The Market Reports
Call: +1-631-407-1315 / +91-750-729-1479
Email: sales@themarketreports.com
Global Thinning Machine Market Research Report 2025
Synopsis
The global Thinning Machine market was valued at US$ 902.3 million in 2023 and is anticipated to reach US$ 1194.6 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
Thinning Machine is mainly used for wafer surface processing of material segment and before integrated circuit packaging. The thinning machine removes the substrate material on the back of the wafer by grinding to meet the requirements of chip package thickness and surface roughness, and to improve the heat dissipation effect of the chip. Thinning to a certain thickness is beneficial to the later packaging process. The key palyers of thinning machines in the world include Disco and Tokyo Precision; their market share is about 75%. Japan and China are the main production areas of thinning machines, accounting for 56.46% and 20.47% respectively. The market share of fully automatic thinning machines accounts for about 68.31%, and the market share of 300mm wafer thinning machines accounts for about 81.44%.
In China market, the key players of Thinning Machine include Disco and TOKYO SEIMITSU, etc. The top two players hold a share over 80%. In terms of product type, Fully Automatic is the largest segment, occupied for a share of about 92%, and in terms of application, 300mm Wafer has a share about 80 percent.
This report aims to provide a comprehensive presentation of the global market for Thinning Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thinning Machine.
Report Scope
The Thinning Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thinning Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thinning Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
200mm Wafer
300mm Wafer
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Thinning Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Thinning Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Thinning Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
The global Thinning Machine market was valued at US$ 902.3 million in 2023 and is anticipated to reach US$ 1194.6 million by 2030, witnessing a CAGR of 6.5% during the forecast period 2024-2030.
Thinning Machine is mainly used for wafer surface processing of material segment and before integrated circuit packaging. The thinning machine removes the substrate material on the back of the wafer by grinding to meet the requirements of chip package thickness and surface roughness, and to improve the heat dissipation effect of the chip. Thinning to a certain thickness is beneficial to the later packaging process. The key palyers of thinning machines in the world include Disco and Tokyo Precision; their market share is about 75%. Japan and China are the main production areas of thinning machines, accounting for 56.46% and 20.47% respectively. The market share of fully automatic thinning machines accounts for about 68.31%, and the market share of 300mm wafer thinning machines accounts for about 81.44%.
In China market, the key players of Thinning Machine include Disco and TOKYO SEIMITSU, etc. The top two players hold a share over 80%. In terms of product type, Fully Automatic is the largest segment, occupied for a share of about 92%, and in terms of application, 300mm Wafer has a share about 80 percent.
This report aims to provide a comprehensive presentation of the global market for Thinning Machine, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Thinning Machine.
Report Scope
The Thinning Machine market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Thinning Machine market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Thinning Machine manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Disco
TOKYO SEIMITSU
G&N
Okamoto Semiconductor Equipment Division
CETC
Koyo Machinery
Revasum
WAIDA MFG
Shenzhen Fangda
Hunan Yujing Machine Industrial
SpeedFam
Hauhaiqingke
Segment by Type
Fully Automatic
Semi-Automatic
Segment by Application
200mm Wafer
300mm Wafer
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
United States
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Thinning Machine manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Thinning Machine by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Thinning Machine in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Thinning Machine Market Overview
1.1 Product Definition
1.2 Thinning Machine Segment by Type
1.2.1 Global Thinning Machine Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Fully Automatic
