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Global Wafer Saw Machines Market Research Report 2025
Synopsis
Dicing machine cut wafers into individual semiconductor chips with blades.
The global Wafer Saw Machines market was valued at US$ 862 million in 2023 and is anticipated to reach US$ 1227.2 million by 2030, witnessing a CAGR of 5.8% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Wafer Saw Machines, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Saw Machines.
Report Scope
The Wafer Saw Machines market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Saw Machines market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Saw Machines manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Accretech
DISCO Corporation
Advanced Dicing Technology
Loadpoint
Dynatex International
3D-Micromac AG
Shenzhen tensun industrial equipment
Beijing Dianke Electronic Equipment
HEYAN TECHNOLOGY
SUNIC SOLAR
HGLASER
Segment by Type
Laser Dicing Machines
Blades Dicing Machine
Segment by Application
Solar
Semiconductor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Saw Machines manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Saw Machines by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Saw Machines in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Dicing machine cut wafers into individual semiconductor chips with blades.
The global Wafer Saw Machines market was valued at US$ 862 million in 2023 and is anticipated to reach US$ 1227.2 million by 2030, witnessing a CAGR of 5.8% during the forecast period 2024-2030.
According to our Semiconductor Research Center, in 2022, the global semiconductor equipment was valued at US$ 109 billion. China mainland, China Taiwan and South Korea have a combined market share over 70%. North America, Europe and Japan, have a combined market share of 23%. The key drivers are high performance computing, AI, cloud computing, Servers, 5G and EV (electric vehicle), etc.
This report aims to provide a comprehensive presentation of the global market for Wafer Saw Machines, with both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Wafer Saw Machines.
Report Scope
The Wafer Saw Machines market size, estimations, and forecasts are provided in terms of output/shipments (Units) and revenue ($ millions), considering 2023 as the base year, with history and forecast data for the period from 2019 to 2030. This report segments the global Wafer Saw Machines market comprehensively. Regional market sizes, concerning products by Type, by Application, and by players, are also provided.
For a more in-depth understanding of the market, the report provides profiles of the competitive landscape, key competitors, and their respective market ranks. The report also discusses technological trends and new product developments.
The report will help the Wafer Saw Machines manufacturers, new entrants, and industry chain related companies in this market with information on the revenues, production, and average price for the overall market and the sub-segments across the different segments, by company, by Type, by Application, and by regions.
Market Segmentation
By Company
Accretech
DISCO Corporation
Advanced Dicing Technology
Loadpoint
Dynatex International
3D-Micromac AG
Shenzhen tensun industrial equipment
Beijing Dianke Electronic Equipment
HEYAN TECHNOLOGY
SUNIC SOLAR
HGLASER
Segment by Type
Laser Dicing Machines
Blades Dicing Machine
Segment by Application
Solar
Semiconductor
Others
Production by Region
North America
Europe
China
Japan
Consumption by Region
North America
U.S.
Canada
Europe
Germany
France
U.K.
Italy
Russia
Asia-Pacific
China
Japan
South Korea
China Taiwan
Southeast Asia
India
Latin America, Middle East & Africa
Mexico
Brazil
Turkey
GCC Countries
Chapter Outline
Chapter 1: Introduces the report scope of the report, executive summary of different market segments (by region, by Type, by Application, etc), including the market size of each market segment, future development potential, and so on. It offers a high-level view of the current state of the market and its likely evolution in the short to mid-term, and long term.
Chapter 2: Detailed analysis of Wafer Saw Machines manufacturers competitive landscape, price, production and value market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Production/output, value of Wafer Saw Machines by region/country. It provides a quantitative analysis of the market size and development potential of each region in the next six years.
Chapter 4: Consumption of Wafer Saw Machines in regional level and country level. It provides a quantitative analysis of the market size and development potential of each region and its main countries and introduces the market development, future development prospects, market space, and production of each country in the world.
Chapter 5: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 6: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product production/output, value, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Introduces the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 10: The main points and conclusions of the report.
