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Global SiC Wafer Laser Cutting Equipment Market Research Report 2025
Synopsis
Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.
The global SiC Wafer Laser Cutting Equipment market was valued at US$ 91 million in 2023 and is anticipated to reach US$ 298.4 million by 2030, witnessing a CAGR of 16.3% during the forecast period 2024-2030.
Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.
This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment.
Report Scope
The SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global SiC Wafer Laser Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC Wafer Laser Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology
Segment by Type
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches
Segment by Application
Foundry
IDM
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Wafer Laser Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Wafer Laser Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Silicon carbide (SiC) was discovered in 1893 as an industrial abrasive for grinding wheels and automotive brakes. The scheme of laser cutting silicon carbide is laser modified cutting technology. The principle is to use a laser beam with a high transmission wavelength to focus on the inside of the wafer through a lens, and multiphoton absorption occurs, resulting in a local deformation layer, namely modified layer. The layer is mainly composed of holes, high dislocation density layers and cracks. The modified layer is the starting point of subsequent wafer dicing and cracking. The modified layer can be confined inside the wafer by optimizing the laser and optical path system, and no thermal damage is caused to the surface and bottom of the wafer. Then, use external force to guide the cracks to the surface and bottom of the wafer, separating the wafer into the required size.
The global SiC Wafer Laser Cutting Equipment market was valued at US$ 91 million in 2023 and is anticipated to reach US$ 298.4 million by 2030, witnessing a CAGR of 16.3% during the forecast period 2024-2030.
Global key players of SiC wafer laser cutting equipment include DISCO Corporation, SuZhou Delphi Laser and Han's Laser, etc. The top three players hold a share over 60%.From the perspective of consumption value by region，Asia-Pacific (excluding China) is the largest market of SiC wafer laser cutting equipment, followed by China, North America, and Europe. In terms of type, processing sizes up to 6 Inches account for more than 75% of the market share. In terms of application, foundry has a share over 60 %.
This report aims to provide a comprehensive presentation of the global market for SiC Wafer Laser Cutting Equipment, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding SiC Wafer Laser Cutting Equipment.
Report Scope
The SiC Wafer Laser Cutting Equipment market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global SiC Wafer Laser Cutting Equipment market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the SiC Wafer Laser Cutting Equipment manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
DISCO Corporation
Suzhou Delphi Laser Co
Han's Laser Technology
3D-Micromac
Synova S.A.
HGTECH
ASMPT
GHN.GIE
Wuhan DR Laser Technology
Segment by Type
Processing Sizes up to 6 Inches
Processing Sizes up to 8 Inches
Segment by Application
Foundry
IDM
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of SiC Wafer Laser Cutting Equipment manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of SiC Wafer Laser Cutting Equipment by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of SiC Wafer Laser Cutting Equipment in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 SiC Wafer Laser Cutting Equipment Market Overview
1.1 Product Definition
1.2 SiC Wafer Laser Cutting Equipment Segment by Type
1.2.1 Global SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Processing Sizes up to 6 Inches
1.2.3 Processing Sizes up to 8 Inches
1.3 SiC Wafer Laser Cutting Equipment Segment by Application
1.3.1 Global SiC Wafer Laser Cutting Equipment Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Foundry
1.3.3 IDM
1.4 Global Market Growth Prospects
1.4.1 Global SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global SiC Wafer Laser Cutting Equipment Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts (2019-2030)
1.4.4 Global SiC Wafer Laser Cutting Equipment Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global SiC Wafer Laser Cutting Equipment Production Market Share by Manufacturers (2019-2024)
2.2 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of SiC Wafer Laser Cutting Equipment, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global SiC Wafer Laser Cutting Equipment Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global SiC Wafer Laser Cutting Equipment Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Product Offered and Application
2.8 Global Key Manufacturers of SiC Wafer Laser Cutting Equipment, Date of Enter into This Industry
2.9 SiC Wafer Laser Cutting Equipment Market Competitive Situation and Trends
2.9.1 SiC Wafer Laser Cutting Equipment Market Concentration Rate
2.9.2 Global 5 and 10 Largest SiC Wafer Laser Cutting Equipment Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 SiC Wafer Laser Cutting Equipment Production by Region
3.1 Global SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global SiC Wafer Laser Cutting Equipment Production Value by Region (2019-2030)
3.2.1 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of SiC Wafer Laser Cutting Equipment by Region (2025-2030)
3.3 Global SiC Wafer Laser Cutting Equipment Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global SiC Wafer Laser Cutting Equipment Production by Region (2019-2030)
3.4.1 Global SiC Wafer Laser Cutting Equipment Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of SiC Wafer Laser Cutting Equipment by Region (2025-2030)
3.5 Global SiC Wafer Laser Cutting Equipment Market Price Analysis by Region (2019-2024)
3.6 Global SiC Wafer Laser Cutting Equipment Production and Value, Year-over-Year Growth
3.6.1 North America SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.3 China SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan SiC Wafer Laser Cutting Equipment Production Value Estimates and Forecasts (2019-2030)
