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Global Thin Shrink Small Outline Package (TSSOP) Market Research Report 2025
Synopsis
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads.
The global Thin Shrink Small Outline Package (TSSOP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Thin Shrink Small Outline Package (TSSOP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Shrink Small Outline Package (TSSOP).
Report Scope
The Thin Shrink Small Outline Package (TSSOP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thin Shrink Small Outline Package (TSSOP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thin Shrink Small Outline Package (TSSOP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor
Nexperia
Analog Devices
Microchip Technology Inc
Orient Semiconductor Electronics
Texas Instruments
Renesas
ON Semiconductor
Jameco Electronics
Segment by Type
QSOP
VSOP
Segment by Application
Industrial
Auto Industry
Electronic
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Thin Shrink Small Outline Package (TSSOP) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
The Thin Shrink Small Outline Package (TSSOP), is a rectangular surface mount plastic ic package with gull-wing leads.
The global Thin Shrink Small Outline Package (TSSOP) market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030.
The global market for semiconductor was estimated at US$ 579 billion in the year 2022, is projected to US$ 790 billion by 2029, growing at a CAGR of 6% during the forecast period. Although some major categories are still double-digit year-over-year growth in 2022, led by Analog with 20.76%, Sensor with 16.31%, and Logic with 14.46% growth, Memory declined with 12.64% year over year. The microprocessor (MPU) and microcontroller (MCU) segments will experience stagnant growth due to weak shipments and investment in notebooks, computers, and standard desktops. In the current market scenario, the growing popularity of IoT-based electronics is stimulating the need for powerful processors and controllers. Hybrid MPUs and MCUs provide real-time embedded processing and control for the topmost IoT-based applications, resulting in significant market growth. The Analog IC segment is expected to grow gradually, while demand from the networking and communications industries is limited. Few of the emerging trends in the growing demand for Analog integrated circuits include signal conversion, automotive-specific Analog applications, and power management. They drive the growing demand for discrete power devices.
This report aims to provide a comprehensive presentation of the global market for Thin Shrink Small Outline Package (TSSOP), with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thin Shrink Small Outline Package (TSSOP).
Report Scope
The Thin Shrink Small Outline Package (TSSOP) market size, estimations, and forecasts are provided in terms of revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thin Shrink Small Outline Package (TSSOP) market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thin Shrink Small Outline Package (TSSOP) companies, new entrants, and industry chain related companies in this market with information on the revenues, sales volume, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Amkor
Nexperia
Analog Devices
Microchip Technology Inc
Orient Semiconductor Electronics
Texas Instruments
Renesas
ON Semiconductor
Jameco Electronics
Segment by Type
QSOP
VSOP
Segment by Application
Industrial
Auto Industry
Electronic
Others
By Region
North America
United States
Canada
Europe
Germany
France
UK
Italy
Russia
Nordic Countries
Rest of Europe
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Introduces executive summary of global market size, regional market size, this section also introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by companies in the industry, and the analysis of relevant policies in the industry.
Chapter 3: Detailed analysis of Thin Shrink Small Outline Package (TSSOP) companies’ competitive landscape, revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 4: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 5: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 6, 7, 8, 9, 10: North America, Europe, Asia Pacific, Latin America, Middle East and Africa segment by country. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and capacity of each country in the world.
Chapter 11: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 12: The main points and conclusions of the report.