Index1 Wafer Saw Machines Market Overview
1.1 Product Definition
1.2 Wafer Saw Machines Segment by Type
1.2.1 Global Wafer Saw Machines Market Value Growth Rate Analysis by Type 2023 VS 2030
1.2.2 Laser Dicing Machines
1.2.3 Blades Dicing Machine
1.3 Wafer Saw Machines Segment by Application
1.3.1 Global Wafer Saw Machines Market Value Growth Rate Analysis by Application: 2023 VS 2030
1.3.2 Solar
1.3.3 Semiconductor
1.3.4 Others
1.4 Global Market Growth Prospects
1.4.1 Global Wafer Saw Machines Production Value Estimates and Forecasts (2019-2030)
1.4.2 Global Wafer Saw Machines Production Capacity Estimates and Forecasts (2019-2030)
1.4.3 Global Wafer Saw Machines Production Estimates and Forecasts (2019-2030)
1.4.4 Global Wafer Saw Machines Market Average Price Estimates and Forecasts (2019-2030)
1.5 Assumptions and Limitations
2 Market Competition by Manufacturers
2.1 Global Wafer Saw Machines Production Market Share by Manufacturers (2019-2024)
2.2 Global Wafer Saw Machines Production Value Market Share by Manufacturers (2019-2024)
2.3 Global Key Players of Wafer Saw Machines, Industry Ranking, 2022 VS 2023 VS 2024
2.4 Global Wafer Saw Machines Market Share by Company Type (Tier 1, Tier 2 and Tier 3)
2.5 Global Wafer Saw Machines Average Price by Manufacturers (2019-2024)
2.6 Global Key Manufacturers of Wafer Saw Machines, Manufacturing Base Distribution and Headquarters
2.7 Global Key Manufacturers of Wafer Saw Machines, Product Offered and Application
2.8 Global Key Manufacturers of Wafer Saw Machines, Date of Enter into This Industry
2.9 Wafer Saw Machines Market Competitive Situation and Trends
2.9.1 Wafer Saw Machines Market Concentration Rate
2.9.2 Global 5 and 10 Largest Wafer Saw Machines Players Market Share by Revenue
2.10 Mergers & Acquisitions, Expansion
3 Wafer Saw Machines Production by Region
3.1 Global Wafer Saw Machines Production Value Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.2 Global Wafer Saw Machines Production Value by Region (2019-2030)
3.2.1 Global Wafer Saw Machines Production Value Market Share by Region (2019-2024)
3.2.2 Global Forecasted Production Value of Wafer Saw Machines by Region (2025-2030)
3.3 Global Wafer Saw Machines Production Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
3.4 Global Wafer Saw Machines Production by Region (2019-2030)
3.4.1 Global Wafer Saw Machines Production Market Share by Region (2019-2024)
3.4.2 Global Forecasted Production of Wafer Saw Machines by Region (2025-2030)
3.5 Global Wafer Saw Machines Market Price Analysis by Region (2019-2024)
3.6 Global Wafer Saw Machines Production and Value, Year-over-Year Growth
3.6.1 North America Wafer Saw Machines Production Value Estimates and Forecasts (2019-2030)
3.6.2 Europe Wafer Saw Machines Production Value Estimates and Forecasts (2019-2030)
3.6.3 China Wafer Saw Machines Production Value Estimates and Forecasts (2019-2030)
3.6.4 Japan Wafer Saw Machines Production Value Estimates and Forecasts (2019-2030)
4 Wafer Saw Machines Consumption by Region
4.1 Global Wafer Saw Machines Consumption Estimates and Forecasts by Region: 2019 VS 2023 VS 2030
4.2 Global Wafer Saw Machines Consumption by Region (2019-2030)
4.2.1 Global Wafer Saw Machines Consumption by Region (2019-2024)
4.2.2 Global Wafer Saw Machines Forecasted Consumption by Region (2025-2030)
4.3 North America
4.3.1 North America Wafer Saw Machines Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.3.2 North America Wafer Saw Machines Consumption by Country (2019-2030)
