, particularly China, leads the global Planar Die Bonder market, with robust domestic demand, supportive policies, and a strong manufacturing base.
Key Features:
The report presents comprehensive understanding of the Planar Die Bonder market. It provides a holistic view of the industry, as well as detailed insights into individual components and stakeholders. The report analysis market dynamics, trends, challenges, and opportunities within the Planar Die Bonder industry.
The report involves analyzing the market at a macro level:
Market Sizing and Segmentation: Report collect data on the overall market size, including the sales quantity (Units), revenue generated, and market share of different by Type (e.g., Manual Plane Die Bonder, Semi-Automatic Planar Die Bonder).
Industry Analysis: Report analyse the broader industry trends, such as government policies and regulations, technological advancements, consumer preferences, and market dynamics. This analysis helps in understanding the key drivers and challenges influencing the Planar Die Bonder market.
Regional Analysis: The report involves examining the Planar Die Bonder market at a regional or national level. Report analyses regional factors such as government incentives, infrastructure development, economic conditions, and consumer behaviour to identify variations and opportunities within different markets.
Market Projections: Report covers the gathered data and analysis to make future projections and forecasts for the Planar Die Bonder market. This may include estimating market growth rates, predicting market demand, and identifying emerging trends.
The report also involves a more granular approach to Planar Die Bonder:
Company Analysis: Report covers individual Planar Die Bonder manufacturers, suppliers, and other relevant industry players. This analysis includes studying their financial performance, market positioning, product portfolios, partnerships, and strategies.
Consumer Analysis: Report covers data on consumer behaviour, preferences, and attitudes towards Planar Die Bonder This may involve surveys, interviews, and analysis of consumer reviews and feedback from different by Application (Semiconductor Manufacturing, Electronic Packaging).
Technology Analysis: Report covers specific technologies relevant to Planar Die Bonder. It assesses the current state, advancements, and potential future developments in Planar Die Bonder areas.
Competitive Landscape: By analyzing individual companies, suppliers, and consumers, the report present insights into the competitive landscape of the Planar Die Bonder market. This analysis helps understand market share, competitive advantages, and potential areas for differentiation among industry players.
Market Validation: The report involves validating findings and projections through primary research, such as surveys, interviews, and focus groups.
Market Segmentation
Planar Die Bonder market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value.
Market segment by Type
Manual Plane Die Bonder
Semi-Automatic Planar Die Bonder
Fully Automatic Flat Die Bonder
Market segment by Application
Semiconductor Manufacturing
Electronic Packaging
Others
Major players covered
ASM Pacific Technology Ltd.
Kulicke & Soffa Industries, Inc.
Tokyo Electron Limited
Applied Materials, Inc.
Disco Corporation
EV Group (EVG)
SPTS Technologies Ltd.
Besi (BE Semiconductor Industries N.V.)
Nordson Corporation
Shibaura Mechatronics Corporation
Palomar Technologies, Inc.
Shinkawa Ltd.
Towa Corporation
F&K Delvotec Bondtechnik GmbH
West Bond, Inc.
Orthodyne Electronics Corporation
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Planar Die Bonder product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Planar Die Bonder, with price, sales, revenue and global market share of Planar Die Bonder from 2018 to 2023.
Chapter 3, the Planar Die Bonder competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Planar Die Bonder breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Planar Die Bonder market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Planar Die Bonder.
Chapter 14 and 15, to describe Planar Die Bonder sales channel, distributors, customers, research findings and conclusion.
Index1 Market Overview
1.1 Product Overview and Scope of Planar Die Bonder
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Planar Die Bonder Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 Manual Plane Die Bonder
1.3.3 Semi-Automatic Planar Die Bonder
1.3.4 Fully Automatic Flat Die Bonder
1.4 Market Analysis by Application
1.4.1 Overview: Global Planar Die Bonder Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 Semiconductor Manufacturing
1.4.3 Electronic Packaging
1.4.4 Others
1.5 Global Planar Die Bonder Market Size & Forecast
1.5.1 Global Planar Die Bonder Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Planar Die Bonder Sales Quantity (2018-2029)
1.5.3 Global Planar Die Bonder Average Price (2018-2029)
2 Manufacturers Profiles
2.1 ASM Pacific Technology Ltd.
2.1.1 ASM Pacific Technology Ltd. Details
2.1.2 ASM Pacific Technology Ltd. Major Business
2.1.3 ASM Pacific Technology Ltd. Planar Die Bonder Product and Services
2.1.4 ASM Pacific Technology Ltd. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 ASM Pacific Technology Ltd. Recent Developments/Updates
