SynopsisSingle-Emitter Laser Diode is a light-emitting unit formed by packaging a laser chip The global Single Emitter Laser Diode market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the foreca.....
SynopsisThe global Semiconductor Laser Module market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Semiconductor Laser Module is estimated.....
SynopsisThe incident light whose light intensity distribution is not uniform enough to meet specific application requirements is transformed into optical components with improved light intensity distribution uniformity and capable of meeting application requirements t.....
SynopsisSince the heat sink material needs to be closely attached to the chip, two basic performance requirements need to be considered: high thermal conductivity (TC) and matching coefficient of thermal expansion (CTE). High thermal conductivity realizes rapid heat d.....
SynopsisThe global Electronic Packaging Ceramic Heat Sink market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Electronic Packaging Cerami.....
SynopsisThe development of metal packaging materials has gone through 4 generations. The first generation is a low expansion coefficient alloy represented by Invar and Kovar alloys, and the thermal conductivity of the alloy is only 11-17W/(m•K). The second generation .....
SynopsisThe global Semiconductor Package Heat Sink Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Semiconductor Package Hea.....
SynopsisThe global Power Device Heat Sink Material market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Power Device Heat Sink Material is.....
SynopsisFRP (Fiberglass Reinforced Plastic) core products are suitable for winding, storing and transporting various optical films, high-performance films, metal foils and high-grade papers. The global FRP Core market was valued at US$ million in 2023 and is ant.....
SynopsisThe global Extracorporeal CO2 Removal Devices market was valued at US$ million in 2023 and is anticipated to reach US$ million by 2030, witnessing a CAGR of % during the forecast period 2024-2030. North American market for Extracorporeal CO2 Removal Devi.....
