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Global Wafer Blade Dicers Market 2025 by Manufacturers, Regions, Type and Application, Forecast to 2029
Synopsis
The global Wafer Blade Dicers market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Wafer blade dicers are cutting machines used in the semiconductor industry to separate wafers into individual chips or devices. Unlike wafer laser dicers that use lasers for cutting, blade dicers employ mechanical diamond blades to perform the slicing operation.
This report is a detailed and comprehensive analysis for global Wafer Blade Dicers market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Wafer Blade Dicers market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Blade Dicers
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace.
This report profiles key players in the global Wafer Blade Dicers market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint and GL Tech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Wafer Blade Dicers market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
Semiconductor
Led
Photovoltaic
Others
Major players covered
DISCO
Tokyo Seimitsu
Advanced Dicing Technologies (ADT)
Loadpoint
GL Tech
CETC
Shenyang Heyan Technology
Jiangsu Jingchuang Advanced Electronic Technology
Shenzhen Hi-Test Semiconductor Equipment
Shenzhen Tensun Precision Equipment
Zhengzhou Qisheng Precision Manufacturing
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Blade Dicers product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Blade Dicers, with price, sales, revenue and global market share of Wafer Blade Dicers from 2018 to 2023.
Chapter 3, the Wafer Blade Dicers competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Blade Dicers breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Wafer Blade Dicers market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Blade Dicers.
Chapter 14 and 15, to describe Wafer Blade Dicers sales channel, distributors, customers, research findings and conclusion.
The global Wafer Blade Dicers market size was valued at USD million in 2022 and is forecast to a readjusted size of USD million by 2029 with a CAGR of % during review period. The influence of COVID-19 and the Russia-Ukraine War were considered while estimating market sizes.
Wafer blade dicers are cutting machines used in the semiconductor industry to separate wafers into individual chips or devices. Unlike wafer laser dicers that use lasers for cutting, blade dicers employ mechanical diamond blades to perform the slicing operation.
This report is a detailed and comprehensive analysis for global Wafer Blade Dicers market. Both quantitative and qualitative analyses are presented by manufacturers, by region & country, by Type and by Application. As the market is constantly changing, this report explores the competition, supply and demand trends, as well as key factors that contribute to its changing demands across many markets. Company profiles and product examples of selected competitors, along with market share estimates of some of the selected leaders for the year 2023, are provided.
Key Features:
Global Wafer Blade Dicers market size and forecasts, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market size and forecasts by region and country, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market size and forecasts, by Type and by Application, in consumption value ($ Million), sales quantity (K Units), and average selling prices (US$/Unit), 2018-2029
Global Wafer Blade Dicers market shares of main players, shipments in revenue ($ Million), sales quantity (K Units), and ASP (US$/Unit), 2018-2023.
The Primary Objectives in This Report Are:
To determine the size of the total market opportunity of global and key countries
To assess the growth potential for Wafer Blade Dicers
To forecast future growth in each product and end-use market
To assess competitive factors affecting the marketplace.
This report profiles key players in the global Wafer Blade Dicers market based on the following parameters - company overview, production, value, price, gross margin, product portfolio, geographical presence, and key developments. Key companies covered as a part of this study include DISCO, Tokyo Seimitsu, Advanced Dicing Technologies (ADT), Loadpoint and GL Tech, etc.
This report also provides key insights about market drivers, restraints, opportunities, new product launches or approvals, COVID-19 and Russia-Ukraine War Influence.
Market Segmentation
Wafer Blade Dicers market is split by Type and by Application. For the period 2018-2029, the growth among segments provides accurate calculations and forecasts for consumption value by Type, and by Application in terms of volume and value. This analysis can help you expand your business by targeting qualified niche markets.
Market segment by Type
Fully Automatic
Semi-Automatic
Market segment by Application
Semiconductor
Led
Photovoltaic
Others
Major players covered
DISCO
Tokyo Seimitsu
Advanced Dicing Technologies (ADT)
Loadpoint
GL Tech
CETC
Shenyang Heyan Technology
Jiangsu Jingchuang Advanced Electronic Technology
Shenzhen Hi-Test Semiconductor Equipment
Shenzhen Tensun Precision Equipment
Zhengzhou Qisheng Precision Manufacturing
Market segment by region, regional analysis covers
North America (United States, Canada and Mexico)
Europe (Germany, France, United Kingdom, Russia, Italy, and Rest of Europe)
Asia-Pacific (China, Japan, Korea, India, Southeast Asia, and Australia)
South America (Brazil, Argentina, Colombia, and Rest of South America)
Middle East & Africa (Saudi Arabia, UAE, Egypt, South Africa, and Rest of Middle East & Africa)
The content of the study subjects, includes a total of 15 chapters:
Chapter 1, to describe Wafer Blade Dicers product scope, market overview, market estimation caveats and base year.