Index1 Report Overview
1.1 Study Scope
1.2 Market Analysis by Type
1.2.1 Global Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Type: 2019 VS 2023 VS 2030
1.2.2 QSOP
1.2.3 VSOP
1.3 Market by Application
1.3.1 Global Thin Shrink Small Outline Package (TSSOP) Market Growth by Application: 2019 VS 2023 VS 2030
1.3.2 Industrial
1.3.3 Auto Industry
1.3.4 Electronic
1.3.5 Others
1.4 Study Objectives
1.5 Years Considered
1.6 Years Considered
2 Global Growth Trends
2.1 Global Thin Shrink Small Outline Package (TSSOP) Market Perspective (2019-2030)
2.2 Thin Shrink Small Outline Package (TSSOP) Growth Trends by Region
2.2.1 Global Thin Shrink Small Outline Package (TSSOP) Market Size by Region: 2019 VS 2023 VS 2030
2.2.2 Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Region (2019-2024)
2.2.3 Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Region (2025-2030)
2.3 Thin Shrink Small Outline Package (TSSOP) Market Dynamics
2.3.1 Thin Shrink Small Outline Package (TSSOP) Industry Trends
2.3.2 Thin Shrink Small Outline Package (TSSOP) Market Drivers
2.3.3 Thin Shrink Small Outline Package (TSSOP) Market Challenges
2.3.4 Thin Shrink Small Outline Package (TSSOP) Market Restraints
3 Competition Landscape by Key Players
3.1 Global Top Thin Shrink Small Outline Package (TSSOP) Players by Revenue
3.1.1 Global Top Thin Shrink Small Outline Package (TSSOP) Players by Revenue (2019-2024)
3.1.2 Global Thin Shrink Small Outline Package (TSSOP) Revenue Market Share by Players (2019-2024)
3.2 Global Thin Shrink Small Outline Package (TSSOP) Market Share by Company Type (Tier 1, Tier 2, and Tier 3)
3.3 Players Covered: Ranking by Thin Shrink Small Outline Package (TSSOP) Revenue
3.4 Global Thin Shrink Small Outline Package (TSSOP) Market Concentration Ratio
3.4.1 Global Thin Shrink Small Outline Package (TSSOP) Market Concentration Ratio (CR5 and HHI)
3.4.2 Global Top 10 and Top 5 Companies by Thin Shrink Small Outline Package (TSSOP) Revenue in 2023
3.5 Thin Shrink Small Outline Package (TSSOP) Key Players Head office and Area Served
3.6 Key Players Thin Shrink Small Outline Package (TSSOP) Product Solution and Service
3.7 Date of Enter into Thin Shrink Small Outline Package (TSSOP) Market
3.8 Mergers & Acquisitions, Expansion Plans
4 Thin Shrink Small Outline Package (TSSOP) Breakdown Data by Type
4.1 Global Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Type (2019-2024)
4.2 Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Type (2025-2030)
5 Thin Shrink Small Outline Package (TSSOP) Breakdown Data by Application
5.1 Global Thin Shrink Small Outline Package (TSSOP) Historic Market Size by Application (2019-2024)
5.2 Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Application (2025-2030)