4 SiC Wafer Laser Cutting Equipment Consumption by Region
4.1 Global SiC Wafer Laser Cutting Equipment Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global SiC Wafer Laser Cutting Equipment Consumption by Region (2019-2030)
4.2.1 Global SiC Wafer Laser Cutting Equipment Consumption by Region (2019-2024)
4.2.2 Global SiC Wafer Laser Cutting Equipment Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America SiC Wafer Laser Cutting Equipment Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe SiC Wafer Laser Cutting Equipment Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific SiC Wafer Laser Cutting Equipment Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa SiC Wafer Laser Cutting Equipment Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global SiC Wafer Laser Cutting Equipment Production by Type (2019-2030)
5.1.1 Global SiC Wafer Laser Cutting Equipment Production by Type (2019-2024)
5.1.2 Global SiC Wafer Laser Cutting Equipment Production by Type (2025-2030)
5.1.3 Global SiC Wafer Laser Cutting Equipment Production Market Share by Type (2019-2030)
5.2 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2019-2030)
5.2.1 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2019-2024)
5.2.2 Global SiC Wafer Laser Cutting Equipment Production Value by Type (2025-2030)
5.2.3 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Type (2019-2030)
5.3 Global SiC Wafer Laser Cutting Equipment Price by Type (2019-2030)
6 Segment by Application
6.1 Global SiC Wafer Laser Cutting Equipment Production by Application (2019-2030)
6.1.1 Global SiC Wafer Laser Cutting Equipment Production by Application (2019-2024)
6.1.2 Global SiC Wafer Laser Cutting Equipment Production by Application (2025-2030)
6.1.3 Global SiC Wafer Laser Cutting Equipment Production Market Share by Application (2019-2030)
6.2 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2019-2030)
6.2.1 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2019-2024)
6.2.2 Global SiC Wafer Laser Cutting Equipment Production Value by Application (2025-2030)
6.2.3 Global SiC Wafer Laser Cutting Equipment Production Value Market Share by Application (2019-2030)
6.3 Global SiC Wafer Laser Cutting Equipment Price by Application (2019-2030)
7 Key Companies Profiled
7.1 DISCO Corporation
7.1.1 DISCO Corporation SiC Wafer Laser Cutting Equipment Corporation Information
7.1.2 DISCO Corporation SiC Wafer Laser Cutting Equipment Product Portfolio
7.1.3 DISCO Corporation SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.1.4 DISCO Corporation Main Business and Markets Served
7.1.5 DISCO Corporation Recent Developments/Updates
7.2 Suzhou Delphi Laser Co
7.2.1 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Corporation Information
7.2.2 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Product Portfolio
7.2.3 Suzhou Delphi Laser Co SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.2.4 Suzhou Delphi Laser Co Main Business and Markets Served
7.2.5 Suzhou Delphi Laser Co Recent Developments/Updates
7.3 Han's Laser Technology
7.3.1 Han's Laser Technology SiC Wafer Laser Cutting Equipment Corporation Information
7.3.2 Han's Laser Technology SiC Wafer Laser Cutting Equipment Product Portfolio
7.3.3 Han's Laser Technology SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Han's Laser Technology Main Business and Markets Served
7.3.5 Han's Laser Technology Recent Developments/Updates
7.4 3D-Micromac
7.4.1 3D-Micromac SiC Wafer Laser Cutting Equipment Corporation Information
7.4.2 3D-Micromac SiC Wafer Laser Cutting Equipment Product Portfolio
7.4.3 3D-Micromac SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.4.4 3D-Micromac Main Business and Markets Served
7.4.5 3D-Micromac Recent Developments/Updates
7.5 Synova S.A.
7.5.1 Synova S.A. SiC Wafer Laser Cutting Equipment Corporation Information
7.5.2 Synova S.A. SiC Wafer Laser Cutting Equipment Product Portfolio
7.5.3 Synova S.A. SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Synova S.A. Main Business and Markets Served
7.5.5 Synova S.A. Recent Developments/Updates
7.6 HGTECH
7.6.1 HGTECH SiC Wafer Laser Cutting Equipment Corporation Information
7.6.2 HGTECH SiC Wafer Laser Cutting Equipment Product Portfolio
7.6.3 HGTECH SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.6.4 HGTECH Main Business and Markets Served
7.6.5 HGTECH Recent Developments/Updates
7.7 ASMPT
7.7.1 ASMPT SiC Wafer Laser Cutting Equipment Corporation Information
7.7.2 ASMPT SiC Wafer Laser Cutting Equipment Product Portfolio
7.7.3 ASMPT SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.7.4 ASMPT Main Business and Markets Served
7.7.5 ASMPT Recent Developments/Updates
7.8 GHN.GIE
7.8.1 GHN.GIE SiC Wafer Laser Cutting Equipment Corporation Information
7.8.2 GHN.GIE SiC Wafer Laser Cutting Equipment Product Portfolio
7.8.3 GHN.GIE SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.8.4 GHN.GIE Main Business and Markets Served
7.7.5 GHN.GIE Recent Developments/Updates
7.9 Wuhan DR Laser Technology
7.9.1 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Corporation Information
7.9.2 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Product Portfolio
7.9.3 Wuhan DR Laser Technology SiC Wafer Laser Cutting Equipment Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Wuhan DR Laser Technology Main Business and Markets Served
7.9.5 Wuhan DR Laser Technology Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 SiC Wafer Laser Cutting Equipment Industry Chain Analysis
8.2 SiC Wafer Laser Cutting Equipment Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 SiC Wafer Laser Cutting Equipment Production Mode & Process
8.4 SiC Wafer Laser Cutting Equipment Sales and Marketing
8.4.1 SiC Wafer Laser Cutting Equipment Sales Channels
8.4.2 SiC Wafer Laser Cutting Equipment Distributors
8.5 SiC Wafer Laser Cutting Equipment Customers
9 SiC Wafer Laser Cutting Equipment Market Dynamics
9.1 SiC Wafer Laser Cutting Equipment Industry Trends
9.2 SiC Wafer Laser Cutting Equipment Market Drivers
9.3 SiC Wafer Laser Cutting Equipment Market Challenges
9.4 SiC Wafer Laser Cutting Equipment Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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