Chapter 2, to profile the top manufacturers of Wafer Blade Dicers, with price, sales, revenue and global market share of Wafer Blade Dicers from 2018 to 2023.
Chapter 3, the Wafer Blade Dicers competitive situation, sales quantity, revenue and global market share of top manufacturers are analyzed emphatically by landscape contrast.
Chapter 4, the Wafer Blade Dicers breakdown data are shown at the regional level, to show the sales quantity, consumption value and growth by regions, from 2018 to 2029.
Chapter 5 and 6, to segment the sales by Type and application, with sales market share and growth rate by type, application, from 2018 to 2029.
Chapter 7, 8, 9, 10 and 11, to break the sales data at the country level, with sales quantity, consumption value and market share for key countries in the world, from 2017 to 2022.and Wafer Blade Dicers market forecast, by regions, type and application, with sales and revenue, from 2024 to 2029.
Chapter 12, market dynamics, drivers, restraints, trends, Porters Five Forces analysis, and Influence of COVID-19 and Russia-Ukraine War.
Chapter 13, the key raw materials and key suppliers, and industry chain of Wafer Blade Dicers.
Chapter 14 and 15, to describe Wafer Blade Dicers sales channel, distributors, customers, research findings and conclusion.
Index1 Market Overview
1.1 Product Overview and Scope of Wafer Blade Dicers
1.2 Market Estimation Caveats and Base Year
1.3 Market Analysis by Type
1.3.1 Overview: Global Wafer Blade Dicers Consumption Value by Type: 2018 Versus 2022 Versus 2029
1.3.2 Fully Automatic
1.3.3 Semi-Automatic
1.4 Market Analysis by Application
1.4.1 Overview: Global Wafer Blade Dicers Consumption Value by Application: 2018 Versus 2022 Versus 2029
1.4.2 Semiconductor
1.4.3 Led
1.4.4 Photovoltaic
1.4.5 Others
1.5 Global Wafer Blade Dicers Market Size & Forecast
1.5.1 Global Wafer Blade Dicers Consumption Value (2018 & 2022 & 2029)
1.5.2 Global Wafer Blade Dicers Sales Quantity (2018-2029)
1.5.3 Global Wafer Blade Dicers Average Price (2018-2029)
2 Manufacturers Profiles
2.1 DISCO
2.1.1 DISCO Details
2.1.2 DISCO Major Business
2.1.3 DISCO Wafer Blade Dicers Product and Services
2.1.4 DISCO Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.1.5 DISCO Recent Developments/Updates
2.2 Tokyo Seimitsu
2.2.1 Tokyo Seimitsu Details
2.2.2 Tokyo Seimitsu Major Business
2.2.3 Tokyo Seimitsu Wafer Blade Dicers Product and Services
2.2.4 Tokyo Seimitsu Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.2.5 Tokyo Seimitsu Recent Developments/Updates
2.3 Advanced Dicing Technologies (ADT)
2.3.1 Advanced Dicing Technologies (ADT) Details
2.3.2 Advanced Dicing Technologies (ADT) Major Business
2.3.3 Advanced Dicing Technologies (ADT) Wafer Blade Dicers Product and Services
2.3.4 Advanced Dicing Technologies (ADT) Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.3.5 Advanced Dicing Technologies (ADT) Recent Developments/Updates
2.4 Loadpoint
2.4.1 Loadpoint Details
2.4.2 Loadpoint Major Business
2.4.3 Loadpoint Wafer Blade Dicers Product and Services
2.4.4 Loadpoint Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.4.5 Loadpoint Recent Developments/Updates
2.5 GL Tech
2.5.1 GL Tech Details
2.5.2 GL Tech Major Business
2.5.3 GL Tech Wafer Blade Dicers Product and Services
2.5.4 GL Tech Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.5.5 GL Tech Recent Developments/Updates
2.6 CETC
2.6.1 CETC Details
2.6.2 CETC Major Business
2.6.3 CETC Wafer Blade Dicers Product and Services
2.6.4 CETC Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.6.5 CETC Recent Developments/Updates
2.7 Shenyang Heyan Technology
2.7.1 Shenyang Heyan Technology Details
2.7.2 Shenyang Heyan Technology Major Business
2.7.3 Shenyang Heyan Technology Wafer Blade Dicers Product and Services
2.7.4 Shenyang Heyan Technology Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.7.5 Shenyang Heyan Technology Recent Developments/Updates