1.2.3 Semi-Automatic
1.3 Thinning Machine Segment by Application
1.3.1 Global Thinning Machine Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 200mm Wafer
1.3.3 300mm Wafer
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Thinning Machine Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Thinning Machine Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Thinning Machine Production Estimates and Forecasts (2019-2030)
1.4.4 Global Thinning Machine Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Thinning Machine Production Market Share by Manufacturers (2019-2024)
2.2 Global Thinning Machine Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Thinning Machine, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Thinning Machine Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Thinning Machine Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Thinning Machine, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Thinning Machine, Product Offered and Application
2.8 Global Key Manufacturers of Thinning Machine, Date of Enter into This Industry
2.9 Thinning Machine Market Competitive Situation and Trends
2.9.1 Thinning Machine Market Concentration Rate
2.9.2 Global 5 and 10 Largest Thinning Machine Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Thinning Machine Production by Region
3.1 Global Thinning Machine Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Thinning Machine Production Value by Region (2019-2030)
3.2.1 Global Thinning Machine Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Thinning Machine by Region (2025-2030)
3.3 Global Thinning Machine Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Thinning Machine Production by Region (2019-2030)
3.4.1 Global Thinning Machine Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Thinning Machine by Region (2025-2030)
3.5 Global Thinning Machine Market Price Analysis by Region (2019-2024)
3.6 Global Thinning Machine Production and Value, Year-over-Year Growth
3.6.1 North America Thinning Machine Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Thinning Machine Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Thinning Machine Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Thinning Machine Production Value Estimates and Forecasts (2019-2030)
4 Thinning Machine Consumption by Region
4.1 Global Thinning Machine Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Thinning Machine Consumption by Region (2019-2030)
4.2.1 Global Thinning Machine Consumption by Region (2019-2024)
4.2.2 Global Thinning Machine Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Thinning Machine Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Thinning Machine Consumption by Country (2019-2030)
4.3.3 United States
4.3.4 Canada
4.4 Europe
4.4.1 Europe Thinning Machine Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Thinning Machine Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Thinning Machine Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Thinning Machine Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Thinning Machine Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Thinning Machine Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Thinning Machine Production by Type (2019-2030)
5.1.1 Global Thinning Machine Production by Type (2019-2024)
5.1.2 Global Thinning Machine Production by Type (2025-2030)
5.1.3 Global Thinning Machine Production Market Share by Type (2019-2030)
5.2 Global Thinning Machine Production Value by Type (2019-2030)
5.2.1 Global Thinning Machine Production Value by Type (2019-2024)
5.2.2 Global Thinning Machine Production Value by Type (2025-2030)
5.2.3 Global Thinning Machine Production Value Market Share by Type (2019-2030)
5.3 Global Thinning Machine Price by Type (2019-2030)
6 Segment by Application
6.1 Global Thinning Machine Production by Application (2019-2030)
6.1.1 Global Thinning Machine Production by Application (2019-2024)
6.1.2 Global Thinning Machine Production by Application (2025-2030)
6.1.3 Global Thinning Machine Production Market Share by Application (2019-2030)
6.2 Global Thinning Machine Production Value by Application (2019-2030)
6.2.1 Global Thinning Machine Production Value by Application (2019-2024)
6.2.2 Global Thinning Machine Production Value by Application (2025-2030)
6.2.3 Global Thinning Machine Production Value Market Share by Application (2019-2030)
6.3 Global Thinning Machine Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Disco
7.1.1 Disco Thinning Machine Corporation Information
7.1.2 Disco Thinning Machine Product Portfolio