4.3.3 U.S.
4.3.4 Canada
4.4 Europe
4.4.1 Europe Wafer Saw Machines Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.4.2 Europe Wafer Saw Machines Consumption by Country (2019-2030)
4.4.3 Germany
4.4.4 France
4.4.5 U.K.
4.4.6 Italy
4.4.7 Russia
4.5 Asia Pacific
4.5.1 Asia Pacific Wafer Saw Machines Consumption Growth Rate by Region: 2019 VS 2023 VS 2030
4.5.2 Asia Pacific Wafer Saw Machines Consumption by Region (2019-2030)
4.5.3 China
4.5.4 Japan
4.5.5 South Korea
4.5.6 China Taiwan
4.5.7 Southeast Asia
4.5.8 India
4.6 Latin America, Middle East & Africa
4.6.1 Latin America, Middle East & Africa Wafer Saw Machines Consumption Growth Rate by Country: 2019 VS 2023 VS 2030
4.6.2 Latin America, Middle East & Africa Wafer Saw Machines Consumption by Country (2019-2030)
4.6.3 Mexico
4.6.4 Brazil
4.6.5 Turkey
5 Segment by Type
5.1 Global Wafer Saw Machines Production by Type (2019-2030)
5.1.1 Global Wafer Saw Machines Production by Type (2019-2024)
5.1.2 Global Wafer Saw Machines Production by Type (2025-2030)
5.1.3 Global Wafer Saw Machines Production Market Share by Type (2019-2030)
5.2 Global Wafer Saw Machines Production Value by Type (2019-2030)
5.2.1 Global Wafer Saw Machines Production Value by Type (2019-2024)
5.2.2 Global Wafer Saw Machines Production Value by Type (2025-2030)
5.2.3 Global Wafer Saw Machines Production Value Market Share by Type (2019-2030)
5.3 Global Wafer Saw Machines Price by Type (2019-2030)
6 Segment by Application
6.1 Global Wafer Saw Machines Production by Application (2019-2030)
6.1.1 Global Wafer Saw Machines Production by Application (2019-2024)
6.1.2 Global Wafer Saw Machines Production by Application (2025-2030)
6.1.3 Global Wafer Saw Machines Production Market Share by Application (2019-2030)
6.2 Global Wafer Saw Machines Production Value by Application (2019-2030)
6.2.1 Global Wafer Saw Machines Production Value by Application (2019-2024)
6.2.2 Global Wafer Saw Machines Production Value by Application (2025-2030)
6.2.3 Global Wafer Saw Machines Production Value Market Share by Application (2019-2030)
6.3 Global Wafer Saw Machines Price by Application (2019-2030)
7 Key Companies Profiled
7.1 Accretech
7.1.1 Accretech Wafer Saw Machines Corporation Information
7.1.2 Accretech Wafer Saw Machines Product Portfolio
7.1.3 Accretech Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.1.4 Accretech Main Business and Markets Served
7.1.5 Accretech Recent Developments/Updates
7.2 DISCO Corporation
7.2.1 DISCO Corporation Wafer Saw Machines Corporation Information
7.2.2 DISCO Corporation Wafer Saw Machines Product Portfolio
7.2.3 DISCO Corporation Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.2.4 DISCO Corporation Main Business and Markets Served
7.2.5 DISCO Corporation Recent Developments/Updates
7.3 Advanced Dicing Technology
7.3.1 Advanced Dicing Technology Wafer Saw Machines Corporation Information
7.3.2 Advanced Dicing Technology Wafer Saw Machines Product Portfolio
7.3.3 Advanced Dicing Technology Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.3.4 Advanced Dicing Technology Main Business and Markets Served
7.3.5 Advanced Dicing Technology Recent Developments/Updates
7.4 Loadpoint
7.4.1 Loadpoint Wafer Saw Machines Corporation Information
7.4.2 Loadpoint Wafer Saw Machines Product Portfolio
7.4.3 Loadpoint Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.4.4 Loadpoint Main Business and Markets Served
7.4.5 Loadpoint Recent Developments/Updates