2.2 Kulicke & Soffa Industries, Inc.
2.2.1 Kulicke & Soffa Industries, Inc. Details
2.2.2 Kulicke & Soffa Industries, Inc. Major Business
2.2.3 Kulicke & Soffa Industries, Inc. Planar Die Bonder Product and Services
2.2.4 Kulicke & Soffa Industries, Inc. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Kulicke & Soffa Industries, Inc. Recent Developments/Updates
2.3 Tokyo Electron Limited
2.3.1 Tokyo Electron Limited Details
2.3.2 Tokyo Electron Limited Major Business
2.3.3 Tokyo Electron Limited Planar Die Bonder Product and Services
2.3.4 Tokyo Electron Limited Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 Tokyo Electron Limited Recent Developments/Updates
2.4 Applied Materials, Inc.
2.4.1 Applied Materials, Inc. Details
2.4.2 Applied Materials, Inc. Major Business
2.4.3 Applied Materials, Inc. Planar Die Bonder Product and Services
2.4.4 Applied Materials, Inc. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 Applied Materials, Inc. Recent Developments/Updates
2.5 Disco Corporation
2.5.1 Disco Corporation Details
2.5.2 Disco Corporation Major Business
2.5.3 Disco Corporation Planar Die Bonder Product and Services
2.5.4 Disco Corporation Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 Disco Corporation Recent Developments/Updates
2.6 EV Group (EVG)
2.6.1 EV Group (EVG) Details
2.6.2 EV Group (EVG) Major Business
2.6.3 EV Group (EVG) Planar Die Bonder Product and Services
2.6.4 EV Group (EVG) Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 EV Group (EVG) Recent Developments/Updates
2.7 SPTS Technologies Ltd.
2.7.1 SPTS Technologies Ltd. Details
2.7.2 SPTS Technologies Ltd. Major Business
2.7.3 SPTS Technologies Ltd. Planar Die Bonder Product and Services
2.7.4 SPTS Technologies Ltd. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 SPTS Technologies Ltd. Recent Developments/Updates
2.8 Besi (BE Semiconductor Industries N.V.)
2.8.1 Besi (BE Semiconductor Industries N.V.) Details
2.8.2 Besi (BE Semiconductor Industries N.V.) Major Business
2.8.3 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Product and Services
2.8.4 Besi (BE Semiconductor Industries N.V.) Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 Besi (BE Semiconductor Industries N.V.) Recent Developments/Updates
2.9 Nordson Corporation
2.9.1 Nordson Corporation Details
2.9.2 Nordson Corporation Major Business
2.9.3 Nordson Corporation Planar Die Bonder Product and Services
2.9.4 Nordson Corporation Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 Nordson Corporation Recent Developments/Updates
2.10 Shibaura Mechatronics Corporation
2.10.1 Shibaura Mechatronics Corporation Details
2.10.2 Shibaura Mechatronics Corporation Major Business
2.10.3 Shibaura Mechatronics Corporation Planar Die Bonder Product and Services
2.10.4 Shibaura Mechatronics Corporation Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.10.5 Shibaura Mechatronics Corporation Recent Developments/Updates
2.11 Palomar Technologies, Inc.
2.11.1 Palomar Technologies, Inc. Details
2.11.2 Palomar Technologies, Inc. Major Business
2.11.3 Palomar Technologies, Inc. Planar Die Bonder Product and Services
2.11.4 Palomar Technologies, Inc. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.11.5 Palomar Technologies, Inc. Recent Developments/Updates
2.12 Shinkawa Ltd.
2.12.1 Shinkawa Ltd. Details
2.12.2 Shinkawa Ltd. Major Business
2.12.3 Shinkawa Ltd. Planar Die Bonder Product and Services
2.12.4 Shinkawa Ltd. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.12.5 Shinkawa Ltd. Recent Developments/Updates
2.13 Towa Corporation
2.13.1 Towa Corporation Details
2.13.2 Towa Corporation Major Business
2.13.3 Towa Corporation Planar Die Bonder Product and Services
2.13.4 Towa Corporation Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.13.5 Towa Corporation Recent Developments/Updates
2.14 F&K Delvotec Bondtechnik GmbH
2.14.1 F&K Delvotec Bondtechnik GmbH Details
2.14.2 F&K Delvotec Bondtechnik GmbH Major Business
2.14.3 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Product and Services
2.14.4 F&K Delvotec Bondtechnik GmbH Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.14.5 F&K Delvotec Bondtechnik GmbH Recent Developments/Updates