6 North America
6.1 North America Thin Shrink Small Outline Package (TSSOP) Market Size (2019-2030)
6.2 North America Thin Shrink Small Outline Package (TSSOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
6.3 North America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024)
6.4 North America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030)
6.5 United States
6.6 Canada
7 Europe
7.1 Europe Thin Shrink Small Outline Package (TSSOP) Market Size (2019-2030)
7.2 Europe Thin Shrink Small Outline Package (TSSOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
7.3 Europe Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024)
7.4 Europe Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030)
7.5 Germany
7.6 France
7.7 U.K.
7.8 Italy
7.9 Russia
7.10 Nordic Countries
8 Asia-Pacific
8.1 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size (2019-2030)
8.2 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Growth Rate by Region: 2019 VS 2023 VS 2030
8.3 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2019-2024)
8.4 Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2025-2030)
8.5 China
8.6 Japan
8.7 South Korea
8.8 Southeast Asia
8.9 India
8.10 Australia
9 Latin America
9.1 Latin America Thin Shrink Small Outline Package (TSSOP) Market Size (2019-2030)
9.2 Latin America Thin Shrink Small Outline Package (TSSOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
9.3 Latin America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024)
9.4 Latin America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030)
9.5 Mexico
9.6 Brazil
10 Middle East & Africa
10.1 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size (2019-2030)
10.2 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Growth Rate by Country: 2019 VS 2023 VS 2030
10.3 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024)
10.4 Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030)
10.5 Turkey
10.6 Saudi Arabia
10.7 UAE
11 Key Players Profiles
11.1 Amkor
11.1.1 Amkor Company Detail
11.1.2 Amkor Business Overview
11.1.3 Amkor Thin Shrink Small Outline Package (TSSOP) Introduction
11.1.4 Amkor Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.1.5 Amkor Recent Development
11.2 Nexperia
11.2.1 Nexperia Company Detail
11.2.2 Nexperia Business Overview
11.2.3 Nexperia Thin Shrink Small Outline Package (TSSOP) Introduction
11.2.4 Nexperia Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.2.5 Nexperia Recent Development
11.3 Analog Devices
11.3.1 Analog Devices Company Detail
11.3.2 Analog Devices Business Overview
11.3.3 Analog Devices Thin Shrink Small Outline Package (TSSOP) Introduction
11.3.4 Analog Devices Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.3.5 Analog Devices Recent Development
11.4 Microchip Technology Inc
11.4.1 Microchip Technology Inc Company Detail
11.4.2 Microchip Technology Inc Business Overview
11.4.3 Microchip Technology Inc Thin Shrink Small Outline Package (TSSOP) Introduction
11.4.4 Microchip Technology Inc Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.4.5 Microchip Technology Inc Recent Development
11.5 Orient Semiconductor Electronics
11.5.1 Orient Semiconductor Electronics Company Detail
11.5.2 Orient Semiconductor Electronics Business Overview
11.5.3 Orient Semiconductor Electronics Thin Shrink Small Outline Package (TSSOP) Introduction
11.5.4 Orient Semiconductor Electronics Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.5.5 Orient Semiconductor Electronics Recent Development
11.6 Texas Instruments
11.6.1 Texas Instruments Company Detail
11.6.2 Texas Instruments Business Overview
11.6.3 Texas Instruments Thin Shrink Small Outline Package (TSSOP) Introduction
11.6.4 Texas Instruments Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.6.5 Texas Instruments Recent Development
11.7 Renesas
11.7.1 Renesas Company Detail
11.7.2 Renesas Business Overview
11.7.3 Renesas Thin Shrink Small Outline Package (TSSOP) Introduction
11.7.4 Renesas Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.7.5 Renesas Recent Development
11.8 ON Semiconductor
11.8.1 ON Semiconductor Company Detail
11.8.2 ON Semiconductor Business Overview
11.8.3 ON Semiconductor Thin Shrink Small Outline Package (TSSOP) Introduction
11.8.4 ON Semiconductor Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.8.5 ON Semiconductor Recent Development
11.9 Jameco Electronics
11.9.1 Jameco Electronics Company Detail
11.9.2 Jameco Electronics Business Overview
11.9.3 Jameco Electronics Thin Shrink Small Outline Package (TSSOP) Introduction
11.9.4 Jameco Electronics Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
11.9.5 Jameco Electronics Recent Development
12 Analyst's Viewpoints/Conclusions
13 Appendix
13.1 Research Methodology
13.1.1 Methodology/Research Approach
13.1.2 Data Source
13.2 Disclaimer
13.3 Author Details
List of TablesList of Tables
Table 1. Global Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Type (US$ Million): 2019 VS 2023 VS 2030
Table 2. Key Players of QSOP
Table 3. Key Players of VSOP
Table 4. Global Thin Shrink Small Outline Package (TSSOP) Market Size Growth by Application (US$ Million): 2019 VS 2023 VS 2030
Table 5. Global Thin Shrink Small Outline Package (TSSOP) Market Size by Region (US$ Million): 2019 VS 2023 VS 2030
Table 6. Global Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2019-2024) & (US$ Million)
