The Market Reports

Synopsis
The global market for Molded Interconnect Device (MID) was estimated to be worth US$ 1515 million in 2024 and is forecast to a readjusted size of US$ 3523 million by 2031 with a CAGR of 13.2% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Molded Interconnect Device (MID) cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
A Molded Interconnect Device (MID) is a technology that integrates mechanical and electronic functions into a single 3D injection-molded plastic part. MIDs enable the direct embedding of conductive traces, vias, and component mounting pads within the molded plastic structure, allowing for the creation of compact, lightweight, and multifunctional components for various applications.
Market Drivers for Molded Interconnect Devices (MIDs):
Miniaturization and Lightweight Design: MIDs enable the integration of multiple functionalities into a single compact component, supporting miniaturization and lightweight design requirements in various industries.
Cost Efficiency: MIDs can reduce assembly costs by consolidating multiple components into a single part, streamlining manufacturing processes, and lowering material and labor costs.
Design Flexibility: The design flexibility offered by MIDs allows for complex geometries, 3D circuit paths, and customized shapes, enabling innovative product designs and improved functionality.
Enhanced Product Performance: MIDs facilitate shorter signal paths, reduced electromagnetic interference, and improved thermal management, leading to enhanced overall product performance.
Increased Interconnect Density: MIDs enable higher interconnect density and more complex electronic functionalities within limited space, making them ideal for applications where space is a constraint.
Environmental Sustainability: MIDs promote sustainability by reducing material waste, energy consumption, and carbon footprint through the integration of multiple functions in a single part.
Market Challenges for Molded Interconnect Devices (MIDs):
Material Compatibility and Reliability: Ensuring compatibility between the molding material and electronic components, as well as maintaining long-term reliability under various environmental conditions, can be challenging.
Manufacturing Complexity: The manufacturing process for MIDs involves multiple steps, including design, mold tooling, laser structuring, metallization, and assembly, which can increase production complexity and lead times.
Testing and Quality Control: Ensuring the quality and reliability of the conductive traces, vias, and component integration within MIDs requires specialized testing methods and quality control measures.
Design Verification and Validation: Validating the design, functionality, and performance of MIDs, especially for complex 3D structures, may pose challenges in terms of simulation, prototyping, and testing.
Market Awareness and Adoption: Awareness of MID technology and its benefits among industries and manufacturers may be limited, hindering widespread adoption and market growth.
Regulatory Compliance: Meeting regulatory requirements, standards, and certifications for MIDs, especially in industries such as automotive, medical devices, and aerospace, can present challenges due to the unique nature of the technology.
This report aims to provide a comprehensive presentation of the global market for Molded Interconnect Device (MID), focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Molded Interconnect Device (MID) by region & country, by Type, and by Application.
The Molded Interconnect Device (MID) market size, estimations, and forecasts are provided in terms of sales volume (K Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Molded Interconnect Device (MID).
Market Segmentation
By Company
Molex LLC
TE Connectivity
SUNWAY
Harting 3D-Circuits
Kunshan Fengjingtuo Electronics
Cicor
Taiyo Holdings
S2P Solutions
2E mechatronic GmbH & Co. KG
TEPROSA GmbH
BS-TECHNICS
Segment by Type
Antenna and Connectivity Modules
Connectors and Switches
Sensors
Lighting
Others
Segment by Application
Consumer Electronics
Automotive Industry
Medical Devices
Industrial Electronics
Others
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Molded Interconnect Device (MID) manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Molded Interconnect Device (MID) in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Molded Interconnect Device (MID) in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index