2.8 Jiangsu Jingchuang Advanced Electronic Technology
2.8.1 Jiangsu Jingchuang Advanced Electronic Technology Details
2.8.2 Jiangsu Jingchuang Advanced Electronic Technology Major Business
2.8.3 Jiangsu Jingchuang Advanced Electronic Technology Wafer Blade Dicers Product and Services
2.8.4 Jiangsu Jingchuang Advanced Electronic Technology Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.8.5 Jiangsu Jingchuang Advanced Electronic Technology Recent Developments/Updates
2.9 Shenzhen Hi-Test Semiconductor Equipment
2.9.1 Shenzhen Hi-Test Semiconductor Equipment Details
2.9.2 Shenzhen Hi-Test Semiconductor Equipment Major Business
2.9.3 Shenzhen Hi-Test Semiconductor Equipment Wafer Blade Dicers Product and Services
2.9.4 Shenzhen Hi-Test Semiconductor Equipment Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.9.5 Shenzhen Hi-Test Semiconductor Equipment Recent Developments/Updates
2.10 Shenzhen Tensun Precision Equipment
2.10.1 Shenzhen Tensun Precision Equipment Details
2.10.2 Shenzhen Tensun Precision Equipment Major Business
2.10.3 Shenzhen Tensun Precision Equipment Wafer Blade Dicers Product and Services
2.10.4 Shenzhen Tensun Precision Equipment Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.10.5 Shenzhen Tensun Precision Equipment Recent Developments/Updates
2.11 Zhengzhou Qisheng Precision Manufacturing
2.11.1 Zhengzhou Qisheng Precision Manufacturing Details
2.11.2 Zhengzhou Qisheng Precision Manufacturing Major Business
2.11.3 Zhengzhou Qisheng Precision Manufacturing Wafer Blade Dicers Product and Services
2.11.4 Zhengzhou Qisheng Precision Manufacturing Wafer Blade Dicers Sales Quantity, Average Price, Revenue, Gross Margin and Market Share (2018-2023)
2.11.5 Zhengzhou Qisheng Precision Manufacturing Recent Developments/Updates
3 Competitive Environment: Wafer Blade Dicers by Manufacturer
3.1 Global Wafer Blade Dicers Sales Quantity by Manufacturer (2018-2023)
3.2 Global Wafer Blade Dicers Revenue by Manufacturer (2018-2023)
3.3 Global Wafer Blade Dicers Average Price by Manufacturer (2018-2023)
3.4 Market Share Analysis (2022)
3.4.1 Producer Shipments of Wafer Blade Dicers by Manufacturer Revenue ($MM) and Market Share (%): 2022
3.4.2 Top 3 Wafer Blade Dicers Manufacturer Market Share in 2022
3.4.2 Top 6 Wafer Blade Dicers Manufacturer Market Share in 2022
3.5 Wafer Blade Dicers Market: Overall Company Footprint Analysis
3.5.1 Wafer Blade Dicers Market: Region Footprint
3.5.2 Wafer Blade Dicers Market: Company Product Type Footprint
3.5.3 Wafer Blade Dicers Market: Company Product Application Footprint
3.6 New Market Entrants and Barriers to Market Entry
3.7 Mergers, Acquisition, Agreements, and Collaborations
4 Consumption Analysis by Region
4.1 Global Wafer Blade Dicers Market Size by Region
4.1.1 Global Wafer Blade Dicers Sales Quantity by Region (2018-2029)
4.1.2 Global Wafer Blade Dicers Consumption Value by Region (2018-2029)
4.1.3 Global Wafer Blade Dicers Average Price by Region (2018-2029)
4.2 North America Wafer Blade Dicers Consumption Value (2018-2029)
4.3 Europe Wafer Blade Dicers Consumption Value (2018-2029)
4.4 Asia-Pacific Wafer Blade Dicers Consumption Value (2018-2029)
4.5 South America Wafer Blade Dicers Consumption Value (2018-2029)
4.6 Middle East and Africa Wafer Blade Dicers Consumption Value (2018-2029)
5 Market Segment by Type
5.1 Global Wafer Blade Dicers Sales Quantity by Type (2018-2029)
5.2 Global Wafer Blade Dicers Consumption Value by Type (2018-2029)
5.3 Global Wafer Blade Dicers Average Price by Type (2018-2029)
6 Market Segment by Application
6.1 Global Wafer Blade Dicers Sales Quantity by Application (2018-2029)
6.2 Global Wafer Blade Dicers Consumption Value by Application (2018-2029)
6.3 Global Wafer Blade Dicers Average Price by Application (2018-2029)
7 North America
7.1 North America Wafer Blade Dicers Sales Quantity by Type (2018-2029)
7.2 North America Wafer Blade Dicers Sales Quantity by Application (2018-2029)