Table 7. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Region (2019-2024)
Table 8. Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Region (2025-2030) & (US$ Million)
Table 9. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Region (2025-2030)
Table 10. Thin Shrink Small Outline Package (TSSOP) Market Trends
Table 11. Thin Shrink Small Outline Package (TSSOP) Market Drivers
Table 12. Thin Shrink Small Outline Package (TSSOP) Market Challenges
Table 13. Thin Shrink Small Outline Package (TSSOP) Market Restraints
Table 14. Global Thin Shrink Small Outline Package (TSSOP) Revenue by Players (2019-2024) & (US$ Million)
Table 15. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Players (2019-2024)
Table 16. Global Top Thin Shrink Small Outline Package (TSSOP) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thin Shrink Small Outline Package (TSSOP) as of 2023)
Table 17. Ranking of Global Top Thin Shrink Small Outline Package (TSSOP) Companies by Revenue (US$ Million) in 2023
Table 18. Global 5 Largest Players Market Share by Thin Shrink Small Outline Package (TSSOP) Revenue (CR5 and HHI) & (2019-2024)
Table 19. Key Players Headquarters and Area Served
Table 20. Key Players Thin Shrink Small Outline Package (TSSOP) Product Solution and Service
Table 21. Date of Enter into Thin Shrink Small Outline Package (TSSOP) Market
Table 22. Mergers & Acquisitions, Expansion Plans
Table 23. Global Thin Shrink Small Outline Package (TSSOP) Market Size by Type (2019-2024) & (US$ Million)
Table 24. Global Thin Shrink Small Outline Package (TSSOP) Revenue Market Share by Type (2019-2024)
Table 25. Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Type (2025-2030) & (US$ Million)
Table 26. Global Thin Shrink Small Outline Package (TSSOP) Revenue Market Share by Type (2025-2030)
Table 27. Global Thin Shrink Small Outline Package (TSSOP) Market Size by Application (2019-2024) & (US$ Million)
Table 28. Global Thin Shrink Small Outline Package (TSSOP) Revenue Market Share by Application (2019-2024)
Table 29. Global Thin Shrink Small Outline Package (TSSOP) Forecasted Market Size by Application (2025-2030) & (US$ Million)
Table 30. Global Thin Shrink Small Outline Package (TSSOP) Revenue Market Share by Application (2025-2030)
Table 31. North America Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 32. North America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024) & (US$ Million)
Table 33. North America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030) & (US$ Million)
Table 34. Europe Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 35. Europe Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024) & (US$ Million)
Table 36. Europe Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030) & (US$ Million)
Table 37. Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Region (US$ Million): 2019 VS 2023 VS 2030
Table 38. Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2019-2024) & (US$ Million)
Table 39. Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size by Region (2025-2030) & (US$ Million)
Table 40. Latin America Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 41. Latin America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024) & (US$ Million)
Table 42. Latin America Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030) & (US$ Million)
Table 43. Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size Growth Rate by Country (US$ Million): 2019 VS 2023 VS 2030
Table 44. Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2019-2024) & (US$ Million)
Table 45. Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size by Country (2025-2030) & (US$ Million)
Table 46. Amkor Company Detail
Table 47. Amkor Business Overview
Table 48. Amkor Thin Shrink Small Outline Package (TSSOP) Product
Table 49. Amkor Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 50. Amkor Recent Development
Table 51. Nexperia Company Detail
Table 52. Nexperia Business Overview
Table 53. Nexperia Thin Shrink Small Outline Package (TSSOP) Product
Table 54. Nexperia Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 55. Nexperia Recent Development
Table 56. Analog Devices Company Detail
Table 57. Analog Devices Business Overview
Table 58. Analog Devices Thin Shrink Small Outline Package (TSSOP) Product
Table 59. Analog Devices Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 60. Analog Devices Recent Development
Table 61. Microchip Technology Inc Company Detail
Table 62. Microchip Technology Inc Business Overview
Table 63. Microchip Technology Inc Thin Shrink Small Outline Package (TSSOP) Product
Table 64. Microchip Technology Inc Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 65. Microchip Technology Inc Recent Development
Table 66. Orient Semiconductor Electronics Company Detail
Table 67. Orient Semiconductor Electronics Business Overview
Table 68. Orient Semiconductor Electronics Thin Shrink Small Outline Package (TSSOP) Product
Table 69. Orient Semiconductor Electronics Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 70. Orient Semiconductor Electronics Recent Development
Table 71. Texas Instruments Company Detail
Table 72. Texas Instruments Business Overview
Table 73. Texas Instruments Thin Shrink Small Outline Package (TSSOP) Product
Table 74. Texas Instruments Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 75. Texas Instruments Recent Development
