The Market Reports

Synopsis
The global market for Semiconductor Laser Annealing Machine was estimated to be worth US$ 910 million in 2024 and is forecast to a readjusted size of US$ 1812 million by 2031 with a CAGR of 10.7% during the forecast period 2025-2031.
In the manufacturing process of semiconductor devices, in order to form specific doping in silicon wafers, multiple ion implantation processes are required during the manufacturing process. During the ion input process, the bombardment of impurity ions will cause a certain degree of lattice damage to the silicon atoms in the wafer, resulting in the impurity ions not being able to be located in the correct lattice position and not having the proper electrical activity. Therefore, the wafer needs to be heat treated to repair the lattice and activate the electrical activity of the impurity ions. This heat treatment process is called annealing.
Semiconductor laser annealing machine refers to special equipment that uses high-energy laser beams for automated annealing processes. Its main function is to project a beam spot of a specific shape and uniform energy distribution onto a semiconductor wafer to anneal, scan and process the wafer. Compared with traditional furnace annealing and rapid annealing technology, laser annealing has the advantages of high instantaneous temperature, short action time, low thermal budget, and optional area processing, which can better meet the process requirements of thin-film processing and efficient activation. At present, laser annealing equipment has been widely used in the field of cutting-edge logic chip manufacturing.
Semiconductor Laser Annealing Machine can be divided into power laser annealing equipment and IC front-end laser annealing equipment. Power laser annealing equipment accounts for more than half, and IC front-end laser annealing equipment has the fastest growth rate. In 2023, the power annealing market share is about 55%. IGBT has become one of the fastest-growing power devices with its excellent performance. With the maturity of wafer thinning technology, thin-film high-voltage IGBT will become a future development trend; in addition, as the research and development of the third-generation wide bandgap semiconductor material SiC becomes more mature, the demand for SiC devices will gradually increase. Laser annealing technology is suitable for thin-film high-voltage IGBT and SiC products, and will continue to be one of the mainstream technologies in the future.
The development of the semiconductor laser annealing machine market is mainly driven by the downstream power device market and the advanced process chip market. In the field of power devices, power devices can be divided into traditional silicon-based devices and wide bandgap material devices according to material type. At present, silicon-based devices with a wide application base will still be the mainstream products for a long time in the future, such as IGBT. Benefiting from the development of industrial control, frequency conversion, and new energy industries, my country's power device industry will maintain steady growth. In addition, as the world's largest IGBT market, China has a large space for import substitution, and the acceleration of the localization process will benefit domestic equipment manufacturers.
The major semiconductor laser annealing machine manufacturers in the global market include Mitsui Group (JSW), Sumitomo Heavy Industries, SCREEN Semiconductor Solutions, Applied Materials and Veeco, etc. The top five companies in the world account for nearly 87% of the market. The overall market concentration is high, and most of the high-end market is monopolized by foreign companies. It is expected that industry competition will become more intense in the next few years, especially in the Chinese market.
This report aims to provide a comprehensive presentation of the global market for Semiconductor Laser Annealing Machine, focusing on the total sales volume, sales revenue, price, key companies market share and ranking, together with an analysis of Semiconductor Laser Annealing Machine by region & country, by Type, and by Application.
The Semiconductor Laser Annealing Machine market size, estimations, and forecasts are provided in terms of sales volume (Units) and sales revenue ($ millions), considering 2024 as the base year, with history and forecast data for the period from 2020 to 2031. With both quantitative and qualitative analysis, to help readers develop business/growth strategies, assess the market competitive situation, analyze their position in the current marketplace, and make informed business decisions regarding Semiconductor Laser Annealing Machine.
Market Segmentation
By Company
Mitsui Group (JSW)
Sumitomo Heavy Industries
SCREEN Semiconductor Solutions
Veeco
Applied Materials
Hitachi
YAC BEAM
Shanghai Micro Electronics Equipment
EO Technics
Beijing U-PRECISION Tech
Chengdu Laipu Technology
Hans DSI
ETA Semitech
Segment by Type
Power Laser Annealing Machine
IC Front-end Laser Annealing Machine
Segment by Application
Power Semiconductor
Advanced Process Chip
By Region
North America
United States
Canada
Asia-Pacific
China
Japan
South Korea
Southeast Asia
India
Australia
Rest of Asia-Pacific
Europe
Germany
France
U.K.
Italy
Netherlands
Nordic Countries
Rest of Europe
Latin America
Mexico
Brazil
Rest of Latin America
Middle East & Africa
Turkey
Saudi Arabia
UAE
Rest of MEA
Chapter Outline
Chapter 1: Introduces the report scope of the report, global total market size (value, volume and price). This chapter also provides the market dynamics, latest developments of the market, the driving factors and restrictive factors of the market, the challenges and risks faced by manufacturers in the industry, and the analysis of relevant policies in the industry.
Chapter 2: Detailed analysis of Semiconductor Laser Annealing Machine manufacturers competitive landscape, price, sales and revenue market share, latest development plan, merger, and acquisition information, etc.
Chapter 3: Provides the analysis of various market segments by Type, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different market segments.
Chapter 4: Provides the analysis of various market segments by Application, covering the market size and development potential of each market segment, to help readers find the blue ocean market in different downstream markets.
Chapter 5: Sales, revenue of Semiconductor Laser Annealing Machine in regional level. It provides a quantitative analysis of the market size and development potential of each region and introduces the market development, future development prospects, market space, and market size of each country in the world.
Chapter 6: Sales, revenue of Semiconductor Laser Annealing Machine in country level. It provides sigmate data by Type, and by Application for each country/region.
Chapter 7: Provides profiles of key players, introducing the basic situation of the main companies in the market in detail, including product sales, revenue, price, gross margin, product introduction, recent development, etc.
Chapter 8: Analysis of industrial chain, including the upstream and downstream of the industry.
Chapter 9: Conclusion.

Index