2.15 West Bond, Inc.
2.15.1 West Bond, Inc. Details
2.15.2 West Bond, Inc. Major Business
2.15.3 West Bond, Inc. Planar Die Bonder Product and Services
2.15.4 West Bond, Inc. Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.15.5 West Bond, Inc. Recent Developments/Updates
2.16 Orthodyne Electronics Corporation
2.16.1 Orthodyne Electronics Corporation Details
2.16.2 Orthodyne Electronics Corporation Major Business
2.16.3 Orthodyne Electronics Corporation Planar Die Bonder Product and Services
2.16.4 Orthodyne Electronics Corporation Planar Die Bonder Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.16.5 Orthodyne Electronics Corporation Recent Developments/Updates
3 Competitive Environment: Planar Die Bonder by Manufacturer
3.1 Global Planar Die Bonder Sales Quantity by Manufacturer (2018-2023)
3.2 Global Planar Die Bonder Revenue by Manufacturer (2018-2023)
3.3 Global Planar Die Bonder Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Planar Die Bonder by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Planar Die Bonder Manufacturer Market Share in 2022
3.4.2 Top 6 Planar Die Bonder Manufacturer Market Share in 2022
3.5 Planar Die Bonder Market: Overall Company Footprint Analysis
3.5.1 Planar Die Bonder Market: Region Footprint
3.5.2 Planar Die Bonder Market: Company Product Type Footprint
3.5.3 Planar Die Bonder Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Planar Die Bonder Market Size by Region
4.1.1 Global Planar Die Bonder Sales Quantity by Region (2018-2029)
4.1.2 Global Planar Die Bonder Consumption Value by Region (2018-2029)
4.1.3 Global Planar Die Bonder Average Price by Region (2018-2029)
4.2 North America Planar Die Bonder Consumption Value (2018-2029)
4.3 Europe Planar Die Bonder Consumption Value (2018-2029)
4.4 Asia-Pacific Planar Die Bonder Consumption Value (2018-2029)
4.5 South America Planar Die Bonder Consumption Value (2018-2029)
4.6 Middle East and Africa Planar Die Bonder Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Planar Die Bonder Sales Quantity by Type (2018-2029)
5.2 Global Planar Die Bonder Consumption Value by Type (2018-2029)
5.3 Global Planar Die Bonder Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Planar Die Bonder Sales Quantity by Application (2018-2029)
6.2 Global Planar Die Bonder Consumption Value by Application (2018-2029)
6.3 Global Planar Die Bonder Average Price by Application (2018-2029)
7 North America
7.1 North America Planar Die Bonder Sales Quantity by Type (2018-2029)
7.2 North America Planar Die Bonder Sales Quantity by Application (2018-2029)
7.3 North America Planar Die Bonder Market Size by Country
7.3.1 North America Planar Die Bonder Sales Quantity by Country (2018-2029)
7.3.2 North America Planar Die Bonder Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Planar Die Bonder Sales Quantity by Type (2018-2029)
8.2 Europe Planar Die Bonder Sales Quantity by Application (2018-2029)
8.3 Europe Planar Die Bonder Market Size by Country
8.3.1 Europe Planar Die Bonder Sales Quantity by Country (2018-2029)
8.3.2 Europe Planar Die Bonder Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Planar Die Bonder Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Planar Die Bonder Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Planar Die Bonder Market Size by Region
9.3.1 Asia-Pacific Planar Die Bonder Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Planar Die Bonder Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Planar Die Bonder Sales Quantity by Type (2018-2029)
10.2 South America Planar Die Bonder Sales Quantity by Application (2018-2029)
10.3 South America Planar Die Bonder Market Size by Country
10.3.1 South America Planar Die Bonder Sales Quantity by Country (2018-2029)
10.3.2 South America Planar Die Bonder Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Planar Die Bonder Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Planar Die Bonder Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Planar Die Bonder Market Size by Country
11.3.1 Middle East & Africa Planar Die Bonder Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Planar Die Bonder Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Planar Die Bonder Market Drivers
12.2 Planar Die Bonder Market Restraints
12.3 Planar Die Bonder Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Planar Die Bonder and Key Manufacturers
13.2 Manufacturing Costs Percentage of Planar Die Bonder
13.3 Planar Die Bonder Production Process
13.4 Planar Die Bonder Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Planar Die Bonder Typical Distributors
14.3 Planar Die Bonder Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
Published By : GlobalInfoResearch
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