Table 76. Renesas Company Detail
Table 77. Renesas Business Overview
Table 78. Renesas Thin Shrink Small Outline Package (TSSOP) Product
Table 79. Renesas Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 80. Renesas Recent Development
Table 81. ON Semiconductor Company Detail
Table 82. ON Semiconductor Business Overview
Table 83. ON Semiconductor Thin Shrink Small Outline Package (TSSOP) Product
Table 84. ON Semiconductor Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 85. ON Semiconductor Recent Development
Table 86. Jameco Electronics Company Detail
Table 87. Jameco Electronics Business Overview
Table 88. Jameco Electronics Thin Shrink Small Outline Package (TSSOP) Product
Table 89. Jameco Electronics Revenue in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024) & (US$ Million)
Table 90. Jameco Electronics Recent Development
Table 91. Research Programs/Design for This Report
Table 92. Key Data Information from Secondary Sources
Table 93. Key Data Information from Primary Sources
List of Figures
Figure 1. Global Thin Shrink Small Outline Package (TSSOP) Market Size Comparison by Type (2024-2030) & (US$ Million)
Figure 2. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Type: 2023 VS 2030
Figure 3. QSOP Features
Figure 4. VSOP Features
Figure 5. Global Thin Shrink Small Outline Package (TSSOP) Market Size Comparison by Application (2024-2030) & (US$ Million)
Figure 6. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Application: 2023 VS 2030
Figure 7. Industrial Case Studies
Figure 8. Auto Industry Case Studies
Figure 9. Electronic Case Studies
Figure 10. Others Case Studies
Figure 11. Thin Shrink Small Outline Package (TSSOP) Report Years Considered
Figure 12. Global Thin Shrink Small Outline Package (TSSOP) Market Size (US$ Million), Year-over-Year: 2019-2030
Figure 13. Global Thin Shrink Small Outline Package (TSSOP) Market Size, (US$ Million), 2019 VS 2023 VS 2030
Figure 14. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Region: 2023 VS 2030
Figure 15. Global Thin Shrink Small Outline Package (TSSOP) Market Share by Players in 2023
Figure 16. Global Top Thin Shrink Small Outline Package (TSSOP) Players by Company Type (Tier 1, Tier 2, and Tier 3) & (based on the Revenue in Thin Shrink Small Outline Package (TSSOP) as of 2023)
Figure 17. The Top 10 and 5 Players Market Share by Thin Shrink Small Outline Package (TSSOP) Revenue in 2023
Figure 18. North America Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 19. North America Thin Shrink Small Outline Package (TSSOP) Market Share by Country (2019-2030)
Figure 20. United States Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 21. Canada Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 22. Europe Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 23. Europe Thin Shrink Small Outline Package (TSSOP) Market Share by Country (2019-2030)
Figure 24. Germany Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 25. France Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 26. U.K. Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 27. Italy Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 28. Russia Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 29. Nordic Countries Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 30. Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 31. Asia-Pacific Thin Shrink Small Outline Package (TSSOP) Market Share by Region (2019-2030)
Figure 32. China Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 33. Japan Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 34. South Korea Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 35. Southeast Asia Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 36. India Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 37. Australia Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 38. Latin America Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 39. Latin America Thin Shrink Small Outline Package (TSSOP) Market Share by Country (2019-2030)
Figure 40. Mexico Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 41. Brazil Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 42. Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 43. Middle East & Africa Thin Shrink Small Outline Package (TSSOP) Market Share by Country (2019-2030)
Figure 44. Turkey Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 45. Saudi Arabia Thin Shrink Small Outline Package (TSSOP) Market Size YoY Growth (2019-2030) & (US$ Million)
Figure 46. Amkor Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 47. Nexperia Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 48. Analog Devices Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 49. Microchip Technology Inc Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 50. Orient Semiconductor Electronics Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 51. Texas Instruments Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 52. Renesas Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 53. ON Semiconductor Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 54. Jameco Electronics Revenue Growth Rate in Thin Shrink Small Outline Package (TSSOP) Business (2019-2024)
Figure 55. Bottom-up and Top-down Approaches for This Report
Figure 56. Data Triangulation
Figure 57. Key Executives Interviewed
Published By : QY Research
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