7.3 North America Wafer Blade Dicers Market Size by Country
7.3.1 North America Wafer Blade Dicers Sales Quantity by Country (2018-2029)
7.3.2 North America Wafer Blade Dicers Consumption Value by Country (2018-2029)
7.3.3 United States Market Size and Forecast (2018-2029)
7.3.4 Canada Market Size and Forecast (2018-2029)
7.3.5 Mexico Market Size and Forecast (2018-2029)
8 Europe
8.1 Europe Wafer Blade Dicers Sales Quantity by Type (2018-2029)
8.2 Europe Wafer Blade Dicers Sales Quantity by Application (2018-2029)
8.3 Europe Wafer Blade Dicers Market Size by Country
8.3.1 Europe Wafer Blade Dicers Sales Quantity by Country (2018-2029)
8.3.2 Europe Wafer Blade Dicers Consumption Value by Country (2018-2029)
8.3.3 Germany Market Size and Forecast (2018-2029)
8.3.4 France Market Size and Forecast (2018-2029)
8.3.5 United Kingdom Market Size and Forecast (2018-2029)
8.3.6 Russia Market Size and Forecast (2018-2029)
8.3.7 Italy Market Size and Forecast (2018-2029)
9 Asia-Pacific
9.1 Asia-Pacific Wafer Blade Dicers Sales Quantity by Type (2018-2029)
9.2 Asia-Pacific Wafer Blade Dicers Sales Quantity by Application (2018-2029)
9.3 Asia-Pacific Wafer Blade Dicers Market Size by Region
9.3.1 Asia-Pacific Wafer Blade Dicers Sales Quantity by Region (2018-2029)
9.3.2 Asia-Pacific Wafer Blade Dicers Consumption Value by Region (2018-2029)
9.3.3 China Market Size and Forecast (2018-2029)
9.3.4 Japan Market Size and Forecast (2018-2029)
9.3.5 Korea Market Size and Forecast (2018-2029)
9.3.6 India Market Size and Forecast (2018-2029)
9.3.7 Southeast Asia Market Size and Forecast (2018-2029)
9.3.8 Australia Market Size and Forecast (2018-2029)
10 South America
10.1 South America Wafer Blade Dicers Sales Quantity by Type (2018-2029)
10.2 South America Wafer Blade Dicers Sales Quantity by Application (2018-2029)
10.3 South America Wafer Blade Dicers Market Size by Country
10.3.1 South America Wafer Blade Dicers Sales Quantity by Country (2018-2029)
10.3.2 South America Wafer Blade Dicers Consumption Value by Country (2018-2029)
10.3.3 Brazil Market Size and Forecast (2018-2029)
10.3.4 Argentina Market Size and Forecast (2018-2029)
11 Middle East & Africa
11.1 Middle East & Africa Wafer Blade Dicers Sales Quantity by Type (2018-2029)
11.2 Middle East & Africa Wafer Blade Dicers Sales Quantity by Application (2018-2029)
11.3 Middle East & Africa Wafer Blade Dicers Market Size by Country
11.3.1 Middle East & Africa Wafer Blade Dicers Sales Quantity by Country (2018-2029)
11.3.2 Middle East & Africa Wafer Blade Dicers Consumption Value by Country (2018-2029)
11.3.3 Turkey Market Size and Forecast (2018-2029)
11.3.4 Egypt Market Size and Forecast (2018-2029)
11.3.5 Saudi Arabia Market Size and Forecast (2018-2029)
11.3.6 South Africa Market Size and Forecast (2018-2029)
12 Market Dynamics
12.1 Wafer Blade Dicers Market Drivers
12.2 Wafer Blade Dicers Market Restraints
12.3 Wafer Blade Dicers Trends Analysis
12.4 Porters Five Forces Analysis
12.4.1 Threat of New Entrants
12.4.2 Bargaining Power of Suppliers
12.4.3 Bargaining Power of Buyers
12.4.4 Threat of Substitutes
12.4.5 Competitive Rivalry
12.5 Influence of COVID-19 and Russia-Ukraine War
12.5.1 Influence of COVID-19
12.5.2 Influence of Russia-Ukraine War
13 Raw Material and Industry Chain
13.1 Raw Material of Wafer Blade Dicers and Key Manufacturers
13.2 Manufacturing Costs Percentage of Wafer Blade Dicers
13.3 Wafer Blade Dicers Production Process
13.4 Wafer Blade Dicers Industrial Chain
14 Shipments by Distribution Channel
14.1 Sales Channel
14.1.1 Direct to End-User
14.1.2 Distributors
14.2 Wafer Blade Dicers Typical Distributors
14.3 Wafer Blade Dicers Typical Customers
15 Research Findings and Conclusion
16 Appendix
16.1 Methodology
16.2 Research Process and Data Source
16.3 Disclaimer
Published By : GlobalInfoResearch
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