7.1.3 Disco Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Disco Main Business and Markets Served
7.1.5 Disco Recent Developments/Updates
7.2 TOKYO SEIMITSU
7.2.1 TOKYO SEIMITSU Thinning Machine Corporation Information
7.2.2 TOKYO SEIMITSU Thinning Machine Product Portfolio
7.2.3 TOKYO SEIMITSU Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.2.4 TOKYO SEIMITSU Main Business and Markets Served
7.2.5 TOKYO SEIMITSU Recent Developments/Updates
7.3 G&N
7.3.1 G&N Thinning Machine Corporation Information
7.3.2 G&N Thinning Machine Product Portfolio
7.3.3 G&N Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.3.4 G&N Main Business and Markets Served
7.3.5 G&N Recent Developments/Updates
7.4 Okamoto Semiconductor Equipment Division
7.4.1 Okamoto Semiconductor Equipment Division Thinning Machine Corporation Information
7.4.2 Okamoto Semiconductor Equipment Division Thinning Machine Product Portfolio
7.4.3 Okamoto Semiconductor Equipment Division Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Okamoto Semiconductor Equipment Division Main Business and Markets Served
7.4.5 Okamoto Semiconductor Equipment Division Recent Developments/Updates
7.5 CETC
7.5.1 CETC Thinning Machine Corporation Information
7.5.2 CETC Thinning Machine Product Portfolio
7.5.3 CETC Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.5.4 CETC Main Business and Markets Served
7.5.5 CETC Recent Developments/Updates
7.6 Koyo Machinery
7.6.1 Koyo Machinery Thinning Machine Corporation Information
7.6.2 Koyo Machinery Thinning Machine Product Portfolio
7.6.3 Koyo Machinery Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.6.4 Koyo Machinery Main Business and Markets Served
7.6.5 Koyo Machinery Recent Developments/Updates
7.7 Revasum
7.7.1 Revasum Thinning Machine Corporation Information
7.7.2 Revasum Thinning Machine Product Portfolio
7.7.3 Revasum Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Revasum Main Business and Markets Served
7.7.5 Revasum Recent Developments/Updates
7.8 WAIDA MFG
7.8.1 WAIDA MFG Thinning Machine Corporation Information
7.8.2 WAIDA MFG Thinning Machine Product Portfolio
7.8.3 WAIDA MFG Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.8.4 WAIDA MFG Main Business and Markets Served
7.7.5 WAIDA MFG Recent Developments/Updates
7.9 Shenzhen Fangda
7.9.1 Shenzhen Fangda Thinning Machine Corporation Information
7.9.2 Shenzhen Fangda Thinning Machine Product Portfolio
7.9.3 Shenzhen Fangda Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.9.4 Shenzhen Fangda Main Business and Markets Served
7.9.5 Shenzhen Fangda Recent Developments/Updates
7.10 Hunan Yujing Machine Industrial
7.10.1 Hunan Yujing Machine Industrial Thinning Machine Corporation Information
7.10.2 Hunan Yujing Machine Industrial Thinning Machine Product Portfolio
7.10.3 Hunan Yujing Machine Industrial Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.10.4 Hunan Yujing Machine Industrial Main Business and Markets Served
7.10.5 Hunan Yujing Machine Industrial Recent Developments/Updates
7.11 SpeedFam
7.11.1 SpeedFam Thinning Machine Corporation Information
7.11.2 SpeedFam Thinning Machine Product Portfolio
7.11.3 SpeedFam Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.11.4 SpeedFam Main Business and Markets Served
7.11.5 SpeedFam Recent Developments/Updates
7.12 Hauhaiqingke
7.12.1 Hauhaiqingke Thinning Machine Corporation Information
7.12.2 Hauhaiqingke Thinning Machine Product Portfolio
7.12.3 Hauhaiqingke Thinning Machine Production, Value, Price and Gross Margin (2019-2024)
7.12.4 Hauhaiqingke Main Business and Markets Served
7.12.5 Hauhaiqingke Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Thinning Machine Industry Chain Analysis
8.2 Thinning Machine Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Thinning Machine Production Mode & Process
8.4 Thinning Machine Sales and Marketing
8.4.1 Thinning Machine Sales Channels
8.4.2 Thinning Machine Distributors
8.5 Thinning Machine Customers
9 Thinning Machine Market Dynamics
9.1 Thinning Machine Industry Trends
9.2 Thinning Machine Market Drivers
9.3 Thinning Machine Market Challenges
9.4 Thinning Machine Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
Why ‘The Market Reports’
In Business:
Pre Sales Support:
Post Sales Support:
Turn Around Time:
Clients Served:
Clients Assisted:
Client Types:
Payment:
- Accept global payments [Credit Card / PayPal / Wire Transfer]
- Accept local payments in South Korea, Germany, China and India [Can pay in local currency]
Latest Industrial Market Reports
Payments Accepted From
Connect with us at
Complete Secure Website
