The Market Reports

Synopsis
The global market for Rapid Thermal Processing Equipment was estimated to be worth US$ 735 million in 2024 and is forecast to a readjusted size of US$ 1106 million by 2031 with a CAGR of 6.2% during the forecast period 2025-2031.
This report provides a comprehensive assessment of recent tariff adjustments and international strategic countermeasures on Rapid Thermal Processing Equipment cross-border industrial footprints, capital allocation patterns, regional economic interdependencies, and supply chain reconfigurations.
Rapid Thermal Processing (RTP) Equipment refers to specialized semiconductor manufacturing systems designed to rapidly heat and cool semiconductor wafers in a controlled environment for short durations, typically ranging from a few seconds to a few minutes. These systems are used to perform thermal processes such as annealing, oxidation, silicidation, and dopant activation without exposing wafers to prolonged high temperatures, thereby minimizing diffusion and preserving sharp junction profiles.
Global main manufacturers of rapid thermal processing equipment include Applied Materials, Mattson Technology and Kokusai Electric, etc. The top three players hold a share about 77%.
The Rapid Thermal Processing (RTP) equipment market holds strong growth potential driven by the semiconductor industry's push toward advanced nodes (5nm and below), increased use of wide bandgap materials like SiC and GaN in power electronics and electric vehicles, the proliferation of AI and high-performance computing applications requiring precise and localized thermal treatments, and the expansion of advanced packaging techniques such as wafer-level and 3D integration, all of which demand high-speed, high-uniformity annealing and oxidation processes; additionally, downstream development is accelerated by the growth of mobile devices, automotive electronics, IoT sensors, and optoelectronics, where RTP enables critical steps like dopant activation, contact annealing, and thin oxide formation with minimal diffusion and superior uniformity, while industry trends such as EUV lithography adoption, chiplet design, and heterogeneous integration further necessitate RTP's capability for precise, short-duration, high-temperature processing in both front-end and back-end manufacturing, supported by strong investment from leading players across Asia-Pacific, North America, and Europe, ensuring ongoing innovation and capacity expansion to meet the complex thermal budget and integration needs of next-generation semiconductor devices in a highly competitive, performance-driven market landscape.
This report aims to provide a comprehensive presentation of the global market for Rapid Thermal Processing Equipment, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Rapid Thermal Processing Equipment by region & country, by Type, and by Application.
The Rapid Thermal Processing Equipment market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Rapid Thermal Processing Equipment.
Market Segmentation
By Company
Applied Materials
Mattson Technology
Kokusai Electric
Ultratech(Veeco）
Centrotherm
AnnealSys
JTEKT Thermo System
ECM
CVD Equipment Corporation
SemiTEq
Shanghai Wanye Enterprises Co., Ltd.
UniTemp GmbH
Plasma-Therm
Segment by Type
Lamp-based
Laser-based
Segment by Application
R&D
Industrial Production
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Rapid Thermal Processing Equipment manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Rapid Thermal Processing Equipment in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Rapid Thermal Processing Equipment in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index