7.5 Dynatex International
7.5.1 Dynatex International Wafer Saw Machines Corporation Information
7.5.2 Dynatex International Wafer Saw Machines Product Portfolio
7.5.3 Dynatex International Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.5.4 Dynatex International Main Business and Markets Served
7.5.5 Dynatex International Recent Developments/Updates
7.6 3D-Micromac AG
7.6.1 3D-Micromac AG Wafer Saw Machines Corporation Information
7.6.2 3D-Micromac AG Wafer Saw Machines Product Portfolio
7.6.3 3D-Micromac AG Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.6.4 3D-Micromac AG Main Business and Markets Served
7.6.5 3D-Micromac AG Recent Developments/Updates
7.7 Shenzhen tensun industrial equipment
7.7.1 Shenzhen tensun industrial equipment Wafer Saw Machines Corporation Information
7.7.2 Shenzhen tensun industrial equipment Wafer Saw Machines Product Portfolio
7.7.3 Shenzhen tensun industrial equipment Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.7.4 Shenzhen tensun industrial equipment Main Business and Markets Served
7.7.5 Shenzhen tensun industrial equipment Recent Developments/Updates
7.8 Beijing Dianke Electronic Equipment
7.8.1 Beijing Dianke Electronic Equipment Wafer Saw Machines Corporation Information
7.8.2 Beijing Dianke Electronic Equipment Wafer Saw Machines Product Portfolio
7.8.3 Beijing Dianke Electronic Equipment Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.8.4 Beijing Dianke Electronic Equipment Main Business and Markets Served
7.7.5 Beijing Dianke Electronic Equipment Recent Developments/Updates
7.9 HEYAN TECHNOLOGY
7.9.1 HEYAN TECHNOLOGY Wafer Saw Machines Corporation Information
7.9.2 HEYAN TECHNOLOGY Wafer Saw Machines Product Portfolio
7.9.3 HEYAN TECHNOLOGY Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.9.4 HEYAN TECHNOLOGY Main Business and Markets Served
7.9.5 HEYAN TECHNOLOGY Recent Developments/Updates
7.10 SUNIC SOLAR
7.10.1 SUNIC SOLAR Wafer Saw Machines Corporation Information
7.10.2 SUNIC SOLAR Wafer Saw Machines Product Portfolio
7.10.3 SUNIC SOLAR Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.10.4 SUNIC SOLAR Main Business and Markets Served
7.10.5 SUNIC SOLAR Recent Developments/Updates
7.11 HGLASER
7.11.1 HGLASER Wafer Saw Machines Corporation Information
7.11.2 HGLASER Wafer Saw Machines Product Portfolio
7.11.3 HGLASER Wafer Saw Machines Production, Value, Price and Gross Margin (2019-2024)
7.11.4 HGLASER Main Business and Markets Served
7.11.5 HGLASER Recent Developments/Updates
8 Industry Chain and Sales Channels Analysis
8.1 Wafer Saw Machines Industry Chain Analysis
8.2 Wafer Saw Machines Key Raw Materials
8.2.1 Key Raw Materials
8.2.2 Raw Materials Key Suppliers
8.3 Wafer Saw Machines Production Mode & Process
8.4 Wafer Saw Machines Sales and Marketing
8.4.1 Wafer Saw Machines Sales Channels
8.4.2 Wafer Saw Machines Distributors
8.5 Wafer Saw Machines Customers
9 Wafer Saw Machines Market Dynamics
9.1 Wafer Saw Machines Industry Trends
9.2 Wafer Saw Machines Market Drivers
9.3 Wafer Saw Machines Market Challenges
9.4 Wafer Saw Machines Market Restraints
10 Research Finding and Conclusion
11 Methodology and Data Source
11.1 Methodology/Research Approach
11.1.1 Research Programs/Design
11.1.2 Market Size Estimation
11.1.3 Market Breakdown and Data Triangulation
11.2 Data Source
11.2.1 Secondary Sources
11.2.2 Primary Sources
11.3 Author List
11.4 Disclaimer
Published By : QY Research
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